公开(公告)号：US09355802B2

公开(公告)日：2016-05-31

申请号：US14286331

申请日：2014-05-23

Applicant: STMicroelectronics (Rousset) SAS

Inventor： Christian Rivero ,  Pascal Fornara ,  Antonio di-Giacomo ,  Brice Arrazat

IPC: H01H59/00 ,  H01L27/06 ,  H01L21/822 ,  H01H1/00 ,  H01L23/522

CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  H01H1/0036 ,  H01H57/00 ,  H01H2001/0068 ,  H01H2001/0078 ,  H01H2059/0054 ,  H01L21/8221 ,  H01L23/522 ,  H01L27/0617 ,  H01L27/0688 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit includes an interconnection part with several metallization levels. An electrically activatable switching device within the interconnection part has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.

Abstract translation: 集成电路包括具有多个金属化级别的互连部件。 互连部件内的可电激活的开关装置具有包括由结构保持的梁的组件。 梁和结构位于相同的金属化水平内。 布置结构在梁上的固定位置，以便为梁定义位于这些固定位置之间的枢转点。 该结构在不存在电位差的情况下相对于光束和垂直于光束的平面基本对称。 在存在施加在结构的第一部分之间的第一电位差并且在存在施加在结构的第二部分之间的第二电位差的情况下在第二方向上枢转时，梁能够在第一方向上枢转。

公开(公告)号：US09318785B2

公开(公告)日：2016-04-19

申请号：US13248787

申请日：2011-09-29

Applicant: Ahmadreza Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

Inventor： Ahmadreza Rofougaran ,  Arya Reza Behzad ,  Sam Ziqun Zhao ,  Jesus Alfonso Castaneda ,  Michael Boers

IPC: H01P1/18 ,  H01P1/06 ,  H01P3/00 ,  B81B7/00 ,  H01L23/522 ,  H01L23/66 ,  H01L25/065 ,  H01L41/09 ,  H01H59/00

CPC classification number: H01P3/00 ,  B81B7/008 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2207/03 ,  H01H59/0009 ,  H01L23/5222 ,  H01L23/66 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L41/0986 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06572 ,  H01L2924/1461 ,  H01P1/06 ,  H01P1/18 ,  H01P1/182 ,  H01P3/121 ,  H01Q13/20 ,  H01L2924/00

Abstract: Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.

Abstract translation: 公开了用于在集成电路内的集成电路和/或功能模块之间进行无线通信的方法和装置。 半导体器件制造操作使用预定的照相和/或化学处理步骤顺序在半导体衬底上形成一个或多个功能模块。 功能模块耦合到形成在半导体衬底上和/或连接到其上以形成集成电路的集成波导。 功能模块通过集成波导使用多址传输方案彼此通信以及其他集成电路。 一个或多个集成电路可以耦合到集成电路载体以形成多芯片模块。 多芯片模块可以耦合到半导体封装以形成封装的集成电路。

公开(公告)号：US20160093530A1

公开(公告)日：2016-03-31

申请号：US14499287

申请日：2014-09-29

Applicant: Innovative Micro Technology

Inventor： John C. HARLEY

IPC: H01L21/768 ,  B81C1/00

CPC classification number: H01L21/76898 ,  B81B7/0006 ,  B81B2201/018 ,  B81B2201/0271 ,  B81B2207/012 ,  B81B2207/015 ,  B81C1/00301 ,  B81C2203/0792 ,  H01L2224/02372 ,  H01L2224/05548

Abstract: A method for forming through silicon vias (TSVs) in a silicon substrate is disclosed. The method involves forming a silicon post as an annulus in a first side of a silicon substrate, removing material from an opposite side to the level of the annulus, removing the silicon post and replacing it with a metal material to form a metal via extending through the thickness of the substrate.

Abstract translation: 公开了一种在硅衬底中形成硅通孔（TSV）的方法。 该方法包括在硅衬底的第一侧中形成硅柱作为环状空间，从与环空的水平面相反的一侧去除材料，去除硅柱并用金属材料代替它，以通过延伸通过 基板的厚度。

公开(公告)号：US09287050B2

公开(公告)日：2016-03-15

申请号：US13413889

申请日：2012-03-07

Applicant: Tomohiro Saito

Inventor： Tomohiro Saito

IPC: H01L29/84 ,  H01G5/18 ,  B81C1/00

CPC classification number: H01G5/18 ,  B81B2201/018 ,  B81B2201/0221 ,  B81B2203/0109 ,  B81C1/00611 ,  B81C2201/0126

Abstract: According to one embodiment, a MEMS includes a first electrode, a first auxiliary structure and a second electrode. The first electrode is provided on a substrate. The first auxiliary structure is provided on the substrate and adjacent to the first electrode. The first auxiliary structure is in an electrically floating state. The second electrode is provided above the first electrode and the first auxiliary structure, and is driven in a direction of the first electrode.

