公开(公告)号：US20120228005A1

公开(公告)日：2012-09-13

申请号：US13474755

申请日：2012-05-18

Applicant: Shunsuke CHISAKA

Inventor： Shunsuke CHISAKA

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K2201/0129 ,  H05K2201/09127 ,  H05K2203/0228 ,  Y10T29/49155 ,  Y10T156/1052

Abstract: A method for manufacturing a rigid-flexible multilayer wiring board includes a step of forming a release layer such that the release layer covers a flexible portion forming region of a principal surface of a first thermoplastic resin sheet, a step of conducting surface modification on the principal surface of the first thermoplastic resin sheet while using the release layer as a mask, a step of laminating a second thermoplastic resin sheet such that the second thermoplastic resin sheet covers the release layer to form a laminate including the first and second thermoplastic resin sheets, a step of press-bonding the laminate, a step of forming a cut from at least either one of upper and lower surfaces of the laminate toward an outline of the release layer when seen in a plan view, and a step of removing a portion surrounded by the cut.

Abstract translation: 制造刚性 - 柔性多层布线板的方法包括形成剥离层的步骤，使得剥离层覆盖第一热塑性树脂片的主表面的柔性部分形成区域，在主体上进行表面改性的步骤 使用剥离层作为掩模的第一热塑性树脂片的表面，层叠第二热塑性树脂片以使第二热塑性树脂片覆盖剥离层以形成包含第一和第二热塑性树脂片的层压体的步骤， 压接层压体的步骤，当从俯视图中观察时，从层叠体的上表面和下表面中的至少一个形成切割至剥离层的轮廓的步骤，以及除去由 那个切口。

公开(公告)号：US20120217049A1

公开(公告)日：2012-08-30

申请号：US13334152

申请日：2011-12-22

Applicant: Nobuhiro HANAI ,  Takaya ENDO ,  Hirofumi FUTAMURA

Inventor： Nobuhiro HANAI ,  Takaya ENDO ,  Hirofumi FUTAMURA

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L2224/16225 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/09127 ,  H05K2201/10121

Abstract: A wiring board with a built-in imaging element including a substrate having an accommodation portion, an imaging device having a light receiver and positioned in the accommodation portion such that the light receiver faces a first surface of the substrate, first insulation layers having an opening portion and formed on the first surface of the substrate such that the light receiver is exposed from the opening portion, and second insulation layers formed on a second surface of the substrate. The first insulation layers include a first insulation layer, the second insulation layers include a second insulation layer, the second insulation layer is positioned at a predetermined tier and has a thermal expansion coefficient which is set lower than that of the first insulation layer at a predetermined tier such that imbalance in thermal expansion and contraction between the first and second insulation layers is substantially offset or mitigated.

Abstract translation: 一种具有内置成像元件的布线板，包括具有容纳部分的基板，具有光接收器的成像装置，位于所述容纳部分中，使得所述光接收器面对所述基板的第一表面，所述第一绝缘层具有开口 并且形成在基板的第一表面上，使得光接收器从开口部分露出，并且第二绝缘层形成在基板的第二表面上。 所述第一绝缘层包括第一绝缘层，所述第二绝缘层包括第二绝缘层，所述第二绝缘层位于预定层，并且具有设定为比所述第一绝缘层的热膨胀系数低的预定的热膨胀系数 使得第一和第二绝缘层之间的热膨胀和收缩的不平衡被基本上抵消或减轻。

公开(公告)号：US20120192415A1

公开(公告)日：2012-08-02

申请号：US13433166

申请日：2012-03-28

Applicant: Hiroto SUGAHARA

Inventor： Hiroto SUGAHARA

IPC: H05K3/10

CPC classification number: H05K3/361 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2002/14491 ,  H01L2924/00 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0052 ,  H05K3/107 ,  H05K3/321 ,  H05K3/3405 ,  H05K3/3415 ,  H05K3/363 ,  H05K3/4069 ,  H05K2201/09127 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2203/013 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A groove, and a recess which communicates with the groove, are formed in a substrate. Next, a through hole which communicates with the groove is formed. Thereafter, a wire is formed on an upper surface of the substrate, and an individual electrode is arranged on a lower surface of the substrate. Further, a droplet of an electroconductive liquid is made to land on the recess, and the liquid is filled in the through hole via the groove. Next, the liquid filled in the groove, the recess, and the through hole is heated to harden. Further, the recess and the groove of the substrate are removed by cutting up to an area near the through hole. Accordingly, it is possible to connect electrically the connecting bodies arranged on both surfaces of the substrate by filling an electroconductive material in the through holes easily.

