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    Low cost lighting circuits manufactured from conductive loaded resin-based materials
    122.
    发明申请
    Low cost lighting circuits manufactured from conductive loaded resin-based materials 有权
    由导电负载的树脂基材料制造的低成本照明电路

    公开(公告)号：US20040189170A1

    公开(公告)日：2004-09-30

    申请号：US10819809

    申请日：2004-04-07

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01J001/88

    CPC classification number: G06K19/07749 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  C09K11/08 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/095 ,  H05K1/167 ,  H05K1/18 ,  H05K1/181 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/10 ,  H05K3/101 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/0113 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: Lighting devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The ratio of the weight of the conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers to the weight of the base resin host is between about 0.20 and 0.40. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like. The conductive loaded resin-based lighting devices can be formed using methods such as injection molding compression molding or extrusion. The conductive loaded resin-based material used to form the lighting devices can also be in the form of a thin flexible woven fabric that can readily be cut to the desired shape.

    Abstract translation: 照明装置由导电负载的树脂基材料形成。 导电负载树脂基材料在基础树脂主体中包括微米导电粉末，导电纤维或导电粉末和导电纤维的组合。 导电粉末，导电纤维或导电粉末和导电纤维的组合的重量与基础树脂主体的重量的比率在约0.20至0.40之间。 微米导电粉末由非金属形成，例如碳，石墨，也可以是金属电镀等，或由金属，如不锈钢，镍，铜，银，也可以是金属镀，或 或者由非金属，电镀或与金属粉末组合的组合。 微米导体纤维优选为镀镍碳纤维，不锈钢纤维，铜纤维，银纤维等。 导电负载的树脂基照明装置可以使用诸如注射成型压缩成型或挤出的方法来形成。 用于形成照明装置的导电负载树脂基材料也可以是可以容易地切割成所需形状的薄柔性机织织物的形式。

    Low cost antennas and electromagnetic ( EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials
    123.
    发明申请
    Low cost antennas and electromagnetic ( EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials 失效
    使用导电负载树脂基材料的电子电路封装或收发器中的低成本天线和电磁（EMF）吸收

    公开(公告)号：US20040160377A1

    公开(公告)日：2004-08-19

    申请号：US10780214

    申请日：2004-02-17

    Applicant: Integral Technologies, Inc.

    Inventor： Thomas Aisenbrey

    IPC: H01Q013/10 ,  H01Q001/42

    CPC classification number: H05K3/101 ,  B29C45/0001 ,  B29C45/0013 ,  B29K2995/0005 ,  B29L2031/3456 ,  G06K19/07749 ,  H01B1/22 ,  H01Q1/1271 ,  H01Q1/364 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q9/30 ,  H05K1/095 ,  H05K3/107 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2203/0113

    Abstract: Low cost antennas and electromagnetic absorbing parts formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises conductive fibers, conductive powders, or in combination thereof in a resin base host wherein the ratio of the weight of the conductor fibers, conductor powders, or combination of conductor fibers and conductor powders to the weight of the base resin host is between about 0.20 and 0.40. The conductive fibers or conductive powders can be stainless steel, nickel, copper, silver, carbon, graphite, plated fibers or particles, or the like. The antenna elements can be formed using methods such as injection molding or extrusion. Virtually any antenna, ground planes, or shielding packages fabricated by conventional means of metal can be fabricated using the conductive loaded resin-based materials. The conductive loaded resin-based material used to form the antenna elements, EMF absorbing elements, or ground planes can be in the form of a thin flexible material, which can be readily cut to the desired shape.

    Abstract translation: 由导电负载的树脂基材料形成的低成本天线和电磁吸收部件。 导电负载的树脂基材料包括导电纤维，导电粉末或其组合在树脂基质主体中，其中导体纤维，导体粉末或导体纤维和导体粉末的组合的重量比与 基础树脂主体在约0.20和0.40之间。 导电纤维或导电粉末可以是不锈钢，镍，铜，银，碳，石墨，电镀纤维或颗粒等。 可以使用诸如注射成型或挤出的方法来形成天线元件。 实际上，任何通过常规金属制造的天线，接地平面或屏蔽封装均可使用导电负载的树脂基材料制造。 用于形成天线元件，EMF吸收元件或接地平面的导电负载树脂基材料可以是薄的柔性材料的形式，其可以容易地切割成所需的形状。

    Method for making printed circuit board having low coefficient of thermal expansion power/ground plane
    124.
    发明授权
    Method for making printed circuit board having low coefficient of thermal expansion power/ground plane 有权
    制造具有低热膨胀系数/印刷电路板的方法

    公开(公告)号：US06722031B2

    公开(公告)日：2004-04-20

    申请号：US10012426

    申请日：2001-12-07

    Applicant: Robert M. Japp ,  Mark D. Poliks

    Inventor： Robert M. Japp ,  Mark D. Poliks

    IPC: H01K310

    CPC classification number: H05K3/4641 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09309 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49165

    Abstract: Conductive materials that have low coefficients of thermal expansion (CTEs) and that are used for power and ground planes are disclosed. Fibrous materials (such as carbon, graphite, glass, quartz, polyethylene, and liquid crystal polymer fibers) with low CTEs are metallized to provide a resultant conductive material with a low CTE. Such fibers may be metallized in their individual state and then formed into a fabric, or these materials may be formed into a fabric and then metallized or a combination of both metallizations may be used. In addition, a graphite or carbon sheet may be metallized on one or both sides to provide a material that has a low CTE and high conductivity. These metallized, low CTE power and ground planes may be laminated with other planes/cores into a composite, or laminated into a core which is then laminated with other planes/cores into a composite. The resultant composite may be used for printed circuit boards (PCBs) or PCBs used as laminate chip carriers.