Abstract translation: 根据一个实施例，MEMS包括第一电极，第一辅助结构和第二电极。 第一电极设置在基板上。 第一辅助结构设置在基板上并与第一电极相邻。 第一辅助结构处于电浮动状态。 第二电极设置在第一电极和第一辅助结构之上，并且沿第一电极的方向被驱动。

公开(公告)号：US09048053B2

公开(公告)日：2015-06-02

申请号：US14051031

申请日：2013-10-10

Applicant: Daisuke Morihara ,  Takahiro Masuda ,  Yasuhiro Horimoto

Inventor： Daisuke Morihara ,  Takahiro Masuda ,  Yasuhiro Horimoto

IPC: H01P1/10 ,  H01H59/00 ,  H01H65/00

CPC classification number: H01H59/0009 ,  B81B7/007 ,  B81B2201/018 ,  H01H49/00 ,  H01H65/00 ,  H01P1/127 ,  Y10T29/49105

Abstract: An electrostatic micro relay has a substrate, a signal line arranged on the substrate and having an input point configured to receive a signal and a plurality of signal channels configured to distribute the signal, the plurality of signal channels being each formed with a fixed contact, a plurality of movable contacts, each provided with respect to each of the fixed contacts and arranged so as to be opposed to a corresponding fixed contact across a space, a plurality of movable electrodes, each connected to each of the plurality of movable contacts and configured to make the connected movable contact brought into contact with and separated from the corresponding fixed contact, a cap, formed with a space configured to house the plurality of movable electrodes, and bonded with the substrate, and a signal input portion.

Abstract translation: 静电微型继电器具有衬底，布置在衬底上的信号线，并且具有被配置为接收信号的输入点和被配置为分配信号的多个信号通道，所述多个信号通道各自形成有固定触点， 多个可动触头，每个可移动触点相对于每个固定触点设置，并且布置成与跨过空间的相应的固定触点相对;多个可移动电极，每个可移动电极连接到多个可动触点中的每一个并构成 使连接的可动触点与相应的固定触点接触并分离，形成有被构造成容纳多个可移动电极并与基板结合的空间的盖，以及信号输入部分。

公开(公告)号：US08749113B2

公开(公告)日：2014-06-10

申请号：US12954806

申请日：2010-11-26

Applicant: Takayuki Masunaga ,  Hiroaki Yamazaki

Inventor： Takayuki Masunaga ,  Hiroaki Yamazaki

IPC: H02N1/00 ,  H02K5/00

CPC classification number: H01H59/0009 ,  B81B3/007 ,  B81B2201/018 ,  B81B2201/045 ,  B81B2203/0109 ,  B81B2203/0172 ,  H02N1/006

Abstract: According to one embodiment, an electrostatic actuator includes an electrode unit, a conductive film body unit, a plurality of first urging units, and a plurality of second urging units. The electrode unit is provided on a substrate. The conductive film body unit is provided opposing the electrode unit. The plurality of first urging units are provided at a first circumferential edge portion of the conductive film body unit to support the film body unit. The plurality of second urging units are provided at a second circumferential edge portion opposing the first circumferential edge portion to support the film body unit. The electrode unit and the conductive film body unit contact or separate by the electrode unit being set to a voltage having a prescribed value. The plurality of first urging units have mutually different rigidities, and the plurality of second urging units have mutually different rigidities.

Abstract translation: 根据一个实施例，静电致动器包括电极单元，导电膜主体单元，多个第一推动单元和多个第二推动单元。 电极单元设置在基板上。 导电膜体单元设置成与电极单元相对。 多个第一推动单元设置在导电膜主体单元的第一圆周边缘部分处以支撑胶片主体单元。 多个第二推动单元设置在与第一周缘部相对的第二周缘部，以支撑胶片主体单元。 由电极单元接触或分离的电极单元和导电膜主体单元被设定为具有规定值的电压。 多个第一推动单元具有相互不同的刚性，并且多个第二推动单元具有相互不同的刚性。

公开(公告)号：US20140125201A1

公开(公告)日：2014-05-08

申请号：US14071025

申请日：2013-11-04

Applicant: RF Micro Devices, Inc.

Inventor： Kushal Bhattacharjee

IPC: H01L41/09 ,  B81B7/02

CPC classification number: H01G5/18 ,  B81B3/0086 ,  B81B2201/018 ,  B81B2201/0271 ,  B81B2201/032 ,  H03H9/02275 ,  H03H9/02409 ,  H03H9/2405 ,  H03H9/2463 ,  H03H9/462 ,  H03H9/467 ,  H03H2009/241

Abstract: A micro-electrical-mechanical systems (MEMS) device includes a substrate, one or more anchors formed on a first surface of the substrate, and a piezoelectric layer suspended over the first surface of the substrate by the one or more anchors. A first electrode may be provided on a first surface of the piezoelectric layer facing the first surface of the substrate, such that the first electrode is in contact with a first bimorph layer of the piezoelectric layer. A second electrode may be provided on a second surface of the piezoelectric layer opposite the first surface, such that the second electrode is in contact with a second bimorph layer of the piezoelectric layer.

