公开(公告)号：US20140116759A1

公开(公告)日：2014-05-01

申请号：US14064401

申请日：2013-10-28

Applicant: IBIDEN CO., LTD.

Inventor： Satoshi WATANABE

IPC: H05K1/05 ,  H05K3/02

CPC classification number: H05K1/0206 ,  H05K1/0271 ,  H05K3/0097 ,  H05K3/108 ,  H05K3/4608 ,  H05K3/4652 ,  H05K2201/066 ,  H05K2201/10287 ,  H05K2201/1056 ,  H05K2203/0369 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/1536

Abstract: A method for manufacturing a printed wiring board includes fixing a lower metal foil on a support plate, forming a lower insulating layer on the lower metal foil, laminating a core metal layer on the lower insulating layer, patterning the core metal layer such that the core metal layer is formed into a core conductive layer, forming an upper insulating layer on the core conductive layer and lower insulating layer, laminating an upper metal foil on the upper insulating layer, removing the plate from the lower foil such that a core substrate including the lower metal foil, lower insulating layer, core conductive layer, upper insulating layer and upper metal foil is formed, and forming on the core substrate a buildup layer including an insulating layer and a conductive layer. The core metal layer has a thickness which is set to be greater than thicknesses of the lower and upper foils.

Abstract translation: 一种制造印刷电路板的方法，包括将下金属箔固定在支撑板上，在下金属箔上形成下绝缘层，在下绝缘层上层叠芯金属层，图案化芯金属层，使芯体 金属层形成为芯导电层，在芯导电层和下绝缘层上形成上绝缘层，在上绝缘层上层叠上金属箔，从下箔去除板，使得包含 形成下金属箔，下绝缘层，芯导电层，上绝缘层和上金属箔，并且在芯基板上形成包括绝缘层和导电层的积层。 芯金属层的厚度被设定为大于下箔和上箔的厚度。

公开(公告)号：US20130329370A1

公开(公告)日：2013-12-12

申请号：US13885437

申请日：2011-11-24

Applicant: Thomas Gottwald ,  Christian Rossle

Inventor： Thomas Gottwald ,  Christian Rossle

IPC: H05K7/20 ,  H05K3/30

CPC classification number: H05K7/20427 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/24195 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/183 ,  H05K3/30 ,  H05K2201/066 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An electronic device comprising an electrically conductive core layer with a first layer composed of electrically conductive material, the first layer being applied on both sides and with at least one electronic component arranged in a cutout of the first layer, wherein the first layer is covered in each case with an electrically insulating, thermally conductive layer and a further layer composed of electrically conductive material is provided in each case on the thermally conductive layer, the further layer being coated in each case with a covering layer composed of electrically conductive material, and furthermore having plated-through boles composed of the material of the covering layer, which extend through the electrically insulating, thermally conductive layer covering the electronic component and the further layer composed of electrically and thermally conductive material for the purpose of making contact with the electronic component.

Abstract translation: 一种电子设备，包括具有由导电材料构成的第一层的导电芯层，所述第一层被施加在两侧，并且至少一个电子部件布置在所述第一层的切口中，其中所述第一层被覆盖在 在每个情况下，在导热层上设置具有电绝缘导热层和由导电材料构成的另外的层的每个壳体，所述另外的层在每种情况下被涂覆有由导电材料构成的覆盖层，此外 具有由覆盖层的材料构成的电镀通孔，其穿过覆盖电子部件的电绝缘导热层，以及由电导热材料构成的另一层，以与电子部件接触。

公开(公告)号：US20130180763A1

公开(公告)日：2013-07-18

申请号：US13352978

申请日：2012-01-18

Applicant: Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E.M. Frushour ,  Jeffrey L. Jensen

Inventor： Wayne L. Moul ,  Robert J. Behnke, II ,  Scott E.M. Frushour ,  Jeffrey L. Jensen

IPC: H05K1/16

CPC classification number: H05K1/0218 ,  H01P3/088 ,  H01P11/003 ,  H05K1/0225 ,  H05K1/0231 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/183 ,  H05K1/186 ,  H05K3/4611 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/0969 ,  H05K2203/063

Abstract: A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer.

Abstract translation: 印刷电路板包括第一层堆叠和耦合到第一层堆叠的第二层堆叠。 第一层堆叠包括第一电绝缘层，第一导电层和限定从其延伸的空隙的切除区域。 第一电绝缘层包括第一表面和相对的第二表面。 第一导电层设置在第一电绝缘层的第一表面上。 第二层堆叠包括第二电绝缘层。 第二电绝缘层包括第一表面和相对的第二表面。 一个或多个导电迹线设置在第二电绝缘层的第一表面上。 印刷电路板还包括至少部分地设置在切除区域内的装置。 该器件电耦合到布置在第二电绝缘层的第一表面上的一个或多个导电迹线中的一个或多个。

公开(公告)号：US20120314371A1

公开(公告)日：2012-12-13

申请号：US13591000

申请日：2012-08-21

Applicant: UMESH MISHRA ,  Primit Parikh ,  Yifeng Wu

Inventor： UMESH MISHRA ,  Primit Parikh ,  Yifeng Wu

IPC: H05K7/20 ,  H01L23/34 ,  H05K3/32

CPC classification number: H05K1/0206 ,  H01L21/8252 ,  H01L23/147 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/66 ,  H01L27/0605 ,  H01L29/2003 ,  H01L29/7787 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/73253 ,  H01L2924/01002 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/30105 ,  H05K1/181 ,  H05K2201/066 ,  Y10T29/4913 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device.

