公开(公告)号：US20120291837A1

公开(公告)日：2012-11-22

申请号：US13437944

申请日：2012-04-03

Applicant: Ching-Huang Lin ,  Rong-Chang Liang ,  Pei-Chang Tsai

Inventor： Ching-Huang Lin ,  Rong-Chang Liang ,  Pei-Chang Tsai

IPC: H01L31/05 ,  H05K1/02 ,  B29C35/08 ,  B29C39/18 ,  B32B37/12

CPC classification number: C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/28 ,  C09J2201/32 ,  C09J2201/602 ,  C09J2203/322 ,  H01B1/22 ,  H01L31/0508 ,  H01L31/0512 ,  H01R4/04 ,  Y02E10/50 ,  Y10T428/14 ,  Y10T428/1438 ,  Y10T428/1443 ,  Y10T428/1471 ,  Y10T428/28

Abstract: An electrode tape, a solar module and methods for manufacturing the same are disclosed. The electrode tape includes an adhesive film and a conductive structure. The adhesive film includes a first adhesive surface and a second adhesive surface which faces an opposite direction to the first adhesive surface. The conductive structure is embedded in the adhesive film with a first contact point exposed on the first adhesive surface and a second contact point exposed on the second adhesive surface. The solar module includes a first solar cell and a second solar cell which are electrically connected with each other through the electrode tape.

Abstract translation: 公开了一种电极带，太阳能电池组件及其制造方法。 电极带包括粘合膜和导电结构。 粘合膜包括面向与第一粘合剂表面相反的方向的第一粘合剂表面和第二粘合剂表面。 导电结构被嵌入粘合剂膜中，第一接触点暴露在第一粘合剂表面上，第二接触点暴露在第二粘合剂表面上。 太阳能模块包括通过电极带彼此电连接的第一太阳能电池和第二太阳能电池。

公开(公告)号：US20120228026A1

公开(公告)日：2012-09-13

申请号：US13512752

申请日：2011-07-19

Applicant: Yasushi Akutsu ,  Kouichi Sato ,  Shigeyuki Yoshizawa

Inventor： Yasushi Akutsu ,  Kouichi Sato ,  Shigeyuki Yoshizawa

IPC: H01B1/12 ,  B32B37/14 ,  H01R4/04 ,  B05D5/12

CPC classification number: H01L24/29 ,  C08F2220/283 ,  C08K3/08 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2205/102 ,  C09J2433/00 ,  H01B1/22 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/29364 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: An anisotropic conductive film is obtained by dispersing conductive particles in an insulating adhesive composition including a (meth)acrylate-based monomer composition, a radical polymerization initiator, and a film-forming resin. The (meth)acrylate-based monomer composition includes a (meth)acrylate-based monomer which has a cyclic ester residue or a cyclic amide residue represented by the formula (1): R1 is a hydrogen atom or a methyl group; R2 is an alkylene group or an alkyloxy group; R3 is an alkyl group, an alkylene group, an aryl group, or a halogen atom; n is an integer of 0 to 3; R4 is absent or an alkylene, dotted lines on both sides of R4 jointly represent a single bond; X1 is absent, or an oxygen atom or a carbon atom; and X2 is an oxygen atom, a nitrogen atom, or a sulfur atom.

Abstract translation: 通过将导电粒子分散在包含（甲基）丙烯酸酯类单体组合物，自由基聚合引发剂和成膜树脂的绝缘性粘合剂组合物中而获得各向异性导电膜。 （甲基）丙烯酸酯类单体组合物包含具有式（1）表示的环状酯残基或环状酰胺残基的（甲基）丙烯酸酯系单体：R1为氢原子或甲基， R2是亚烷基或烷氧基; R3是烷基，亚烷基，芳基或卤素原子; n为0〜3的整数， R4不存在或亚烷基，R4两面的虚线共同表示单键; X1不存在，或氧原子或碳原子; X 2为氧原子，氮原子或硫原子。

公开(公告)号：US20120211144A1

公开(公告)日：2012-08-23

申请号：US13399339

申请日：2012-02-17

Applicant: Karsten LITZENBERGER ,  Klaus EDELMANN ,  Matthias SCHWEIM ,  Rainer SCHILDT

Inventor： Karsten LITZENBERGER ,  Klaus EDELMANN ,  Matthias SCHWEIM ,  Rainer SCHILDT

