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公开(公告)号：US08846199B2
公开(公告)日：2014-09-30
申请号：US13339557
申请日：2011-12-29
Applicant: Stuart D. Hellring , Kaliappa G. Ragunathan , Kenneth J. Balog , Hong Li , Robert A. Montague
Inventor： Stuart D. Hellring , Kaliappa G. Ragunathan , Kenneth J. Balog , Hong Li , Robert A. Montague
CPC classification number: D01F6/52 , D01D5/003 , D01F6/44 , H05K1/0366 , H05K2201/0278 , Y10T428/24994 , Y10T428/2913 , Y10T428/2929 , Y10T428/2931 , Y10T428/2962 , Y10T428/298
Abstract: Organic-inorganic hybrid fibers and methods for the preparation of such fibers are disclosed.
Abstract translation: 公开了有机 - 无机杂化纤维及其制备方法。
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132.发明授权Method of making halogen-free circuitized substrate with reduced thermal expansion 有权制造具有降低的热膨胀的无卤电路基板的方法公开(公告)号：US08499440B2
公开(公告)日：2013-08-06
申请号：US12380618
申请日：2009-03-02
Applicant: Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
Inventor： Robert M. Japp , Voya R. Markovich , Kostas I. Papthomas
CPC classification number: H05K3/4688 , H01L23/145 , H01L23/3733 , H01L23/49833 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3011 , H05K1/0366 , H05K1/0373 , H05K3/4652 , H05K3/4655 , H05K2201/0209 , H05K2201/0278 , H05K2201/09309 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , H01L2224/0401
Abstract: A method of making a circuitized substrate including a composite layer having a first dielectric sub-layer including a halogen-free resin and fibers dispersed therein and a second dielectric sub-layer without fibers but also including a halogen-free resin with inorganic particulates therein.
Abstract translation: 一种制造电路化基板的方法，该基板包括具有包含无卤素树脂的第一介电子层和分散在其中的纤维的复合层和不含纤维的第二电介质子层，并且还包括无卤素树脂和无机颗粒。
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公开(公告)号：US08486318B2
公开(公告)日：2013-07-16
申请号：US13111850
申请日：2011-05-19
Applicant: Deok Hoon Kim , Kyung Wook Paik , Kyoung Lim Suk , Jae Ok Kim
Inventor： Deok Hoon Kim , Kyung Wook Paik , Kyoung Lim Suk , Jae Ok Kim
IPC: B29C47/02
CPC classification number: H01R4/04 , C08G2650/40 , C08L71/00 , C08L71/02 , C08L77/00 , C08L77/10 , C08L79/04 , C08L81/02 , C08L81/06 , C09J133/08 , C09J133/20 , C09J133/24 , C09J135/06 , C09J143/04 , D01D5/0007 , D01F1/10 , H01R12/52 , H05K3/323 , H05K2201/0278 , H05K2201/029 , Y10T428/254 , Y10T428/28 , Y10T428/2852 , Y10T428/287 , Y10T428/2874 , Y10T428/2878 , Y10T428/2887 , Y10T428/2891 , Y10T428/2896 , Y10T442/30
Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
Abstract translation: 提供了用于实现各种功能的功能性纤维和纤维聚集体，用于容易地结合电子部件的粘合剂及其制造方法。 特别地，沿长度方向延伸的纤维包括载体聚合物和多个功能性颗粒，其中多个功能性颗粒嵌入载体聚合物中并且物理地固定到载体聚合物上以使其一体化。
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134.发明申请公开(公告)号：US20130062045A1
公开(公告)日：2013-03-14
申请号：US13232515
申请日：2011-09-14
Applicant: FU HUA CHU , DAVID SHAU CHEW WANG , YI AN SHA , KUO HSUN CHEN
Inventor： FU HUA CHU , DAVID SHAU CHEW WANG , YI AN SHA , KUO HSUN CHEN
IPC: F28F7/00
CPC classification number: H05K1/0373 , F28F7/00 , F28F21/06 , H05K1/0203 , H05K2201/0278 , H05K2201/0293
Abstract: A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK.
