公开(公告)号：US20160172320A1

公开(公告)日：2016-06-16

申请号：US14566185

申请日：2014-12-10

Applicant: Intel Corporation

Inventor： RAJASEKARAN SWAMINATHAN ,  RAVINDRANATH V. MAHAJAN

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/742 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/1132 ,  H01L2224/11418 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/1148 ,  H01L2224/11849 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13316 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13387 ,  H01L2224/13411 ,  H01L2224/13447 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16503 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81222 ,  H01L2224/81409 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/01026 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0341 ,  H05K2201/083 ,  H05K2201/10674 ,  H05K2203/104 ,  Y02P70/613 ,  H01L2924/01082 ,  H01L2924/0105 ,  H01L2924/01083 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/05381 ,  H01L2924/053 ,  H01L2924/0532 ,  H01L2924/01056

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages.

公开(公告)号：US20160157338A1

公开(公告)日：2016-06-02

申请号：US14951606

申请日：2015-11-25

Applicant: KYOCERA Circuit Solutions, Inc. ,  National University Corporation Okayama University

Inventor： Yoshitaka TOYOTA ,  Kengo IOKIBE ,  Yuki YAMASHITA ,  Toshiyuki KANEKO ,  Masanori NAITO ,  Kiyohiko KAIYA ,  Toshihisa UEHARA ,  Koichi KONDO

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/0236 ,  H05K1/0262 ,  H05K2201/083

Abstract: A printed wiring board includes a digital circuit, an analog circuit, and a power supply path that is disposed on an insulating layer between the digital circuit and the analog circuit. A plurality of open stub EBG structures are disposed at an end of a bridge section in a power supply plane. The open stub EBG structure is an open stub state whose one end is connected to the power supply path and other end is in an open state.

Abstract translation: 印刷电路板包括数字电路，模拟电路和设置在数字电路和模拟电路之间的绝缘层上的电源路径。 多个开放短截线EBG结构设置在电源平面中的桥接部分的端部。 打开的存根EBG结构是一个开放的短截线状态，其一端连接到电源路径，另一端处于打开状态。

公开(公告)号：US20160113113A1

公开(公告)日：2016-04-21

申请号：US14882967

申请日：2015-10-14

Applicant: ROGERS CORPORATION

Inventor： Murali Sethumadhavan ,  Allen F. Horn, III ,  Karl Edward Sprentall ,  Michael White

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/04 ,  H05K3/06 ,  D06M15/227 ,  D06M11/83

CPC classification number: H05K1/0353 ,  D06M11/83 ,  D06M15/227 ,  D06M2200/00 ,  H01F1/348 ,  H01F17/0006 ,  H05K3/043 ,  H05K3/061 ,  H05K3/4644 ,  H05K2201/083

Abstract: In an embodiment, a magneto-dielectric substrate comprises a dielectric polymer matrix; and a plurality of hexaferrite particles dispersed in the polymer matrix in an amount and of a type effective to provide a magneto-dielectric substrate having a magnetic constant of greater than or equal to 2.5 from 0 to 500 MHz, or 3 to 8 from 0 to 500 MHz; a magnetic loss of less than or equal to 0.1 from 0 to 500 MHz, or 0.001 to 0.05 over 0 to 500 MHz; and a dielectric constant of 1.5 to 8 or 2.5 to 8 from 0 to 500 MHz.

Abstract translation: 在一个实施例中，磁介电基片包括电介质聚合物基体; 以及分散在聚合物基体中的数量和类型的多个六铁素体颗粒，其有效地提供磁介质基底，其磁性常数为从0至500MHz大于或等于2.5，或3至8从0至 500 MHz; 0至500MHz的磁损耗小于或等于0.1，在0至500MHz时为0.001至0.05; 介电常数为0〜500MHz的1.5〜8或2.5〜8。

公开(公告)号：US20160099516A1

公开(公告)日：2016-04-07

申请号：US14862440

申请日：2015-09-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki-Jung KIM

IPC: H01R13/62 ,  H05K7/14 ,  H05K9/00 ,  H05K1/18

CPC classification number: H01R13/6205 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/1684 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/10189

Abstract: An electronic device includes a connection unit that is electrically connected with an external connection jack utilizing a magnetic force for a non-insertive electrical connection. According to an embodiment, the electronic device may include an electronic device main body; a printed circuit board that is provided in the electronic device main body and that has a connection unit and a plurality of electronic components mounted thereon; and a magnetic connection device unit that is provided in the electronic device main body and that electrically connects the connection unit with an external connection jack by a magnetic force.