IPC: B32B37/00

CPC classification number: B29C66/721 ,  B29C35/02 ,  B29C35/0261 ,  B29C65/08 ,  B29C65/14 ,  B29C65/1409 ,  B29C65/1412 ,  B29C65/1425 ,  B29C65/1435 ,  B29C65/1467 ,  B29C65/3612 ,  B29C65/3656 ,  B29C65/3668 ,  B29C65/368 ,  B29C65/4835 ,  B29C65/485 ,  B29C65/4855 ,  B29C65/4875 ,  B29C65/4885 ,  B29C65/489 ,  B29C66/1122 ,  B29C66/545 ,  B29C66/612 ,  B29C66/71 ,  B29C66/7212 ,  B29C66/723 ,  B29C66/72321 ,  B29C66/861 ,  B29C66/91411 ,  B29C66/91651 ,  B29C66/91655 ,  B29C66/919 ,  B29C2035/0811 ,  B29C2035/0822 ,  B29C2035/0855 ,  B29K2063/00 ,  B29K2105/06 ,  B29K2305/10 ,  B29K2307/00 ,  B29K2995/0005 ,  B29K2995/0013 ,  B29L2009/003 ,  B29L2031/3082 ,  B64F5/10 ,  C08J5/121 ,  C09J5/00 ,  C09J5/06 ,  C09J2201/602 ,  C09J2205/31 ,  C09J2400/22 ,  C09J2400/226 ,  B29K2307/04 ,  B29C65/00

Abstract: A method for joining a first and a second component, at least one of which comprises a fibre-reinforced plastics material. The components are arranged in relation to one another in such a way that a gap region remains between the first and the second component. The gap region is filled, at least in portions, with an uncured plastics material filler in which nanoparticles are dispersed. Energy is introduced locally into the nanoparticles in order to cure the plastics material filler. In another aspect, the invention provides a device for joining two components.

Abstract translation: 一种用于接合第一和第二部件的方法，其中至少一个部件包括纤维增强塑料材料。 这些部件相对于彼此布置成使得间隙区域保持在第一和第二部件之间。 间隙区域至少部分地与其中分散有纳米颗粒的未固化塑料材料填料填充。 将能量局部地引入到纳米颗粒中以便固化塑料填料。 另一方面，本发明提供一种用于连接两个部件的装置。

公开(公告)号：US20110318569A1

公开(公告)日：2011-12-29

申请号：US13254748

申请日：2010-02-26

Applicant: Tetsurou Kobayashi ,  Makoto Saitou ,  Hiroki Fujii ,  Itsuhiro Hatanaka ,  Kazumichi Kato ,  Shinya Nakano

Inventor： Tetsurou Kobayashi ,  Makoto Saitou ,  Hiroki Fujii ,  Itsuhiro Hatanaka ,  Kazumichi Kato ,  Shinya Nakano

IPC: B32B3/26 ,  B32B7/12 ,  H01B1/24 ,  C09J7/02

CPC classification number: C08J9/122 ,  B32B5/022 ,  B32B5/18 ,  B32B7/12 ,  B32B25/045 ,  B32B25/10 ,  B32B25/12 ,  B32B27/065 ,  B32B27/12 ,  B32B2266/025 ,  B32B2307/202 ,  B32B2307/21 ,  B32B2307/546 ,  B32B2307/72 ,  B32B2307/732 ,  C08J9/0066 ,  C08J2201/03 ,  C08J2203/08 ,  C08J2205/052 ,  C08J2323/02 ,  C08J2323/12 ,  C08J2323/16 ,  C08K3/04 ,  C08L23/02 ,  C08L23/04 ,  C08L23/10 ,  C08L2205/02 ,  C09J7/26 ,  C09J7/29 ,  C09J2201/602 ,  C09J2201/622 ,  C09J2400/243 ,  C09J2433/00 ,  H01B1/24 ,  Y10T428/249921 ,  Y10T428/249982 ,  Y10T428/249983

Abstract: Provided is a resin foam which is satisfactorily flexible and electrically conductive, can be easily processed into a desired shape, and is usable as an electrically conductive cushioning sealant capable of filling in a minute clearance between densely packaged electronic components.The resin foam has a volume resistivity of 1010 Ω·cm or less and a repulsive load at 50% compression of 5 N/cm2 or less. The resin foam preferably has a surface resistivity of 1010 ohms per square or less, preferably has an apparent density of 0.01 to 0.15 g/cm3, and preferably has an expansion ratio of 9 times or more.

Abstract translation: 提供令人满意的柔性和导电性的树脂发泡体，可以容易地加工成所需的形状，并且可用作能够在密集封装的电子部件之间填充微小间隙的导电缓冲密封剂。 树脂泡沫体的体积电阻率为10 10Ω·cm·cm以下，压缩压力为50N / cm 2以下的排斥载荷。 优选树脂发泡体的表面电阻率为10 10欧姆/平方
以下，优选表观密度为0.01〜0.15g / cm 3，优选为9倍以上。

公开(公告)号：US20110110066A1

公开(公告)日：2011-05-12

申请号：US13002543

申请日：2009-04-09

Applicant: Yasunobu Yamada ,  Yasushi Akutsu ,  Kouichi Miyauchi

Inventor： Yasunobu Yamada ,  Yasushi Akutsu ,  Kouichi Miyauchi

IPC: H05K1/11 ,  B32B7/12 ,  B32B37/00

CPC classification number: H05K3/323 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2433/00 ,  H01B1/22 ,  H01L2224/29 ,  H05K2203/1189 ,  Y10T156/10 ,  Y10T428/2857 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31511 ,  Y10T428/31909

Abstract: A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures. Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition.

