公开(公告)号：US20090324902A1

公开(公告)日：2009-12-31

申请号：US12490815

申请日：2009-06-24

Applicant: Tsukasa TOKUNAGA ,  Akira Ichiki ,  Yuichi Shirasaki

Inventor： Tsukasa TOKUNAGA ,  Akira Ichiki ,  Yuichi Shirasaki

IPC: B32B3/10 ,  G03C1/005

CPC classification number: H05K3/106 ,  G03C1/853 ,  H05K2201/0209 ,  H05K2201/0326 ,  Y10T428/24802

Abstract: A photosensitive material for forming a conductive film having a support, a silver salt-containing emulsion layer over the support, and one or more optional layers formed over the support or the silver salt-containing emulsion layer side of the support, wherein any one of the silver salt-containing emulsion layer or the optional layer(s) contains conductive fine particles and a binder, and the ratio by mass of the conductive fine particles to the binder (the conductive fine particles/the binder) is from 1/33 to 1.5/1.

Abstract translation: 一种用于形成具有载体的导电膜的感光材料，在载体上的含银盐的乳液层，以及形成在载体上的一个或多个任选的层或载体的含银盐乳剂层侧，其中任何一个 含银盐乳剂层或任选的层含有导电性微粒和粘合剂，导电性微粒与粘合剂的比例（导电性微粒/粘合剂）的比例为1/33〜 1.5 / 1。

公开(公告)号：US20090259265A1

公开(公告)日：2009-10-15

申请号：US12472222

申请日：2009-05-26

Applicant: Robert A. Stevenson ,  Warren S. Dabney ,  Richard L. Brendel ,  John Roberts ,  Christine A. Frysz

Inventor： Robert A. Stevenson ,  Warren S. Dabney ,  Richard L. Brendel ,  John Roberts ,  Christine A. Frysz

IPC: A61N1/02

CPC classification number: A61N1/37 ,  A61N1/0534 ,  A61N1/0539 ,  A61N1/0556 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G4/35 ,  H01R13/7197 ,  H01R2201/12 ,  H05K3/321 ,  H05K2201/0326

Abstract: An implantable passive or active electronic network component or component network is provided which is suitable for prolonged direct body fluid exposure and is attachable to a conductive surface, circuit trace, lead or electrode. The electronic network component or component network includes (1) a non-conductive body of biocompatible and non-migratable material, (2) a conductive termination surface of biocompatible and non-migratable material, associated with the body, and (3) a connection material of biocompatible and non-migratable material, for conductively coupling the termination surface to the conductive surface, circuit trace, lead or electrode. The electronic network component may include a capacitor, a resistor, an inductor, a diode, a transistor, an electronic switch, a MEMs device, or a microchip. A biocompatible and non-migratable adhesive is utilized to conductively couple components of the individual components of the electronic network, such as the conductive surface, circuit trace, lead or electrode.

Abstract translation: 提供了一种植入式无源或有源电子网络组件或组件网络，其适用于延长的直接体液暴露，并且可连接到导电表面，电路迹线，引线或电极。 电子网络部件或组件网络包括（1）生物相容性和不可迁移材料的非导电体，（2）与身体相关联的生物相容性和不可迁移材料的导电终端表面，和（3）连接 生物相容性和不可迁移材料的材料，用于将终端表面导电耦合到导电表面，电路迹线，引线或电极。 电子网络部件可以包括电容器，电阻器，电感器，二极管，晶体管，电子开关，MEMs器件或微芯片。 使用生物相容性和不可迁移的粘合剂来导电地耦合电子网络的各个部件的部件，例如导电表面，电路迹线，引线或电极。

公开(公告)号：US20090165296A1

公开(公告)日：2009-07-02

申请号：US12401492

申请日：2009-03-10

Applicant: Yoash CARMI

Inventor： Yoash CARMI

IPC: H05K3/07 ,  H05K3/46 ,  H01L21/44

CPC classification number: H01P11/003 ,  H01Q1/2208 ,  H01Q1/38 ,  H05B3/84 ,  H05B2203/017 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/06 ,  H05K9/0094 ,  H05K2201/0326 ,  H05K2201/0338 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: According to embodiments of the present invention, a method for manufacturing a pattern of conductive elements on a substrate is provided. The method includes coating an aluminum foil laminated onto the substrate with an electrically conductive material, applying an etch-resist material on selective areas pre-designed to carry the conductive objects, chemically etching to remove the aluminum and the electrically conductive material from areas not covered by the etch-resist material that are complementary to the selective areas and removing the etch-resist material.