Abstract translation: 电路基板在第一表面上具有一个或多个有源部件和多个无源电路元件。 有源半导体器件具有材料层和多个端子的衬底。 有源半导体器件被倒装芯片安装在电路基板上，并且器件的至少一个端子与电路基板上的有源元件电连接。 基板上的有源元件和安装有倒装芯片的有源半导体器件与无源电路元件组合形成前置放大器和输出放大器。 在电源开关配置中，电路基板在第一表面上具有逻辑控制电路。 安装在电路基板上的半导体晶体管倒装芯片电连接到第一表面上的控制电路，从而控制倒装芯片安装器件的接通和断开。

公开(公告)号：US08330049B2

公开(公告)日：2012-12-11

申请号：US12550812

申请日：2009-08-31

Applicant: Yoon Hyuck Choi ,  Dae Hyeong Lee ,  Jin Waun Kim ,  Kwang Jae Oh

Inventor： Yoon Hyuck Choi ,  Dae Hyeong Lee ,  Jin Waun Kim ,  Kwang Jae Oh

IPC: H05K1/00

CPC classification number: H05K1/0201 ,  H01C1/148 ,  H01C7/003 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/066 ,  H05K2201/09909 ,  Y10T156/10

Abstract: There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions.The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased.Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.

Abstract translation: 提供了一种电路板模块及其制造方法。 电路板模块可以包括：电路板; 布置在电路板上的电阻器; 覆盖电阻器两端的焊盘; 粘合剂部分至少设置在焊盘上并由电绝缘材料形成; 以及散热构件，其设置在所述电阻器上并且使用所述粘合部分结合到所述焊盘。 选择性地形成粘合剂部分，从而防止在安装到电路板上的电阻器和散热构件之间发生短路。 因此，可以提高部件的可靠性。 此外，用于连接板和散热构件的粘合材料由导热材料形成，从而提高散热效率。

公开(公告)号：US08318546B2

公开(公告)日：2012-11-27

申请号：US13090375

申请日：2011-04-20

Applicant: David J. Lima

Inventor： David J. Lima

IPC: H01L21/44 ,  H01L21/48

CPC classification number: H05K1/0207 ,  G02B6/4269 ,  G02B6/4272 ,  H05K1/0206 ,  H05K7/205 ,  H05K7/20545 ,  H05K2201/066 ,  H05K2201/09309 ,  Y10T29/49826

Abstract: Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.

Abstract translation: 为设备提供热管理。 该装置可以包括在基板的第一表面上具有安装区域的基板。 该装置还可以包括从安装区域延伸到基板的至少内部的第一热通孔。 该装置还可以包括基本上平行于衬底的第一表面的至少一个热平面，所述至少一个热平面与第一热通孔中的至少一个热接触。 该装置还可以包括散热器附接区域和从散热器附接区域延伸到衬底内部的第二热通路，该至少一个热平面与第二热通孔热接触。

公开(公告)号：US08218337B2

公开(公告)日：2012-07-10

申请号：US12642315

申请日：2009-12-18

Applicant: Dobabani Choudhury ,  Prasad Alluri

Inventor： Dobabani Choudhury ,  Prasad Alluri

IPC: H05K9/00 ,  H05K1/03 ,  H05K1/18 ,  H05K7/20

CPC classification number: H05K1/024 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/20 ,  H01L24/73 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0236 ,  H05K1/185 ,  H05K2201/066 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/09709 ,  H05K2201/10416 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00

Abstract: According to various aspects of the present disclosure, an apparatus is disclosed that includes a small form factor mobile platform including a system-on-package architecture, the system-on-package architecture arranged as a stack of layers including a first layer having a first conformable material; a second layer having a second conformable material; one or more electronic components embedded within the stack of layers; and a vertical filtering structure arranged periodically between the one or more electronic components, wherein the first conformable material, the second conformable material, or both are configured to allow high frequency signal routing.