Abstract translation: 凹槽和与槽连通的凹部形成在基板中。 接着，形成与槽连通的通孔。 此后，在基板的上表面上形成导线，并且在基板的下表面上设置单独的电极。 此外，使导电液体的液滴落在凹部上，并且液体经由凹槽填充在通孔中。 接下来，将填充在槽，凹部和通孔中的液体加热硬化。 此外，通过切割到通孔附近的区域来去除基板的凹部和凹槽。 因此，可以容易地在通孔中填充导电材料来电连接布置在基板的两个表面上的连接体。

公开(公告)号：US20120185025A1

公开(公告)日：2012-07-19

申请号：US13429215

申请日：2012-03-23

Applicant: Robert Greenberg ,  Jerry Ok

Inventor： Robert Greenberg ,  Jerry Ok

IPC: A61N1/05

CPC classification number: A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L23/057 ,  H01L23/10 ,  H01L23/4985 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/01079 ,  H01L2924/1461 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/423 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/0733 ,  H05K2203/1446 ,  H01L2924/00

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

公开(公告)号：US20120181074A1

公开(公告)日：2012-07-19

申请号：US13249507

申请日：2011-09-30

Applicant: Teruyuki Ishihara ,  Hidetoshi Noguchi

Inventor： Teruyuki Ishihara ,  Hidetoshi Noguchi

IPC: H05K1/11 ,  H05K3/46

CPC classification number: H05K3/46 ,  H05K1/183 ,  H05K3/3452 ,  H05K3/4691 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2203/107 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A wiring board having an insulation layer, and a buildup structure formed on the insulation layer and including insulation layers. The insulation layer and the buildup structure form a board structure in which a cavity portion having an opening on a surface of the buildup structure on the opposite side of the insulation layer is formed. The cavity portion is extending through one or more of the insulation layers in the buildup structure and has a groove portion formed on the bottom surface of the cavity portion along a wall surface of the cavity portion. The board structure composed of the insulation layer and the buildup structure has a pad formed on the bottom surface of the cavity portion in a position farther from the wall surface of the cavity portion than the groove portion.

Abstract translation: 具有绝缘层的布线板和形成在绝缘层上并包括绝缘层的堆积结构。 绝缘层和积层结构形成板结构，其中形成在绝缘层相对侧上的积层结构的表面上具有开口的空腔部分。 空腔部分延伸穿过积聚结构中的一个或多个绝缘层，并且具有沿着空腔部分的壁表面形成在空腔部分的底表面上的凹槽部分。 由绝缘层和积层结构构成的板结构具有在空腔部的底面上形成有比凹槽部更远离空腔部的壁面的位置的垫。

公开(公告)号：US08098134B2

公开(公告)日：2012-01-17

申请号：US11766754

申请日：2007-06-21

Applicant: John Azevedo ,  Rodolfo Monsalvo ,  Jun Liu

Inventor： John Azevedo ,  Rodolfo Monsalvo ,  Jun Liu

IPC: H04Q5/22

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A multi-document read-write station provides the ability to read/write to a stack of Radio Frequency Identification (RFID) tags within a small area. Specifically, the station provides the ability to read from and write to a tall stack of RFID tagged sheets with the RFID tags stacked one on top of the other. The station and capability described herein is the result of and comprises several components including a closed chamber comprising a document slot, an antenna system, and a power management system.

Abstract translation: 多文档读写站提供在一小区域内读/写一堆无线射频识别（RFID）标签的能力。 具体来说，该站提供读取和写入高标签RFID标签的纸张的能力，其中RFID标签堆叠在另一个之上。 本文描述的站和能力是包括若干组件的结果，包括包括文档槽，天线系统和电源管理系统的封闭室。

公开(公告)号：US08063312B2

公开(公告)日：2011-11-22

申请号：US11898503

申请日：2007-09-12

Applicant: Yasunari Ooyabu ,  Jun Ishii ,  Kensuke Nishi

Inventor： Yasunari Ooyabu ,  Jun Ishii ,  Kensuke Nishi

IPC: H05K1/03

CPC classification number: H05K1/0269 ,  G11B5/486 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/163 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24331

Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.