Abstract translation: 根据本发明的实施例，提供了一种用于在基板上制造导电元件图案的方法。 该方法包括用导电材料涂覆层压到基底上的铝箔，在预先设计成承载导电物体的选择区域上施加抗蚀剂材料，化学蚀刻以从未覆盖的区域去除铝和导电材料 通过与选择性区域互补的蚀刻抗蚀剂材料并除去抗蚀剂材料。

公开(公告)号：US07534487B2

公开(公告)日：2009-05-19

申请号：US11083767

申请日：2005-03-18

Applicant: Dagmar Klein ,  Holger Kliesch ,  Thorsten Kiehne ,  Bodo Kuhmann ,  Franz Hora ,  Gottfried Hilkert ,  Manfred Wiederhold

Inventor： Dagmar Klein ,  Holger Kliesch ,  Thorsten Kiehne ,  Bodo Kuhmann ,  Franz Hora ,  Gottfried Hilkert ,  Manfred Wiederhold

IPC: B32B27/08 ,  B32B27/18 ,  B32B27/36 ,  B32B15/09 ,  B32B37/02

CPC classification number: B32B27/36 ,  B32B27/08 ,  B32B27/18 ,  B32B27/20 ,  B32B2307/202 ,  B32B2307/518 ,  B32B2457/00 ,  C08G63/00 ,  C08J5/06 ,  C08J2367/02 ,  H05K1/0254 ,  H05K3/388 ,  H05K2201/0145 ,  H05K2201/0326 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/31504 ,  Y10T428/31663 ,  Y10T428/31681 ,  Y10T428/31786

Abstract: The invention relates to a transparent, electrically conductive, biaxially oriented, single- or multilayer polyester film which includes a coating composed of (a) conductive (ITO) indium tin oxide particles or (ATO) antimony tin oxide particles, or of a mixture of these. The film further include other conductive components (b). The other conductive components (b) may be present either in the coating including ITO particles and/or ATO particles or in a layer in contact therewith. The conductive component (b) may also be a metal layer in contact with the ITO and/or ATO. The film is only oriented or relaxed prior to application of the ITO and/or ATO coating. The invention further relates to a process for the production of the film, and its use.

Abstract translation: 本发明涉及一种透明导电双轴取向的单层或多层聚酯薄膜，其包括由（a）导电（ITO）氧化铟锡颗粒或（ATO）锑锡氧化物颗粒组成的涂层，或由 这些。 膜还包括其它导电组分（b）。 其它导电组分（b）可以存在于包括ITO颗粒和/或ATO颗粒的涂层中或与其接触的层中。 导电组分（b）也可以是与ITO和/或ATO接触的金属层。 在施加ITO和/或ATO涂层之前，膜仅被取向或松弛。 本发明还涉及一种制备薄膜的方法及其用途。

公开(公告)号：US20090078454A1

公开(公告)日：2009-03-26

申请号：US12081457

申请日：2008-04-16

Applicant: Jin Chen ,  Hui Li ,  Rong He

Inventor： Jin Chen ,  Hui Li ,  Rong He

IPC: H05K1/09 ,  H01R12/04 ,  H01R9/00

CPC classification number: H01R12/7076 ,  H05K3/305 ,  H05K3/325 ,  H05K3/361 ,  H05K2201/0326 ,  H05K2201/0373 ,  Y10T29/49147

Abstract: An electronic circuit connecting structure of a flat display panel substrate is described. The electronic circuit connecting structure includes a plurality of conductive terminals on the flat display panel substrate and a plurality of conductive protrusions formed on the conductive terminals. In addition, an electronic circuit connecting method for the flat display panel substrate is also disclosed therein.

