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公开(公告)号：US09181087B2
公开(公告)日：2015-11-10
申请号：US13038459
申请日：2011-03-02
Applicant: Dennis Mortensen , Pirmin Hermann Otto Rombach
Inventor： Dennis Mortensen , Pirmin Hermann Otto Rombach
CPC classification number: B81C1/00666 , B81B3/0078 , B81B2201/0257 , B81C2201/0167 , H04R19/005 , Y10T29/41 , Y10T428/24802 , Y10T428/249921 , Y10T428/25
Abstract: The present invention refers to a flat back plate, e.g. for MEMS capacitors e.g. for MEMS microphones. For that the back plate comprises a tensile element that exerts a horizontal tensile stress on its environment.
Abstract translation: 本发明涉及平板背板，例如 用于MEMS电容器 用于MEMS麦克风。 为此，背板包括在其环境上施加水平拉伸应力的拉伸元件。
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公开(公告)号：US20150315014A1
公开(公告)日：2015-11-05
申请号：US14797436
申请日：2015-07-13
Applicant: Unisem (M) Berhad
Inventor： Rob Protheroe , Alan Evans , Timothy Leung , Tang Ming Xiang , Guan JunHua
IPC: B81B7/00
CPC classification number: H01L29/84 , B81B7/0041 , B81B7/0058 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81C1/00269 , B81C1/00309 , B81C1/00333 , B81C2203/0109 , B81C2203/052 , G01L9/0042 , H01L23/053 , H01L2224/16225 , H04R1/021 , H04R1/04 , H04R2201/003
Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.
Abstract translation: 一种用于制造封装微电子机械系统（MEMS）装置的封装件的方法提供了具有盖和侧壁的盖，端盖延伸穿过盖。 第一基部部件结合到限定内部空腔的侧壁。 该第一基座部件还包括延伸穿过其中的孔。 MEMS器件通过孔插入并且与MEMS器件结合到盖上，至少部分地与端口重叠。 通过将第二基部部件接合到第一基部部件以密封孔来完成组装。 如此形成的包装具有盖，盖，侧壁和延伸通过盖的端口。 MEMS器件被接合到盖并且电连接到设置在第一基底部件上的导电特征。 第二基部部件结合到跨越孔的第一基部部件。
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公开(公告)号：US09167352B2
公开(公告)日：2015-10-20
申请号：US14224406
申请日：2014-03-25
Applicant: OMRON Corporation
Inventor： Masaaki Kasai , Hidetoshi Nishio
CPC classification number: H04R19/005 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/096 , B81C2203/0154 , H01L2224/48091 , H01L2224/48145 , H01L2224/73265 , H01L2924/15151 , H04R1/083 , H04R31/006 , H01L2924/00014 , H01L2924/00012
Abstract: A microphone has a base substrate having a main surface, an acoustic sensor mounted on the main surface, and a circuit element that processes a signal output from the acoustic sensor. The acoustic sensor has a sensor substrate having a first surface opposed to the base substrate, a second surface on a side opposite to the first surface, and a cavity formed while piercing the sensor substrate from the first surface to the second surface, and a movable electrode that covers the cavity from the second surface side. A through-hole is formed in the base substrate while piercing the base substrate in a thickness direction to communicate with the cavity. The through-hole overlaps the sensor substrate when viewed in the thickness direction of the base substrate.
Abstract translation: 麦克风具有基底，其具有主表面，安装在主表面上的声传感器，以及处理从声传感器输出的信号的电路元件。 所述声学传感器具有传感器基板，所述传感器基板具有与所述基底基板相对的第一表面，与所述第一表面相对的一侧上的第二表面，以及在从所述第一表面穿过所述传感器基板到所述第二表面时形成的空腔， 从第二表面侧覆盖空腔的电极。 在基底基板上形成贯通孔，同时沿着厚度方向刺穿基底基板与腔体连通。 当从基底基板的厚度方向观察时，通孔与传感器基板重叠。
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公开(公告)号：US09162871B1
公开(公告)日：2015-10-20
申请号：US13969052
申请日：2013-08-16
Applicant: Amkor Technology, Inc.