Abstract translation: 电子设备包括利用用于非插入式电连接的磁力与外部连接插座电连接的连接单元。 根据实施例，电子设备可以包括电子设备主体; 设置在电子设备主体中并具有安装在其上的连接单元和多个电子部件的印刷电路板; 以及设置在电子设备主体中并且通过磁力将连接单元与外部连接插座电连接的磁性连接装置单元。

公开(公告)号：US20160029477A1

公开(公告)日：2016-01-28

申请号：US14766898

申请日：2014-02-24

Applicant: NEC CORPORATION

Inventor： Mizuki IWANAMI ,  Taras KUSHTA

IPC: H05K1/02 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K1/0216 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/0233 ,  H05K1/114 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/083 ,  H05K2201/086 ,  H05K2203/06 ,  H01L2924/00014

Abstract: A wiring substrate, to be interposed when an electronic component including an integrated circuit is mounted on a printed wiring board, includes a signal wire transmitting a signal from the electronic component, and a power supply wire supplying a power voltage to the electronic component, and the power supply wire is coated directly with a magnetic thin coat, and the magnetic thin coat is not provided on the signal wire so that the magnetic thin coat is arranged to be separated from the signal wire.

Abstract translation: 当将包括集成电路的电子部件安装在印刷线路板上时将要插入的布线基板包括传输来自电子部件的信号的信号线和向电子部件供电的电源线，以及 电源线被直接涂覆在磁性薄膜上，并且磁性薄膜没有设置在信号线上，使得磁性薄膜布置成与信号线分离。

公开(公告)号：US20160027557A1

公开(公告)日：2016-01-28

申请号：US14801137

申请日：2015-07-16

Applicant: Konica Minolta, Inc.

Inventor： Keita SAITO ,  Midori SHIMOMURA ,  Dai SUWAMA ,  Sayaka MORITA

IPC: H01B13/00

CPC classification number: H05K3/1283 ,  B05C5/0204 ,  H01B13/0026 ,  H05K1/097 ,  H05K2201/0145 ,  H05K2201/083 ,  H05K2203/102 ,  H05K2203/1131 ,  H05K2203/1545

Abstract: A conductive pattern production device includes: a patterning unit that forms a pattern of a composite ink on a base member; and a burning unit that burns the pattern by high-frequency heating. The composite ink is obtained by mixing a particle material that is a material having a relative permeability of 200 or above or a carbon micro-coil and a conductive ink that has, after the burning, a resistivity of 1 to 2000 μΩ·cm.

Abstract translation: 导电图案制造装置包括：图案形成单元，其在基底构件上形成复合墨水的图案; 以及通过高频加热燃烧图案的燃烧单元。 复合油墨是通过将作为相对磁导率为200以上的材料的粒子材料或碳微型线圈与在燃烧后具有1〜2000μΩ·cm·cm·cm的电阻率的导电性油墨混合而获得的。

公开(公告)号：US20150194943A1

公开(公告)日：2015-07-09

申请号：US14661181

申请日：2015-03-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kanta MOTOKI ,  Sayyed TABIB ,  Saneaki ARIUMI

IPC: H03H7/01

CPC classification number: H03H7/0138 ,  H01G4/40 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/0233 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K3/403 ,  H05K2201/083

Abstract: A built-in-circuit substrate includes a substrate body, an electrical circuit including inner electrodes provided inside the substrate body and to which an RF signal is input, outer electrodes which are provided on the substrate body so as to be connected to the electrical circuit and which each include an underlying metal layer and a nickel layer covering at least a portion of the underlying metal layer, and a permanent magnet which is arranged on the substrate body. Thus, noise caused by intermodulation distortion generated in the nickel layers of the outer electrodes is prevented.