Abstract translation: 使用能够固化的可聚合丙烯酸类化合物的各向异性导电膜，在130℃的压缩温度和3秒的压缩条件的压缩条件下进行各向异性连接时，可以实现高粘合强度和良好的导电可靠性 在比相对较低的温度和相对较短的时间比热固性环氧树脂以及成膜树脂。 因此，各向异性导电膜具有层叠绝缘粘合剂层和各向异性导电粘合剂层的结构。 绝缘粘合剂层和各向异性导电粘合剂层各自含有可聚合的丙烯酸类化合物，成膜树脂和聚合引发剂。 聚合引发剂含有两种具有不同一分钟半衰期温度的有机过氧化物。 在两种有机过氧化物中，具有较高一分钟半衰期的有机过氧化物通过分解产生苯甲酸或其衍生物。

公开(公告)号：US07867611B2

公开(公告)日：2011-01-11

申请号：US12751558

申请日：2010-03-31

Applicant: Daniel P. Segall ,  Iris E. Hilton ,  Melissa E. Szymanski ,  John R. Pennace

Inventor： Daniel P. Segall ,  Iris E. Hilton ,  Melissa E. Szymanski ,  John R. Pennace

IPC: A61B5/04 ,  A61B5/0402 ,  H01B1/12 ,  C09J133/08 ,  B32B27/18

CPC classification number: C08K5/19 ,  C08K5/42 ,  C08L33/00 ,  C09J7/10 ,  C09J9/00 ,  C09J9/02 ,  C09J11/06 ,  C09J2201/602 ,  C09J2433/00 ,  Y10T428/24008 ,  Y10T428/25 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2891

Abstract: A biomedical sensor is disclosed that includes a conductive material for coupling to monitoring equipment, and a composite. The composite includes a polymeric material and a polar material that is substantially dispersed within the polymeric material. The composite has a first side that is coupled to the conductive material and has a second side that is positionable with respect to a subject to be monitored. The polar material exhibits molecular compatibility with the polymeric material such that the polar material neither blooms to a surface of the polymeric material nor crystallizes within the polymeric material.

Abstract translation: 公开了一种生物医学传感器，其包括用于耦合到监测设备的导电材料和复合材料。 复合材料包括聚合物材料和基本上分散在聚合材料内的极性材料。 复合材料具有耦合到导电材料的第一侧，并且具有可相对于待监测对象定位的第二侧。 极性材料表现出与聚合物材料的分子相容性，使得极性材料既不会聚合到聚合物材料的表面也不在聚合物材料内结晶。

公开(公告)号：US20100313667A1

公开(公告)日：2010-12-16

申请号：US12513230

申请日：2008-10-09

Applicant: Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

Inventor： Yoshio Terada ,  Fumiteru Asai ,  Hirokuni Hashimoto

IPC: G01L9/00 ,  H01L21/66

CPC classification number: G01R1/0735 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/40 ,  B32B2255/205 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/516 ,  B32B2307/518 ,  C09J7/38 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  G01R31/2853 ,  H01L21/67132 ,  H01L21/67253

Abstract: Disclosed is an adhesive sheet for inspection, which is obtained by arranging an adhesive layer on a base film. The base film and the adhesive layer are electrically conductive, and an electrically conductive path is formed between the base film and the adhesive layer. Consequently, an inspection for electrical conduction of a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer can be performed while the semiconductor wafer or the semiconductor chip is bonded to the adhesive sheet. In addition, this adhesive sheet for inspection enables to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.

Abstract translation: 公开了一种用于检查的粘合片，其通过在基膜上布置粘合剂层而获得。 基膜和粘合剂层是导电的，并且在基膜和粘合剂层之间形成导电路径。 因此，可以在将半导体晶片或半导体芯片粘合到粘合片上的同时，进行通过切割半导体晶片获得的半导体晶片或半导体芯片的导电性的检查。 此外，该检查用粘合片能够防止半导体晶片的变形（翘曲）或断裂，或者在检查时在半导体晶片的背面产生裂纹或划痕。

公开(公告)号：US20100227101A1

公开(公告)日：2010-09-09

申请号：US12662931

申请日：2010-05-12

Applicant: Masao Saito ,  Osamu Takamatsu ,  Takayuki Matsushima

Inventor： Masao Saito ,  Osamu Takamatsu ,  Takayuki Matsushima

IPC: B32B33/00

CPC classification number: H05K3/323 ,  C08F290/062 ,  C08L71/12 ,  C08L2205/02 ,  C08L2312/00 ,  C08L2666/02 ,  C09J4/00 ,  C09J7/10 ,  C09J9/02 ,  C09J11/08 ,  C09J133/068 ,  C09J163/10 ,  C09J2201/602 ,  C09J2463/00 ,  H01L21/6835 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K2201/0239 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/31935 ,  C08F220/32 ,  H01L2924/00 ,  H01L2924/3512

Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.