Inventor： Bob Shih-Wei Kuo , Russell Shumway , Louis B. Troche, Jr.
CPC classification number: B81B7/0032 , B81B7/0061 , B81B7/0064 , B81B7/0074 , B81B2201/0257 , B81B2201/0264 , B81B2207/09 , B81C1/00261 , B81C1/00269 , B81C2203/01 , B81C2203/0109 , B81C2203/0154 , B81C2203/0163 , H01L24/97 , H01L2224/32225 , H01L2224/32245 , H01L2224/48111 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/16151 , H01L2924/16152 , H01L2924/00
Abstract: A metal mesh lid MEMS package includes a substrate, a MEMS electronic component coupled to the substrate, and a metal mesh lid coupled to the substrate with a lid adhesive. The metal mesh lid includes a polymeric lid body having a top port formed therein and a metal mesh cap coupled to the lid body. The metal mesh cap covers the top port and serves as both a particulate filter and a continuous conductive shield for EMI/RF interferences. Further, the metal mesh cap provides a locking feature for the lid adhesive to maximize the attach strength of the metal mesh lid to the substrate.
Abstract translation: 金属网盖MEMS封装包括衬底，耦合到衬底的MEMS电子部件和用盖粘合剂耦合到衬底的金属网盖。 金属网盖包括聚合物盖体，其具有形成在其中的顶部端口和联接到盖体的金属网罩。 金属网罩覆盖顶部端口，既用于颗粒过滤器又可用于EMI / RF干扰的连续导电屏蔽。 此外，金属网盖为盖粘合剂提供了锁定特征，以最大化金属网盖对基底的附着强度。
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公开(公告)号：US20150293160A1
公开(公告)日：2015-10-15
申请号：US14367716
申请日：2012-11-14
Applicant: OMRON Corporation
Inventor： Takashi Kasai , Inoue Tadashi
CPC classification number: G01R27/2605 , B81B2201/0257 , B81B2201/0264 , B81C1/00873 , G01H11/06 , H04R19/005 , H04R19/04
Abstract: Diaphragm 33 is provided on a top surface of silicon substrate 32, and plate unit 39 is fixed to the top surface of silicon substrate 32 so as to cover the movable electrode film with a gap. Plate unit 39 is made of an insulating material. Fixed electrode film 40 is formed on a bottom surface of plate unit 39, and diaphragm 33 and fixed electrode film 40 constitute a capacitor. In an area around plate unit 39, a whole outer peripheral edge of the top surface of silicon substrate 32 is exposed from plate unit 39. On the top surface of the substrate 32, insulating sheet 47 made of the insulating material is formed in a part of an area exposed from plate unit 39, and electrode pad 48 electrically connected to diaphragm 33 and electrode pad 49 electrically connected to fixed electrode film 40 are provided on a top surface of insulating sheet 47.
Abstract translation: 膜片33设置在硅基板32的上表面，板单元39固定在硅基板32的上表面上，以便间隙地覆盖可动电极膜。 平板单元39由绝缘材料制成。 固定电极膜40形成在板单元39的底面上，隔膜33和固定电极膜40构成电容器。 在板单元39周围的区域中，硅基板32的上表面的整个外周边缘从板单元39暴露。在基板32的顶表面上，由绝缘材料制成的绝缘片47形成在 在绝缘片47的上表面上设置从板单元39暴露的区域，电连接到隔膜33的电极焊盘48和与固定电极膜40电连接的电极焊盘49。
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Patent Agency Ranking
146.发明授权公开(公告)号：US09156675B2
公开(公告)日：2015-10-13
申请号：US14322106
申请日：2014-07-02
Applicant: Arnd Kaelberer , Jochen Reinmuth , Johannes Classen
Inventor： Arnd Kaelberer , Jochen Reinmuth , Johannes Classen
CPC classification number: B81B3/0037 , B81B3/0021 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81B2207/012 , B81B2207/095 , B81C1/00682 , G01L9/0072 , H04R19/04 , H04R31/00
Abstract: A micromechanical component includes a substrate having a cavern structured into the same, an at least partially conductive diaphragm, which at least partially spans the cavern, and a counter electrode, which is situated on an outer side of the diaphragm oriented away from the substrate so that a clearance is present between the counter electrode and the at least partially conductive diaphragm, the at least partially conductive diaphragm being spanned onto or over at least one electrically insulating material which at least partially covers the functional top side of the substrate, and at least one pressure access being formed on the cavern so that the at least partially conductive diaphragm is bendable into the clearance when a gaseous medium flows from an outer surroundings of the micromechanical component into the cavern. Also described is a manufacturing method for a micromechanical component.