Abstract translation: 内置电路基板包括基板主体，电路，包括设置在基板本体内并且输入RF信号的内部电极，设置在基板主体上以连接到电路的外部电极 并且其各自包括底层金属层和覆盖下面的金属层的至少一部分的镍层和布置在基底主体上的永磁体。 因此，防止在外部电极的镍层中产生的互调失真引起的噪声。

公开(公告)号：US09074070B2

公开(公告)日：2015-07-07

申请号：US13658063

申请日：2012-10-23

Applicant: Ticona LLC

Inventor： Paul C. Yung ,  Rong Luo

IPC: C08K3/22 ,  C09K19/38 ,  C08K3/04 ,  C08K3/40 ,  C08L67/03 ,  C08K3/36

CPC classification number: C08K3/36 ,  C08K3/22 ,  C09K19/38 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0129 ,  H05K2201/083 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107

Abstract: A thermoplastic composition that contains a unique combination of a thermotropic liquid crystalline polymer, dielectric material, laser activatable additive, and a fibrous filler is provided. The nature of the components and/or their concentration are selectively controlled in the present invention to maintain a high dielectric constant, good mechanical properties (e.g., deflection under load), and good processibility (e.g., low viscosity), yet still be laser activatable. Thus, the thermoplastic composition can be readily shaped into a thin substrate and subsequently applied with one or more conductive elements using a laser direct structuring process (“LDS”).

Abstract translation: 提供了包含热致液晶聚合物，介电材料，激光可激活添加剂和纤维填料的独特组合的热塑性组合物。 在本发明中选择性地控制组分的性质和/或它们的浓度以保持高的介电常数，良好的机械性能（例如，负载下的挠曲）和良好的加工性（例如低粘度），但仍然是激光可激活的 。 因此，热塑性组合物可以容易地成形为薄的衬底，并随后使用激光直接结构化工艺（“LDS”）施加一个或多个导电元件。

公开(公告)号：US20150107765A1

公开(公告)日：2015-04-23

申请号：US14512535

申请日：2014-10-13

Applicant: SunRay Scientific LLC

Inventor： S. Kumar Khanna

IPC: C09J9/02 ,  H05K3/30 ,  H05K13/04 ,  C09J9/00

CPC classification number: C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

Abstract translation: 公开了各向异性导电粘合剂（ACA）和相关方法的说明性实施方案。 在一个说明性实施方案中，ACA可以包括可使用UV光固化的粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层的铁磁材料。 当ACA在经受磁场后用UV光固化时，导电材料可以形成导电和隔离的平行路径。

公开(公告)号：US20150053467A1

公开(公告)日：2015-02-26

申请号：US14526698

申请日：2014-10-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigetoshi Hayashi ,  Tomoya Yokoyama ,  Takako Sato

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/112 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2924/15162 ,  H01L2924/1531 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/113 ,  H05K1/116 ,  H05K1/165 ,  H05K3/403 ,  H05K3/4629 ,  H05K2201/083 ,  H05K2201/09145

Abstract: Provided is a multilayer substrate that can prevent generation of cracks caused by stress generated due to a difference between the coefficient of linear expansion of electrode pads and that of a ceramic material. An electrode pad arranged on a layer below an outermost component mounting electrode pad has a larger area than an area of the component mounting electrode pad. Similarly, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, and an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad.

Abstract translation: 提供一种多层基板，其可以防止由于电极焊盘的线膨胀系数与陶瓷材料的线性膨胀系数之间的差异而产生的应力产生的裂纹。 布置在最外面部件安装电极焊盘下方的层上的电极焊盘的面积大于部件安装电极焊盘的面积。 类似地，布置在部件安装电极焊盘下方的层上的电极焊盘具有比部件安装电极焊盘的面积更大的面积，布置在部件安装电极焊盘下方的电极焊盘的面积大于 部件安装电极焊盘和布置在部件安装电极焊盘下方的层上的电极焊盘的面积大于部件安装电极焊盘的面积。