Abstract translation: 布线电路板具有金属支撑板，形成在金属支撑板上的金属箔，形成在金属支撑板上以覆盖金属箔的绝缘基底层，以及形成在绝缘基底层上的导电图案， 端子部分。 在绝缘基底层中形成开口以露出金属箔。

公开(公告)号：US20110163879A1

公开(公告)日：2011-07-07

申请号：US12982369

申请日：2010-12-30

Applicant: James Robert Kruest ,  Gary Bann

Inventor： James Robert Kruest ,  Gary Bann

IPC: G06K7/01

CPC classification number: G06K7/10475 ,  G06K7/0008 ,  G06K7/10029 ,  G06K7/10039 ,  G06K19/0723 ,  G06K19/07796 ,  G06K19/07798 ,  G06Q10/08 ,  H04J3/0641 ,  H05K1/02 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/30 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: RFID tags are used for many purpose including tracking RFID interrogators are used to retrieve information from tags. In many applications, RFID interrogators and RFID tags remain stationary during interrogation. Regions of low energy due to interference from either additional antenna or reflections from RFID tags and objects can impede or prohibit the reading of RFID tags residing in such regions. Stirring of the generated electromagnetic field is a method of moving around the regions of low energy, where tags can not be read, during the interrogation process. Mechanical stirring is accomplished by introducing a conductor into the electromagnetic field and moving it about in the field. Solid state stirring is accomplished by introducing a variable conductor into the field and varying the conductivity of the variable conductor. Mathematical stirring is accomplished by use of a plurality of antenna and controlling the phase difference between the antenna in a configuration known as phased antenna arrays.

Abstract translation: RFID标签用于许多目的，包括跟踪RFID询问器用于从标签中检索信息。 在许多应用中，RFID询问器和RFID标签在询问期间保持静止。 由于来自任何附加天线的干扰或来自RFID标签和物体的反射导致的低能量区域可能阻碍或禁止读取驻留在这些区域中的RFID标签。 所产生的电磁场的搅动是在询问过程期间围绕标签不能被读取的低能量区域移动的方法。 机械搅拌通过将导体引入电磁场并在现场移动来实现。 通过将可变导体引入到场中并改变可变导体的导电性来实现固态搅拌。 通过使用多个天线来实现数学搅拌，并且以称为相控天线阵列的配置来控制天线之间的相位差。

公开(公告)号：US20110118808A1

公开(公告)日：2011-05-19

申请号：US13009769

申请日：2011-01-19

Applicant: Greenberg Robert J. ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

Inventor： Greenberg Robert J. ,  Neil Talbot ,  Jerry Ok ,  Jordan Neysmith ,  Dao Min Zhou

IPC: A61F9/08 ,  A61N1/36

CPC classification number: A61N1/3758 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/375 ,  H01L21/563 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/81 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13169 ,  H01L2224/13178 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81469 ,  H01L2224/81478 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/189 ,  H05K3/10 ,  H05K3/188 ,  H05K3/305 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3436 ,  H05K3/361 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4084 ,  H05K3/423 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4691 ,  H05K13/0469 ,  H05K2201/09127 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10977 ,  H05K2203/05 ,  H05K2203/06 ,  H05K2203/0733 ,  H05K2203/09 ,  H05K2203/107 ,  H05K2203/1446 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package, that is suitable for implantation in living tissue, such as for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.

Abstract translation: 本发明涉及一种将气密密封的电子封装结合到电极或柔性电路的方法以及所得到的电子封装，其适于植入生物组织，例如用于视网膜或皮质电极阵列，以使视力恢复 对某些无意识的个人。 密封电子封装通过电镀生物相容性材料（例如铂或金）直接结合到柔性电路或电极上，有效地形成电镀铆钉形连接，其将柔性电路连接到电子封装。 所得到的电子装置是生物相容的并且适合长期植入生物体组织。

公开(公告)号：US07789989B2

公开(公告)日：2010-09-07

申请号：US12270612

申请日：2008-11-13

Applicant: Lin Ren ,  Ying Su ,  Cheng-Hsien Lin

Inventor： Lin Ren ,  Ying Su ,  Cheng-Hsien Lin

IPC: B29C65/00

CPC classification number: H05K3/4691 ,  H05K3/0052 ,  H05K3/4611 ,  H05K2201/0909 ,  H05K2201/09127 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T156/1064

Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.

Abstract translation: 制造刚柔柔性印刷电路板的方法包括以下步骤。 首先，提供柔性基板。 其次，在柔性基板中限定至少一个狭缝。 第三，提供具有对应于柔性基板的结构的刚性基板。 第四，将柔性基板层合到刚性基板上以获得层压基板。 第五，去除刚性基板的一部分。 第六，层叠基板沿着假想边界线切割以去除层叠基板的废弃部分。 因此，获得刚性柔性印刷电路板。