Abstract translation: 提供了一种满足低温固化性，高粘合性和高可靠性的绝缘粘合膜和各向异性导电粘合剂膜。 本发明的各向异性导电粘合剂膜是这样构成的，其中导电颗粒7分散在绝缘粘合树脂6中，其包括作为主要成分的具有不饱和双键的自由基聚合性树脂组分; 不具有不饱和双键的树脂组分; 含磷酸树脂组分; 和自由基聚合引发剂。

公开(公告)号：US07727814B2

公开(公告)日：2010-06-01

申请号：US12218161

申请日：2008-07-10

Applicant: Daewoong Suh ,  Amram Eitan ,  Yongki Min

Inventor： Daewoong Suh ,  Amram Eitan ,  Yongki Min

IPC: H01L21/00 ,  H01L21/44

CPC classification number: H01L23/49827 ,  B82Y10/00 ,  C09J7/22 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/326 ,  H01L23/49877 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/05676 ,  H01L2224/0568 ,  H01L2224/11452 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13193 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13666 ,  H01L2224/16145 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/29 ,  H01L2224/29076 ,  H01L2224/29078 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83203 ,  H01L2225/06527 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/026 ,  Y10S977/848 ,  Y10S977/932 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second component. The interconnect further includes a passivation layer to fill the gaps between adjacent CNTs. A method of producing Anisotropic Conductive Film (ACF) and an ACF is provided. The ACF includes a plurality of CNTs, which provide a conducting path between a first side of the ACF and a second side of the ACF. The sides of the ACF can also include a conductive curable adhesive layer. In an embodiment, the conductive curable adhesive layer can incorporate a B-stage cross-linkable polymer and silver particles.

Abstract translation: 提供互连和互连的方法来连接集成电路的第一部件和第二部件。 互连包括多个碳纳米管（CNT），其在第一部件和第二部件之间提供导电路径。 互连还包括钝化层以填充相邻CNT之间的间隙。 提供制造各向异性导电膜（ACF）和ACF的方法。 ACF包括多个CNT，其在ACF的第一侧和ACF的第二侧之间提供导电路径。 ACF的侧面还可以包括导电的可固化粘合剂层。 在一个实施方案中，导电可固化粘合剂层可以并入B级可交联聚合物和银颗粒。

公开(公告)号：US20090068830A1

公开(公告)日：2009-03-12

申请号：US12218161

申请日：2008-07-10

Applicant: Daewoong Suh ,  Amran Eitan ,  Yongki Min

Inventor： Daewoong Suh ,  Amran Eitan ,  Yongki Min

IPC: H01L21/44

CPC classification number: H01L23/49827 ,  B82Y10/00 ,  C09J7/22 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/326 ,  H01L23/49877 ,  H01L23/5384 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/0566 ,  H01L2224/05676 ,  H01L2224/0568 ,  H01L2224/11452 ,  H01L2224/1182 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13193 ,  H01L2224/13562 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/13666 ,  H01L2224/16145 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/29 ,  H01L2224/29076 ,  H01L2224/29078 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83203 ,  H01L2225/06527 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/026 ,  Y10S977/848 ,  Y10S977/932 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: A method of interconnecting and an interconnect is provided to connect a first component and a second component of an integrated circuit. The interconnect includes a plurality of Carbon Nanotubes (CNTs), which provide a conducting path between the first component and the second component. The interconnect further includes a passivation layer to fill the gaps between adjacent CNTs. A method of producing Anisotropic Conductive Film (ACF) and an ACF is provided. The ACF includes a plurality of CNTs, which provide a conducting path between a first side of the ACF and a second side of the ACF. The sides of the ACF can also include a conductive curable adhesive layer. In an embodiment, the conductive curable adhesive layer can incorporate a B-stage cross-linkable polymer and silver particles.

Abstract translation: 提供互连和互连的方法来连接集成电路的第一部件和第二部件。 互连包括多个碳纳米管（CNT），其在第一部件和第二部件之间提供导电路径。 互连还包括钝化层以填充相邻CNT之间的间隙。 提供制造各向异性导电膜（ACF）和ACF的方法。 ACF包括多个CNT，其在ACF的第一侧和ACF的第二侧之间提供导电路径。 ACF的侧面还可以包括导电的可固化粘合剂层。 在一个实施方案中，导电可固化粘合剂层可以并入B级可交联聚合物和银颗粒。