Abstract translation: 微电气机械系统（MEMS）装置包括衬底，形成在衬底的第一表面上的一个或多个锚固体和通过一个或多个锚固件悬挂在衬底的第一表面上的压电层。 第一电极可以设置在面向基板的第一表面的压电层的第一表面上，使得第一电极与压电层的第一双压电晶片层接触。 第二电极可以设置在与第一表面相对的压电层的第二表面上，使得第二电极与压电层的第二双晶片层接触。

公开(公告)号：US20140071583A1

公开(公告)日：2014-03-13

申请号：US13717479

申请日：2012-12-17

Applicant: BROADCOM CORPORATION

Inventor： Ahmadreza Rofougaran

IPC: H01H29/00 ,  H01G5/013

CPC classification number: H01H29/004 ,  B81B3/0032 ,  B81B2201/018 ,  H01G5/0132 ,  H01H1/0036 ,  H01H2029/008

Abstract: A liquid micro-electro-mechanical system (MEMS) component includes a board, a channel frame, a flexible channel side, a liquid droplet, and one or more conductive elements. The channel frame is within the board and mates with the flexible channel side to form a channel within the board. The liquid droplet is contained within the channel. When a pressure is applied to the flexible side, the shape of the liquid droplet is changed with respect to the one or more conductive elements thereby changing an operational characteristic of the liquid MEMS component.

Abstract translation: 液体微电子机械系统（MEMS）部件包括板，通道框架，柔性通道侧，液滴和一个或多个导电元件。 通道框架在板内，并与柔性通道侧配合，以在板内形成通道。 液滴包含在通道内。 当向柔性侧施加压力时，相对于一个或多个导电元件改变液滴的形状，从而改变液体MEMS部件的操作特性。

公开(公告)号：US20140070336A1

公开(公告)日：2014-03-13

申请号：US13963409

申请日：2013-08-09

Applicant: DONGBU HITEK CO., LTD.

Inventor： Chung Kyung JUNG ,  Ki Jun Yun ,  Oh Jin Jung ,  Sang Wook Ryu ,  Seong Hun Jeong ,  Sung Wook Joo

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00015 ,  B81B3/0018 ,  B81B2201/018 ,  B81C1/00801 ,  B81C2201/014

Abstract: Method for manufacturing a semiconductor device includes the steps of forming a lower electrode pattern on a substrate, forming a first interlayer insulating layer on the lower electrode pattern, forming an upper electrode pattern on the first interlayer insulating layer, forming a second interlayer insulating layer on the upper electrode pattern, forming an etch blocking layer on a side of the upper electrode pattern, wherein the etch blocking layer passes through the first interlayer insulating layer, forming a cavity which exposes the side of the etch blocking layer by etching the second interlayer insulating layer, and forming a contact ball in the cavity.

Abstract translation: 制造半导体器件的方法包括以下步骤：在衬底上形成下电极图案，在下电极图案上形成第一层间绝缘层，在第一层间绝缘层上形成上电极图案，在第一层间绝缘层上形成第二层间绝缘层 所述上电极图案在所述上电极图案的一侧上形成蚀刻阻挡层，其中所述蚀刻阻挡层穿过所述第一层间绝缘层，形成通过蚀刻所述第二层间绝缘体而暴露所述蚀刻阻挡层侧的空腔 并且在空腔中形成接触球。

公开(公告)号：US20110315529A1

公开(公告)日：2011-12-29

申请号：US13203884

申请日：2010-03-18

Applicant: Karim Segueni ,  Nicolas Lorphelin

Inventor： Karim Segueni ,  Nicolas Lorphelin

IPC: H01H57/00

CPC classification number: H01H59/0009 ,  B81B5/00 ,  B81B2201/018

Abstract: The MEMS structure comprises: a flexible membrane (6), which has a main longitudinal axis (6a) defining a longitudinal direction (X), at least one pillar (3, 3′) under the flexible membrane (6), electric lowering actuation means (7) that are adapted to bend down the flexible membrane (6) into a down forced state electric raising actuation means (8) that are adapted to bend up the flexible membrane (6) into an up forced state. The electric lowering actuation means (7) or the electric raising actuation means (8) comprise an actuation area (7c or 8c), that extends under a part of the membrane (6) and that is adapted to exert pulling forces on the membrane (6) simultaneously on both sides of the said at least one pillar (3) in the longitudinal direction (X).

Abstract translation: MEMS结构包括：柔性膜（6），其具有限定纵向（X）的主纵向轴线（6a），在柔性膜（6）下方的至少一个柱体（3,3'），电降压致动 适于将柔性膜（6）向下弯曲成适于将柔性膜（6）弯曲成向上强制状态的向下强制状态电动致动装置（8）的装置（7）。 电降落致动装置（7）或电动致动装置（8）包括致动区域（7c或8c），其在膜（6）的一部分下延伸并且适于在膜上施加拉力 6）同时在所述至少一个支柱（3）的纵向（X）上的两侧。