Abstract translation: 导热介电聚合物材料包括热固性环氧树脂，非织造纤维组分，固化剂和导热填料。 热固性环氧树脂选自端环氧官能团环氧树脂，侧链环氧官能团环氧树脂，多官能环氧树脂或其混合物。 热固性环氧树脂占导热介电聚合物材料的4％-60％（体积）。 固化剂被配置为在固化温度下固化热固性环氧树脂。 导热填料包含导热介电聚合物材料的40体积％-70体积％。 非织造纤维组分包含1％-35％体积的导热介电聚合物材料。 导热介电聚合物材料的导热率大于0.5W / mK。
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公开(公告)号：US08394731B2
公开(公告)日：2013-03-12
申请号：US12447653
申请日：2007-11-07
Applicant: Akira Sato , Akira Fujinoki , Hiroyuki Nishimura , Tsukasa Sakaguchi
Inventor： Akira Sato , Akira Fujinoki , Hiroyuki Nishimura , Tsukasa Sakaguchi
IPC: D03D15/00
CPC classification number: H05K1/0366 , D02G3/04 , D02G3/18 , D03D1/0082 , D03D1/0088 , D03D15/00 , D03D15/0011 , D03D15/0016 , D03D15/0027 , D10B2101/06 , D10B2201/00 , D10B2321/02 , D10B2321/021 , D10B2321/022 , D10B2321/121 , H05K1/024 , H05K2201/0158 , H05K2201/0278 , H05K2201/029 , Y10T442/30 , Y10T442/313 , Y10T442/3138 , Y10T442/3976
Abstract: Disclosed is a printed wiring board which attains aims of printed wiring boards required for realizing high-speed, high-frequency semiconductor devices, namely a printed wiring board having low dielectric constant, low dielectric loss tangent and low linear expansion coefficient. Also disclosed is a composite woven fabric suitably used as a base material for such a printed wiring board. Specifically disclosed is a composite woven fabric containing quartz glass fibers and polyolefin fibers, in which the ratio of the quartz glass fibers to the composite woven fabric is set at 10 vol % or more and 90 vol % or less. It is preferred that the quartz glass fibers each have a filament diameter of 3 μm or more and 16 μm or less, and the composite woven fabric has a thickness of 200 μm or less.
Abstract translation: 公开了实现高速，高频半导体器件所需的印刷线路板的目的的印刷线路板，即具有低介电常数，低介电损耗角正切和低线膨胀系数的印刷线路板。 还公开了适合用作这种印刷线路板的基材的复合机织织物。 具体公开了含有石英玻璃纤维和聚烯烃纤维的复合机织织物，其中石英玻璃纤维与复合机织织物的比率设定在10体积％以上且90体积％以下。 优选石英玻璃纤维的长丝直径为3μm以上且16μm以下，复合织物的厚度为200μm以下。
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Patent Agency Ranking
公开(公告)号：US08357433B2
公开(公告)日：2013-01-22
申请号：US12164591
申请日：2008-06-30
Applicant: Gary C. Stevens , James D. B. Smith , John W. Wood
Inventor： Gary C. Stevens , James D. B. Smith , John W. Wood
IPC: H01B1/06
CPC classification number: C08G83/001 , C08J5/046 , C08J2363/00 , C08K3/14 , C08K3/22 , C08L63/00 , D21H13/44 , H05K1/0373 , H05K2201/0251 , H05K2201/0278 , Y10T428/23943 , Y10T428/2907 , Y10T428/2913 , Y10T428/292 , Y10T428/2924 , Y10T428/2925 , Y10T428/2933 , Y10T428/2936 , Y10T428/2947 , Y10T442/2738 , C08L2666/54
Abstract: Polymer brushes (50) in a resin that create phonon pathways therein. The polymer brushes themselves comprise structured polymer hairs having a density of 0.8 to 1.0 g/cc, a chain length of 1 to 1000 nm, and a thermal conductivity of 0.5 to 5.0 W/mK. The polymer brushes are 10-25% by volume of the resin, and the polymer hairs can orient surrounding resin molecules to the polymer hairs alignment (55).