    Abstract translation: 公开了具有低热膨胀系数（CTE）并且用于电力和接地平面的导电材料。 具有低CTE的纤维材料（例如碳，石墨，玻璃，石英，聚乙烯和液晶聚合物纤维）被金属化以提供具有低CTE的所得导电材料。 这样的纤维可以以其单独状态进行金属化，然后形成织物，或者这些材料可以形成织物，然后金属化，或者可以使用两种金属化的组合。 此外，石墨或碳片可以在一侧或两侧金属化，以提供具有低CTE和高导电性的材料。 这些金属化的低CTE功率和接地层可以与其它平面/芯层压成复合材料，或者层压成芯，然后将其与其它平面/芯层叠合成复合材料。 所得的复合材料可用于印刷电路板（PCB）或用作层压芯片载体的PCB。

    Method for manufacturing a printed circuit board substrate with passive electrical components
    125.
    发明申请
    Method for manufacturing a printed circuit board substrate with passive electrical components 审中-公开
    制造具有无源电气部件的印刷电路板基板的方法

    公开(公告)号：US20040012937A1

    公开(公告)日：2004-01-22

    申请号：US10199484

    申请日：2002-07-18

    Applicant: KULICKE & SOFFA INVESTMENTS, INC.

    Inventor： David DeGrappo ,  Richard Dow ,  Timothy W. Ellis

    IPC: H05K007/02

    CPC classification number: H05K1/16 ,  H05K1/0366 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/10 ,  H05K2201/0281 ,  H05K2201/029

    Abstract: A process for manufacturing a Printed Circuit Board (PCB) substrate with passive electrical components (e.g., capacitors, inductors and/or resistors) includes weaving a plurality of dielectric strands (e.g., fiberglass yarns) and at least one electrically conductive strand (e.g., a copper wire) to form a woven fabric. The woven fabric is impregnated with a dielectric resin material to form an impregnated fabric and, thereafter, the impregnated fabric is cured to form a cured fabric. The cured fabric's upper and lower surfaces are then planed. The planing of the upper and lower surface segments the electrically conductive strands and forms a PCB substrate with a passive electrical component (e.g., a capacitor and/or inductor) therein. The passive electrical component(s) includes electrically isolated conductive strand segments separated by at least one of the dielectric resin material and the dielectric strands. A PCB substrate with passive electrical components formed therein includes a planarized woven fabric with a cured dielectric resin material impregnated therein. The planarized woven fabric includes a planed upper surface, a planed lower surface and a plurality of integrally formed electrically conductive strand segments (e.g., copper wire segments) configured as electrically conductive portions of a passive electrical component. The cured dielectric resin material is disposed between the integrally formed conductive strand segments.

    Abstract translation: 用于制造具有无源电气部件（例如，电容器，电感器和/或电阻器）的印刷电路板（PCB）衬底的工艺包括编织多根电介质股线（例如玻璃纤维纱线）和至少一个导电股线（例如， 铜线）以形成机织织物。 织物用介电树脂材料浸渍以形成浸渍的织物，然后将浸渍的织物固化以形成固化织物。 然后将固化的织物的上表面和下表面平整。 上表面和下表面的平面划分导电股线并且在其中形成具有无源电组件（例如，电容器和/或电感器）的PCB衬底。 被动电气部件包括由绝缘树脂材料和电介质线中的至少一个隔开的电隔离的导电线段。 其中形成有无源电气部件的PCB基板包括其中浸渍有固化的电介质树脂材料的平面化机织织物。 平面织造织物包括被配置为无源电气部件的导电部分的平面上表面，平面化下表面和多个整体形成的导电线段（例如，铜线段）。 固化的电介质树脂材料设置在整体形成的导电链段之间。

    Porous power and ground planes for reduced PCB delamination and better reliability
    128.
    发明授权
    Porous power and ground planes for reduced PCB delamination and better reliability 有权
    多功能电源和接地平面可降低PCB分层和更好的可靠性

    公开(公告)号：US06613413B1

    公开(公告)日：2003-09-02

    申请号：US09300762

    申请日：1999-04-26

    Applicant: Robert M. Japp ,  Mark D. Poliks

    Inventor： Robert M. Japp ,  Mark D. Poliks

    IPC: B32B310

    CPC classification number: H05K3/38 ,  H05K3/429 ,  H05K3/4641 ,  H05K2201/0116 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/0769 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2203/1131 ,  Y10S428/901 ,  Y10T29/49002 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1052 ,  Y10T428/24273 ,  Y10T428/24917

    Abstract: Power and ground planes used in Printed Circuit Boards (PCBs) having porous, conductive materials allow liquids (e.g., water and/or other solvents) to pass through the power and ground planes, thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon/graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets porous by forming an array of holes in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods.

    Abstract translation: 在具有多孔导电材料的印刷电路板（PCB）中使用的电源和接地层允许液体（例如水和/或其他溶剂）通过电源和接地层，从而减少PCB（或用作层压芯片的PCB）故障 载体）由绝缘体的阴极/阳极丝生长和分层引起。 适用于PCB的多孔导电材料可以通过使用金属涂布的有机布（例如聚酯或液晶聚合物）或织物（例如由碳/石墨或玻璃纤维制成的那些）形成，使用金属丝网代替金属 使用烧结金属，或者通过在金属板中形成孔阵列来制造多孔的金属片。 织物和网可以编织或随机。 如果在金属板中形成孔阵列，则可以形成这样的阵列，而不需要使用常规PCB组装方法执行的附加处理步骤。

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