公开(公告)号：US5281466A

公开(公告)日：1994-01-25

申请号：US703633

申请日：1991-05-22

Applicant: David J. Arthur ,  Gwo S. Swei ,  Allen F. Horn, III ,  Brett Kilhenny

Inventor： David J. Arthur ,  Gwo S. Swei ,  Allen F. Horn, III ,  Brett Kilhenny

IPC: C04B26/08 ,  C04B35/14 ,  C04B41/45 ,  C08K9/02 ,  C08K9/04 ,  C08K9/06 ,  H01B3/44 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  H05K3/46 ,  B32B3/00

CPC classification number: H05K3/4626 ,  C04B26/08 ,  C04B35/14 ,  C04B41/4584 ,  C08K9/02 ,  C08K9/04 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H05K1/0373 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/056 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  H05K3/389 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31692

Abstract: A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a zirconate coupling agent and/or a titanate coupling agent and the ceramic has a volume % fraction of between about 26-45.

Abstract translation: 提出了一种复合材料，其由陶瓷填充的含氟聚合物组成，其中陶瓷涂覆有锆酸酯偶联剂和/或钛酸酯偶联剂，陶瓷的体积％分数为约26-45。

公开(公告)号：US5149590A

公开(公告)日：1992-09-22

申请号：US279474

申请日：1988-12-02

Applicant: David Arthur ,  Gwo S. Swei

Inventor： David Arthur ,  Gwo S. Swei

IPC: C08K9/06 ,  H01B3/44 ,  H01L23/14 ,  H05K1/03 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K1/0373 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/034 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  H05K3/389 ,  H05K3/4626 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31699

Abstract: A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials is presented which exhibits improved electrical performance over other printed wiring board materials. Also, the low coefficients of thermal expansion and compliant nature of this electrical substrate material results in improved surface mount reliability and plated through-hole reliability. The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material which renders the surface of the ceramic hydrophobic and provides improved tensile strength, peel strenth and dimensional stability. In addition, even improved results are provided when the silane coating is comprised of a fluorinated silane or a combination of fluorinated and non-fluorinated silanes.

Abstract translation: 提出了一种非常适合形成刚性印刷线路板基板材料的基于陶瓷填充的基于氟聚合物的电气基板材料，其表现出比其它印刷线路板材料更好的电性能。 此外，该电气基板材料的低的热膨胀系数和顺从性导致改进的表面贴装可靠性和电镀通孔可靠性。 电气基材优选包含填充有二氧化硅的聚四氟乙烯以及少量微纤维。 在本发明的一个重要特征中，陶瓷填料（二氧化硅）涂有硅烷涂层材料，使陶瓷表面疏水并提供改善的拉伸强度，剥离强度和尺寸稳定性。 此外，当硅烷涂层由氟化硅烷或氟化和非氟化硅烷的组合构成时，甚至提供了甚至改进的结果。

公开(公告)号：US5095047A

公开(公告)日：1992-03-10

申请号：US502939

申请日：1990-04-02

Applicant: Osamu Ogitani ,  Ryuichi Fujii ,  Toru Shirose

Inventor： Osamu Ogitani ,  Ryuichi Fujii ,  Toru Shirose

IPC: C08G59/00 ,  C08G59/24 ,  C08G59/50 ,  C08K3/34 ,  C08K3/36 ,  C08L63/00 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08G59/245 ,  C08G59/5033 ,  C08K3/346 ,  C08K3/36 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0251

Abstract: A thermosetting resin composition suitable for forming an insulating layer to be interposed between two adjacent wiring patterns of a multilayer printed wiring board is disclosed which includes a bisphenol AD epoxy resin, an aromatic polyamine, mica having an average particle size of 50 .mu.m or less, and silica having an average particle size of 20 .mu.m or less, the average particle size of the silica being smaller than that of the mica, and the amount of the silica being 20-80% based on the total weight of the silica and the mica.

公开(公告)号：US4943606A

公开(公告)日：1990-07-24

申请号：US236721

申请日：1988-08-26

Applicant: Masakazu Inoue ,  Kuniaki Asai ,  Kazuo Hieda ,  Tadayasu Kobayashi

Inventor： Masakazu Inoue ,  Kuniaki Asai ,  Kazuo Hieda ,  Tadayasu Kobayashi

IPC: C08L67/00 ,  C08J7/00 ,  C08K3/26 ,  C08K7/04 ,  H05K1/03

CPC classification number: H05K1/0373 ,  C08K3/26 ,  C08K7/04 ,  H05K1/0326 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251

Abstract: A resin composition for printed circuit board comprising:(A) 30-90% by weight of a liquid crystal polyester,(B) 3-50% by weight of an inorganic fibrous or acicular material having an average diameter of 15 .mu.m or below and an average length of 200 .mu.m or below, and(C) 3-30% by weight of an alkaline earth metal carbonate.

公开(公告)号：US4869956A

公开(公告)日：1989-09-26

申请号：US328415

申请日：1989-03-24

Applicant: William G. Bridges ,  Thomas A. Armer

Inventor： William G. Bridges ,  Thomas A. Armer

IPC: B32B15/08 ,  H05K1/03

CPC classification number: B32B15/08 ,  H05K1/032 ,  H05K1/036 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0355 ,  Y10T428/25 ,  Y10T428/265 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31696 ,  Y10T428/31699

Abstract: Polymer/copper laminates and a method for their manufacture employing smooth, untreated, wrought-copper and characterized by cohesive and adhesive strength in the resulting laminates.