Abstract translation: 微机械部件包括具有被构造成相同的洞穴的基板，至少部分地导电的隔膜，其至少部分地跨过该洞穴;以及对电极，其位于远离基板的隔膜的外侧上， 在相对电极和至少部分导电的隔膜之间存在间隙，所述至少部分导电的隔膜跨越至少一个电绝缘材料或至少部分地覆盖基板的功能顶侧的电绝缘材料，并且至少 一个压力通道形成在洞穴上，使得当气体介质从微机械部件的外部周围流动到洞穴中时，至少部分导电的隔膜可弯曲成间隙。 还描述了一种用于微机械部件的制造方法。
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公开(公告)号：US20150266723A1
公开(公告)日：2015-09-24
申请号：US14218561
申请日：2014-03-18
Applicant: InvenSense, Inc.
Inventor： Mei-Lin CHAN , Michael Julian DANEMAN , Erhan Polatkan ATA , Xiang LI , Martin LIM
CPC classification number: H04R19/04 , B81B2201/0257 , B81B2207/012 , B81C1/00238 , B81C2203/0792 , H04R1/08 , H04R19/005 , H04R31/003 , H04R31/006 , H04R2201/003
Abstract: A MEMS device includes a first plate coupled to a second plate and a fixed third plate formed on a first substrate. The first and second plates are displaced in the presence of an acoustic pressure differential across the surfaces of the first plate. The MEMS device also includes a first electrode formed on the third plate and a second electrode formed on the second substrate. The first, second plate, and third plates are contained in an enclosure formed by a first and second substrates. The device includes an acoustic port to expose the first plate to the environment. The MEMS device also includes a first gap formed between the second and third plates and a second gap formed between the second plate and the second electrode. The displacement of the second plate causes the first gap to change inversely to the second gap.
Abstract translation: MEMS器件包括耦合到第二板的第一板和形成在第一衬底上的固定的第三板。 在第一板的表面上存在声压差的情况下，第一和第二板被移位。 MEMS器件还包括形成在第三板上的第一电极和形成在第二衬底上的第二电极。 第一，第二板和第三板被包含在由第一和第二基板形成的外壳中。 该装置包括用于将第一板暴露于环境的声学端口。 MEMS器件还包括形成在第二和第三板之间的第一间隙和形成在第二板和第二电极之间的第二间隙。 第二板的位移导致第一间隙与第二间隙成反比变化。
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公开(公告)号：US20150256940A1
公开(公告)日：2015-09-10
申请号：US14198657
申请日：2014-03-06
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Marina Fekry Megally Bastarous
IPC: H04R23/00
CPC classification number: H04R19/04 , B81B2201/0257 , B81C1/00182 , H01L2224/16145 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H01L2924/16152 , H04R19/005 , H04R2201/003 , H01L2924/00014
Abstract: A sensor structure, is disclosed. The sensor structure may include a first suspended structure and a second suspended structure disposed from the first suspended structure to form a volume. The first suspended structure and the second suspended structure may be arranged relative to each other such that a received pressure wave entering the volume between the first suspended structure and the second suspended structure generates a displacement of the first suspended structure to a first direction and a displacement of the second suspended structure to a second direction different from the first direction and the displacement may generate a measurable signal.