Abstract translation: 在其中产生声子通道的树脂中的聚合物刷（50）。 聚合物刷本身包含密度为0.8至1.0g / cc，链长为1至1000nm，热导率为0.5至5.0W / mK的结构化聚合物毛发。 聚合物刷是树脂的10-25体积％，聚合物毛可以将周围的树脂分子定向到聚合物毛发排列（55）。
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公开(公告)号：US20120228805A1
公开(公告)日：2012-09-13
申请号：US13111850
申请日：2011-05-19
Applicant: Deok Hoon KIM , Kyung Wook PAIK , Kyoung Lim SUK , Jae Ok KIM
Inventor： Deok Hoon KIM , Kyung Wook PAIK , Kyoung Lim SUK , Jae Ok KIM
CPC classification number: H01R4/04 , C08G2650/40 , C08L71/00 , C08L71/02 , C08L77/00 , C08L77/10 , C08L79/04 , C08L81/02 , C08L81/06 , C09J133/08 , C09J133/20 , C09J133/24 , C09J135/06 , C09J143/04 , D01D5/0007 , D01F1/10 , H01R12/52 , H05K3/323 , H05K2201/0278 , H05K2201/029 , Y10T428/254 , Y10T428/28 , Y10T428/2852 , Y10T428/287 , Y10T428/2874 , Y10T428/2878 , Y10T428/2887 , Y10T428/2891 , Y10T428/2896 , Y10T442/30
Abstract: Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.
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138.发明授权Multilayered circuitized substrate with P-aramid dielectric layers and method of making same 失效具有P型芳族聚酰胺介电层的多层电路基板及其制造方法公开(公告)号：US08211790B2
公开(公告)日：2012-07-03
申请号：US12380617
申请日：2009-03-02
Applicant: Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
Inventor： Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
IPC: H01L21/4763
CPC classification number: H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2924/0002 , H01L2924/12044 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , Y10T156/10 , H01L2924/00
Abstract: A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
Abstract translation: 一种多层电路化基板，包括多个介电层，每个电介质层由浸渍有不含卤素的低吸湿性树脂的对芳族聚酰胺纸构成，所述不含卤素的低吸湿性树脂包括无机填料，但不包括连续或半连续的玻璃纤维作为其一部分， 电路层位于第一介电层上。 还提供了制造该基板的方法。
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公开(公告)号：US20120097431A1
公开(公告)日：2012-04-26
申请号：US13339244
申请日：2011-12-28
Applicant: Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
Inventor： Kalu K. Vasoya , Bharat M. Mangrolia , William E. Davis , Richard A. Bohner
CPC classification number: B32B27/12 , B32B5/26 , B32B27/04 , B32B2260/021 , B32B2262/101 , B32B2262/106 , B32B2307/202 , B32B2307/302 , B32B2457/00 , C08K3/38 , C08K9/08 , C08K2003/385 , H05K1/0206 , H05K1/0207 , H05K1/0366 , H05K1/0373 , H05K3/429 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0209 , H05K2201/0278 , H05K2201/0287 , H05K2201/0323 , Y10S428/901 , Y10T29/49124 , Y10T29/49165 , Y10T428/24917 , Y10T428/24994 , Y10T428/249942 , Y10T428/249945 , Y10T428/249946 , Y10T428/249947 , Y10T428/249951 , Y10T428/249952 , Y10T428/25 , Y10T428/292 , Y10T428/31504 , Y10T442/117 , Y10T442/2418
Abstract: Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Abstract translation: 预浸料，层压板，印刷线路板结构以及用于构造材料和印刷线路板的工艺，其能够构造具有改善的热性能的印刷线路板。 在一个实施方案中，预浸料包括浸渍有导电和导热树脂的基材。 在其它实施例中，预浸料坯具有包括碳的基底材料。 在其它实施方案中，预浸料包括浸渍有导热树脂的基材。 在其他实施例中，印刷线路板结构包括可以用作接地和/或电力平面的导电和导热的层压板。
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公开(公告)号：US08088323B2
公开(公告)日：2012-01-03
申请号：US11679345
申请日：2007-02-27
Applicant: Stuart D. Hellring , Kaliappa G. Ragunathan , Kenneth J. Balog , Hong Li , Robert A. Montague
Inventor： Stuart D. Hellring , Kaliappa G. Ragunathan , Kenneth J. Balog , Hong Li , Robert A. Montague
CPC classification number: D01F6/52 , D01D5/003 , D01F6/44 , H05K1/0366 , H05K2201/0278 , Y10T428/24994 , Y10T428/2913 , Y10T428/2929 , Y10T428/2931 , Y10T428/2962 , Y10T428/298
Abstract: Organic-inorganic hybrid fibers and methods for the preparation of such fibers are disclosed.
Abstract translation: 公开了有机 - 无机杂化纤维及其制备方法。
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