Abstract translation: 聚合物/铜层压材料及其制造方法采用光滑的未处理的锻造铜，并且在所得的层压板中以粘结和粘合强度为特征。

公开(公告)号：US4634631A

公开(公告)日：1987-01-06

申请号：US755074

申请日：1985-07-15

Applicant: Samuel Gazit ,  Cathy A. Fleischer

Inventor： Samuel Gazit ,  Cathy A. Fleischer

IPC: B32B7/02 ,  B32B15/08 ,  B32B15/085 ,  B32B27/28 ,  B32B27/30 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  B32B27/08

CPC classification number: H05K1/036 ,  B32B15/08 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0355 ,  H05K2201/0715 ,  H05K2203/0793 ,  H05K3/281 ,  Y10S428/901 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31699 ,  Y10T428/31721

Abstract: A flexible circuit laminate is presented comprising a microglass reinforced fluoropolymer layer sandwiched between a polyimide substrate and a copper conductive pattern. The glass reinforced fluoropolymer acts as a high bond strength adhesive between the polyimide and copper conductive pattern. The glass reinforced fluoropolymer also contributes to improved dimensional stability as well as improved electrical performance. Preferably, the microglass content is between about 4 to about 30 weight percent, and more preferably about 20 weight percent glass. In a method of making the flexible circuit laminate, the polyimide substrate undergoes a preferably alkaline microetching surface treatment, followed by rinsing, drying and lamination to the microglass reinforced fluoropolymer and copper layers.

Abstract translation: 提出了一种柔性电路层压板，其包括夹在聚酰亚胺基板和铜导电图案之间的微透镜增强氟聚合物层。 玻璃纤维增​​强氟聚合物作为聚酰亚胺和铜导电图案之间的高粘结强度粘合剂。 玻璃增强的氟聚合物还有助于提高尺寸稳定性以及改善的电性能。 优选地，微玻璃含量在约4至约30重量％之间，更优选约20重量％的玻璃。 在制造柔性电路层叠体的方法中，聚酰亚胺基板进行优选的碱性微蚀刻表面处理，随后漂洗，干燥和层压至微玻璃增强的含氟聚合物和铜层。

公开(公告)号：US4393111A

公开(公告)日：1983-07-12

申请号：US288689

申请日：1981-07-31

Applicant: Theodore H. Klein

Inventor： Theodore H. Klein

IPC: H05K1/03 ,  H05K3/02 ,  B32B3/10 ,  H05K1/00

CPC classification number: H05K3/022 ,  H05K1/0373 ,  H05K1/0326 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/09118 ,  Y10S428/901 ,  Y10T428/21 ,  Y10T428/24802 ,  Y10T428/2907 ,  Y10T428/3162 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31794

Abstract: Conductor-clad composites are advantageously fabricated using molding compounds and associated processing techniques. The conductive cladding is applied and bonded to the composite during the molding process. The conductor-clad composite may be used as printed wiring board, and in this embodiment results in improved physical, chemical, mechanical, and electrical properties.

公开(公告)号：US3841957A

公开(公告)日：1974-10-15

申请号：US29821472

申请日：1972-10-17

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： SPRENGLING G

IPC: C08K9/00 ,  C08G85/00 ,  C08J5/08 ,  C08K5/00 ,  C08K9/04 ,  C08L23/00 ,  C08L67/00 ,  C08L77/00 ,  C08L101/00 ,  H01B3/30 ,  H01B3/40 ,  H05K1/03 ,  B32B15/08 ,  B32B15/04

CPC classification number: B32B27/20 ,  B32B27/281 ,  B32B27/285 ,  B32B27/32 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2315/085 ,  B32B2323/04 ,  B32B2325/00 ,  B32B2363/00 ,  B32B2367/00 ,  B32B2371/00 ,  B32B2379/08 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/122 ,  Y10T428/31511

Abstract: 1. AN ARTICLE COMPRISING (A) A FLAT BOARD WHICH COMPRISES (1) ABOUT 15 TO ABOUT 70% OF A HARDENED, SYNTHETIC, ORGANIC RESIN; (2) ABOUT 30 TO ABOUT 85% NON-CONDUCTIVE FILLER; AND (3) ABOUT 0.001 TO ABOUT 1.0% OF A SURFACTANT HAVING A PERFLUORINATED CHAIN AT LEAST THREE CARBON ATOMS ALONG AT ONE END AND A POLAR GROUP AT THE OTHER END, SAID SURFACTANT POSSESSING THE PROPERTY OF LOWERING THE SURFACE ENERGY OF SAID RESIN BY FREELY MIGRATING TO THE SURFACE OF SAID RESIN AND TO ITS INTERFACES WITH SAID FILLER AFTER SAID RESIN IS HARDENED; AND (B) A CONDUCTING CIRCUIT BONDED TO AT LEAST ONE SIDE OF SAID FLAT BOARD.

公开(公告)号：US3258387A

公开(公告)日：1966-06-28

申请号：US10122161

申请日：1961-04-06

Applicant: OWENS CORNING FIBERGLASS CORP

Inventor： WINSOR BROWN ALFRED ,  LEARY DAVID E

IPC: H01B1/00 ,  H01B3/00 ,  H01B3/04 ,  H05K1/03

CPC classification number: H05K1/0373 ,  H01B1/00 ,  H01B3/002 ,  H01B3/004 ,  H01B3/04 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0251 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T428/24909 ,  Y10T428/24917 ,  Y10T428/251 ,  Y10T428/252