Abstract translation: 公开了传感器结构。 传感器结构可以包括第一悬挂结构和从第一悬挂结构设置以形成体积的第二悬挂结构。 第一悬挂结构和第二悬挂结构可以相对于彼此布置，使得进入第一悬挂结构和第二悬置结构之间的体积的接收压力波产生第一悬挂结构朝向第一方向的位移和位移 的第二悬挂结构的第二方向与第一方向不同，并且位移可以产生可测量的信号。
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公开(公告)号：US20150256924A1
公开(公告)日：2015-09-10
申请号：US14430466
申请日：2013-09-19
Applicant: WOLFSON MICROELECTRONICS PLC
Inventor： Tsjerk Hoekstra , Mark Hesketh
CPC classification number: H04R19/005 , B81B3/0021 , B81B2201/0257 , H04R1/222 , H04R1/2892 , H04R7/20 , H04R19/04 , H04R31/003 , H04R2201/003 , H04R2207/021
Abstract: This application relates to MEMS devices, especially MEMS capacitive transducers and to processes for forming such MEMS transducer that provide increased robustness and resilience to acoustic shock. The application describes a MEMS transducer having a flexible membrane (101) supported relative to a first surface of a substrate (105) which has one or more cavities therein, e.g. to provide an acoustic volume. A stop structure (401, 402) is positioned so as to be contactable by the membrane when deflected so as to limit the amount of deflection of the membrane. The stop structure defines one or more openings to the one or more substrate cavities and comprises at least one narrow support element (401, 402) within or between said one or more openings. The stop structure thus limits the amount of membrane deflection, thus reducing the stress experienced at the edges and prevents the membrane from contacting a sharp edge of a substrate cavity. As the stop structure comprises narrow support elements any performance impact on the transducer is limited.
Abstract translation: 本申请涉及MEMS器件，特别是MEMS电容式换能器，以及用于形成这样的MEMS换能器的方法，其提供对声学冲击的增强的鲁棒性和弹性。 该应用描述了一种MEMS传感器，其具有相对于其中具有一个或多个空腔的衬底（105）的第一表面支撑的柔性膜（101）。 以提供声音体积。 定位结构（401,402）被定位成当偏转时能够被膜接触，以限制膜的偏转量。 止挡结构限定了一个或多个开口到一个或多个基底空腔，并且包括在所述一个或多个开口之内或之间的至少一个窄支撑元件（401,402）。 因此，止挡结构限制了膜偏转的量，从而减小了边缘处的应力，并且防止了膜接触衬底腔的尖锐边缘。 由于止动结构包括窄支撑元件，所以对换能器的任何性能影响都受到限制。
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公开(公告)号：US20150251898A1
公开(公告)日：2015-09-10
申请号：US14665745
申请日：2015-03-23
Applicant: Knowles Electronics, LLC
Inventor： Sandra F. Vos , Daniel Giesecke
CPC classification number: H04R1/04 , B81B2201/0257 , B81C1/0023 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/16151 , H01L2924/16152 , H04R19/005 , H04R19/04 , H04R31/006 , H01L2924/00014
Abstract: A Microelectromechanical System (MEMS) microphone includes a base printed circuit board (PCB), the base PCB having customer pads; at least one wall coupled to the base; a lid PCB coupled to the at least wall, the lid having a port extending there through; an electrically conductive through-hole via extending through the wall electrically connecting the lid PCB to the base PCB; an integrated circuit embedded in the lid and coupled to the electrically conductive through-hole via; and a micro electro mechanical system (MEMS) device coupled to the integrated circuit in the lid and disposed over the port. Sound energy is converted to an electrical signal by the MEMS device and transmitted to the integrated circuit. The integrated circuit processes the signals and sends the processed signals to the customer pads via the electrically conductive through-hole via.
Abstract translation: 微机电系统（MEMS）麦克风包括基板印刷电路板（PCB），基板PCB具有用户焊盘; 耦合到所述基座的至少一个壁; 耦合到所述至少壁的盖PCB，所述盖具有在其延伸的端口; 导电通孔，其延伸穿过所述壁将所述盖PCB电连接到所述基底PCB; 集成电路，嵌入在盖中并耦合到导电通孔通孔; 以及耦合到盖中的集成电路并设置在端口上的微机电系统（MEMS）装置。 声能被MEMS器件转换成电信号并传输到集成电路。 集成电路处理信号，并通过导电通孔通孔将经处理的信号发送到用户焊盘。
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