Abstract translation: 根据本公开的各个方面，公开了一种装置，其包括包括系统级封装体系结构的小尺寸移动平台，所述系统级封装体系结构布置为层叠层，所述层包括第一层，所述第一层具有第一层 适应材料; 具有第二适形材料的第二层; 嵌入层叠层内的一个或多个电子部件; 以及在所述一个或多个电子部件之间周期性地布置的垂直滤波结构，其中所述第一适形材料，所述第二适形材料或两者被配置为允许高频信号路由。

公开(公告)号：US08192054B2

公开(公告)日：2012-06-05

申请号：US12274283

申请日：2008-11-19

Applicant: Zdenko Grajcar

Inventor： Zdenko Grajcar

IPC: F21V29/00

CPC classification number: F21V21/00 ,  F21K9/233 ,  F21V23/06 ,  F21V29/004 ,  F21V29/74 ,  F21V29/773 ,  F21V29/80 ,  F21V29/83 ,  F21Y2115/10 ,  F28F3/022 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A device is disclosed for producing light that may include one or more printed circuit boards (PCBs), an electronics package may be disposed about a first surface of one or more of the PCBs and a housing. A plurality of PCB's may be set apart and connected by pins to dissipate heat from one PCB to another, and/or to convey electrical connectivity. Pins may be configured to pass through or into one or both the PCBs including the cores to conduct heat generated by the electronics package away for dispersion. In some embodiments, the pins may pass into the backplane. The PCBs may include LEDs, lights, computer devices, memories, telecommunications devices, or combinations of these. The device may also include a housing to contain the plurality of PCBs such that air flow may enter the housing and pass by the pins for cooling of the PCBs and electronics thereof.

Abstract translation: 公开了一种用于产生可以包括一个或多个印刷电路板（PCB）的光的器件，电子封装可以围绕一个或多个PCB和壳体的第一表面设置。 多个PCB可以通过引脚分开并连接，以将散热从一个PCB散发到另一个PCB，和/或传送电连接。 引脚可以被配置成穿过或者进入包括芯的一个或两个PCB，以便传导电子封装产生的热量以便分散。 在一些实施例中，销可以进入背板。 PCB可以包括LED，灯，计算机设备，存储器，电信设备或这些的组合。 该装置还可以包括容纳多个PCB的壳体，使得空气流可以进入壳体并通过销穿过以冷却PCB及其电子装置。

公开(公告)号：US20120092833A1

公开(公告)日：2012-04-19

申请号：US12903710

申请日：2010-10-13

Applicant: Yi-Shun Chang ,  Syh-Yuh Cheng

Inventor： Yi-Shun Chang ,  Syh-Yuh Cheng

IPC: H05K7/20

CPC classification number: H01L33/642 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/0061 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10106 ,  H01L2924/00

Abstract: An LED heat-conducting substrate and its thermal module wherein the composite heat-conducting substrate is incorporated by multiple heat-conducting wires or fibers and insulating material. Said wires or fibers are arranged at interval, and penetrate the front and rear faces. The wires or fibers are segregated by insulating material. An electrode pad is incorporated onto the front face of the composite heat-conducting substrate, and is electrically connected with the electrode pin of LED unit. A heat-conducting pad is incorporated and kept in contact with the heat sink of the LED component for heat conduction. An insulating layer is incorporated onto the rear face of the composite heat-conducting substrate, and located correspondingly to the electrode pad. The LED heat-conducting substrate and thermal module can be constructed easily for high heat conduction in the thickness direction and high electrical insulation in the direction of plane, enabling quick heat transfer to the heat-sinking component.

Abstract translation: LED导热基板及其热模块，其中复合导热基板由多根导热丝或纤维和绝缘材料结合。 所述电线或纤维间隔布置，并穿透前后面。 电线或纤维被绝缘材料隔离。 在复合导热基板的正面上并入电极焊盘，与LED单元的电极引脚电连接。 导热垫被并入并与LED部件的散热器保持接触以用于热传导。 绝缘层被结合到复合导热基板的后表面上，并且对应于电极焊盘。 LED导热基板和热模块可以容易地构造在厚度方向上的高热传导和在平面方向上的高电绝缘性，使得能够快速地传热到散热部件。

公开(公告)号：US20110292615A1

公开(公告)日：2011-12-01

申请号：US13086842

申请日：2011-04-14

Applicant: Rutunj Rai ,  Nadir Sharaf

Inventor： Rutunj Rai ,  Nadir Sharaf

IPC: H05K7/20

CPC classification number: H05K1/144 ,  H05K1/0204 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10015 ,  H05K2201/2036

Abstract: An automotive power converter may include a cold plate, a printed circuit board spaced away from the cold plate and including at least one heat generating electrical component attached thereto, and another printed circuit board disposed between the cold plate and the printed circuit board spaced away from the cold plate. The converter may further include at least one thermally conductive element configured to provide a thermally conductive path from the at least one heat generating electrical component to the cold plate. The at least one thermally conductive element may pass through the printed circuit boards.

Abstract translation: 汽车功率转换器可以包括冷板，与冷板间隔开的包括至少一个附着在其上的发热电气部件的印刷电路板，以及设置在冷板和印刷电路板之间的另一个印刷电路板， 冷盘。 转换器还可以包括至少一个导热元件，其被配置为提供从至少一个发热电气部件到冷板的导热路径。 至少一个导热元件可以穿过印刷电路板。