Abstract translation: 对平板显示面板基板的电子电路连接结构进行说明。 电子电路连接结构包括在平面显示面板基板上的多个导电端子和形成在导电端子上的多个导电突起。 此外，还公开了一种用于平板显示面板基板的电子电路连接方法。

公开(公告)号：US07444733B2

公开(公告)日：2008-11-04

申请号：US11289356

申请日：2005-11-30

Applicant: Jia-Chong Ho ,  Tarng-Shiang Hu ,  Hsiang-Yuan Cheng

Inventor： Jia-Chong Ho ,  Tarng-Shiang Hu ,  Hsiang-Yuan Cheng

IPC: H01S4/00 ,  H05K3/30 ,  H05K3/02 ,  G01R3/00

CPC classification number: H05K3/303 ,  H01L23/544 ,  H01L51/0097 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/007 ,  H05K3/048 ,  H05K2201/0326 ,  H05K2201/09918 ,  H05K2203/016 ,  H05K2203/0191 ,  H05K2203/0228 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49135 ,  H01L2924/00

Abstract: Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.

Abstract translation: 提出了柔性基板装置上的电子元件工艺的对准精度提高及其方法。 将柔性基板的工艺步骤放在衬底保持器上，其中柔性衬底通过聚合物带固定。 多个对准标记正在进行光刻处理。 当制造电子部件时，将不受应力的切口分离柔性基板和基板支架。

公开(公告)号：US20080202798A1

公开(公告)日：2008-08-28

申请号：US12110707

申请日：2008-04-28

Applicant: Ryohei SATOH ,  Koji Nakagawa ,  Eiji Morinaga ,  Reo Usui ,  Takamitsu Isono ,  Kenji Tanaka ,  Satoru Takaki ,  Kenichi Ebata ,  Hiroshi Sakamoto

Inventor： Ryohei SATOH ,  Koji Nakagawa ,  Eiji Morinaga ,  Reo Usui ,  Takamitsu Isono ,  Kenji Tanaka ,  Satoru Takaki ,  Kenichi Ebata ,  Hiroshi Sakamoto

IPC: H05K1/03 ,  H05K3/22

CPC classification number: H01J9/02 ,  C03C17/2453 ,  C03C23/0025 ,  C03C23/007 ,  C03C2217/211 ,  C03C2217/23 ,  C03C2217/231 ,  C03C2217/24 ,  C03C2218/151 ,  H05K3/027 ,  H05K2201/0108 ,  H05K2201/0326 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×1019/cm3 or higher, with a laser light having a wavelength of 1,064 nm to form a circuit pattern on the transparent substrate.

Abstract translation: 本发明的目的是提供一种制造具有氧化锡薄膜的透明基板的方法，该方法即使通过用能量低的激光照射也能令人满意地进行图案化，因为其中发生烧蚀现象。 本发明涉及一种用于制造承载电路图案的透明基板的方法，该方法包括：照射带有透明基板的薄膜附着透明基板，该透明基板上具有载流子浓度为5×10 19 / > / cm 3以上，具有波长为1064nm的激光，以在透明基板上形成电路图案。

公开(公告)号：US20080054403A1

公开(公告)日：2008-03-06

申请号：US11929788

申请日：2007-10-30

Applicant: Cengiz Palanduz

Inventor： Cengiz Palanduz

IPC: H01L29/76

CPC classification number: H05K1/162 ,  H01G4/1209 ,  H01G4/20 ,  H01G4/33 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0326 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49155 ,  H01L2924/00

Abstract: An apparatus including a first electrode; a second electrode; a first and second ceramic material disposed between the first electrode and the second electrode, the second ceramic material having a greater electrical conductivity than the first ceramic material. A method including forming a first ceramic material film and a different second ceramic material film on a first electrode; and forming a second electrode on the second ceramic material film to form a capacitor structure having the first ceramic material film and the second ceramic material film disposed between the first electrode and the second electrode, wherein the first ceramic material has a conductivity selected to dampen undesired oscillations in electrical device operation to which the capacitor structure may be exposed. An apparatus including a first electrode; a second electrode; and a composite dielectric including a plurality of dielectric films including a different Curie temperature.

公开(公告)号：US20070283832A1

公开(公告)日：2007-12-13

申请号：US11552746

申请日：2006-10-25

Applicant: STEVEN P. HOTELLING

Inventor： STEVEN P. HOTELLING

IPC: B41F23/04

CPC classification number: H05K3/107 ,  G02F1/133305 ,  G02F2001/136295 ,  H05K3/0014 ,  H05K3/16 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/09036 ,  H05K2203/0108

Abstract: An imprint circuit patterning technique that shrinks the minimum feature dimension of circuit features formed on plastic substrates is provided. The imprint circuit patterning technique may be applied to the fabrication of LCDs, particularly LCDs including integral touch sensing. Substrates having patterned substantially transparent electrodes for use with such touch-sensing LCDs and the touch-sensing LCDs are also provided.

Abstract translation: 提供一种压缩电路图案化技术，其缩小形成在塑料基板上的电路特征的最小特征尺寸。 压印电路图案化技术可以应用于LCD的制造，特别是包括整体触摸感测的LCD。 还提供了具有图案化的基本上透明的电极以用于这种触摸感测LCD和触摸感测LCD的衬底。

公开(公告)号：US07049742B2

公开(公告)日：2006-05-23

申请号：US10398827

申请日：2001-10-09

Applicant: Kwang-Ho Jeong ,  Shin-Cheul Kim

Inventor： Kwang-Ho Jeong ,  Shin-Cheul Kim

IPC: H05B33/02

CPC classification number: H05K3/107 ,  H01L27/32 ,  H01L51/0016 ,  H01L51/0023 ,  H01L51/52 ,  H05K1/0306 ,  H05K3/002 ,  H05K2201/0326 ,  H05K2201/09036

Abstract: The present invention relates to a structure of a substrate with electrodes embedded thereinto for use in a flat display device, the device having the structure of the substrate, and a method of manufacturing the structure of the substrate and the device, wherein a problem produced in a case where the electrodes protrude from the substrate for use in the flat display device can be solved, the resistance of the electrodes can be reduced by increasing the cross-sectional areas thereof, the amount of luminescence emitted to the front of the luminescence device can be increased, and the substrate can be kept flat even though the thickness of the electrodes is increased. The device is formed on the substrate (10) by etching a top surface of the substrate (10) for use in the flat display device in a predetermined pattern and then embedding the electrodes into the etched portions or grooves (11). Accordingly, the device can be kept flat and maintain a uniform shape even after a hole transport layer or an electron transport layer has been formed thereon, the yield of the device can be increased, and voltage drop due to the electrodes in a case where the display device becomes larger in area can be minimized, and the amount of luminescence emitted to the front of the device can be increased.

Abstract translation: 本发明涉及具有嵌入其中的电极的基板的结构，用于平板显示装置，具有基板结构的装置以及制造基板和装置的结构的方法，其中产生的问题 可以解决从平板显示装置中使用的基板突出的电极的情况，通过增加其截面积可以降低电极的电阻，发光装置的前方发光的量可以 即使电极的厚度增加，也可以使基板保持平坦。 通过以预定图案蚀刻用于平面显示装置的基板（10）的顶表面，然后将电极嵌入蚀刻部分或凹槽（11）中，在基板（10）上形成装置。 因此，即使在其上形成空穴传输层或电子传输层之后，器件也可以保持平坦并保持均匀的形状，从而可以提高器件的产量，并且由于电极的电压降 显示装置的面积变大可以最小化，并且可以增加发射到装置前面的发光量。