公开(公告)号：US20080163687A1

公开(公告)日：2008-07-10

申请号：US12051905

申请日：2008-03-20

Applicant: Michael Scott Kranz ,  Robert Faye Elliott ,  Michael Ray Whitley ,  Marty Ray Williams ,  Philip John Reiner

Inventor： Michael Scott Kranz ,  Robert Faye Elliott ,  Michael Ray Whitley ,  Marty Ray Williams ,  Philip John Reiner

IPC: G01P15/125 ,  G01N7/00 ,  G01K13/00

CPC classification number: B81C1/00246 ,  B81B2201/0235 ,  B81B2201/0278 ,  B81B2201/0292 ,  G01P2015/082 ,  G01P2015/084 ,  G01P2015/0842

Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

Abstract translation: 芯片上的MEMS传感器套件提供单一集成到一个MEMS芯片上的能力，以感测温度，湿度和两个加速轴。 该器件在一个芯片上集成了MEMS加速度计，MEMS湿度传感器和MEMS温度传感器。 这些单独的器件包含所有在通用制造工艺中制造的校准质量，悬浮液，湿度敏感电容器和温度敏感电阻器（热敏电阻器），从而允许它们集成到一个微加工芯片上。 该器件可以在简单的微加工工艺中制造，允许其尺寸被小型化以用于嵌入式和便携式应用。 在运行过程中，传感器套件芯片监测两个轴的温度水平，湿度水平和加速度水平。 外部电路允许传感器读数，范围选择和信号处理。

公开(公告)号：US07244935B2

公开(公告)日：2007-07-17

申请号：US10551425

申请日：2004-04-16

Applicant: Jean-Jacques Yon ,  Jean-Louis Ouvrier-Buffet ,  Astrid Astier ,  Michel Vilain

Inventor： Jean-Jacques Yon ,  Jean-Louis Ouvrier-Buffet ,  Astrid Astier ,  Michel Vilain

IPC: G01J5/00

CPC classification number: G01J5/02 ,  B81B3/0081 ,  B81B2201/0278 ,  B81C2201/0115 ,  G01J5/0235 ,  G01J5/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An absorbent membrane (1) is fixed in suspension onto a front face of a substrate (2), in a direction substantially parallel to the substrate (2), by at least one alveolate structure thermally insulating the membrane from the substrate (2) and arranged in a plane substantially perpendicular to the substrate (2). The detector can comprise arms (3) fixedly secured to the absorbent membrane (1). The alveolate structures can be respectively arranged between one of the arms (3) and the substrate (2). The alveolate structure can be formed by a plurality of superposed thin layers (6) separated by spacers (7) or by superposed rows of arcades formed by thin layers. The alveolate structure can comprise a porous pad.

Abstract translation: 吸收膜（1）通过将膜与基板（2）热绝缘的至少一个肺泡结构以基本上平行于基底（2）的方向悬挂在基底（2）的正面上，以及 布置在基本上垂直于基底（2）的平面中。 检测器可以包括固定在吸收膜（1）上的臂（3）。 蜂窝结构可以分别布置在臂（3）中的一个和基底（2）之间。 蜂窝结构可以由多个由间隔物（7）分隔开的叠置的薄层（6）或由薄层形成的叠层的叠层形成。 泡沫结构可以包括多孔垫。

公开(公告)号：US07160750B2

公开(公告)日：2007-01-09

申请号：US10473762

申请日：2002-02-21

Applicant: Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

Inventor： Hubert Benzel ,  Heribert Weber ,  Frank Schaefer

IPC: H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/0278 ,  B81C2201/0115 ,  B81C2201/0139

Abstract: A method for manufacturing a semiconductor component, such as, for example, a multilayer semiconductor component including a micromechanical component, such as, for example, a heat transfer sensor having a semiconductor substrate of silicon, and a sensor region. For inexpensive manufacture of a thermal insulation between the semiconductor substrate and the sensor region a porous layer is provided in the semiconductor component.

Abstract translation: 一种半导体部件的制造方法，例如包括微机械部件的多层半导体部件，例如具有硅的半导体基板的传热传感器和传感器区域。 为了廉价地制造半导体基板和传感器区域之间的绝热，在半导体部件中设置多孔层。

公开(公告)号：US20060273256A1

公开(公告)日：2006-12-07

申请号：US10551425

申请日：2004-04-16

Applicant: Jean-Jacques Yon ,  Jean-Louis Ouvrier-Buffet ,  Astrid Astier ,  Michel Vilain

Inventor： Jean-Jacques Yon ,  Jean-Louis Ouvrier-Buffet ,  Astrid Astier ,  Michel Vilain

IPC: G01J5/00

CPC classification number: G01J5/02 ,  B81B3/0081 ,  B81B2201/0278 ,  B81C2201/0115 ,  G01J5/0235 ,  G01J5/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An absorbent membrane (1) is fixed in suspension onto a front face of a substrate (2), in a direction substantially parallel to the substrate (2), by at least one alveolate structure thermally insulating the membrane from the substrate (2) and arranged in a plane substantially perpendicular to the substrate (2). The detector can comprise arms (3) fixedly secured to the absorbent membrane (1). The alveolate structures can be respectively arranged between one of the arms (3) and the substrate (2). The alveolate structure can be formed by a plurality of superposed thin layers (6) separated by spacers (7) or by superposed rows of arcades formed by thin layers. The alveolate structure can comprise a porous pad.

Abstract translation: 吸收膜（1）通过将膜与基板（2）热绝缘的至少一个肺泡结构以基本上平行于基底（2）的方向悬挂在基底（2）的正面上，以及 布置在基本上垂直于基底（2）的平面中。 检测器可以包括固定在吸收膜（1）上的臂（3）。 蜂窝结构可以分别布置在臂（3）中的一个和基底（2）之间。 蜂窝结构可以由多个由间隔物（7）分隔的叠置的薄层（6）或由薄层形成的叠层的叠层形成。 泡沫结构可以包括多孔垫。

公开(公告)号：US20060057755A1

公开(公告)日：2006-03-16

申请号：US11221520

申请日：2005-09-07

Applicant: Heribert Weber

Inventor： Heribert Weber

IPC: H01L21/00

CPC classification number: B81C1/00158 ,  B81B2201/0278 ,  B81B2203/0315

Abstract: A micromechanical component having a silicon substrate; a cavity provided in the substrate; and a diaphragm, provided on the surface of the substrate, which closes the cavity; the diaphragm featuring a silicon-oxide layer having an opening that is formed by silicon-oxide wedges pointing to each other; and the diaphragm having at least one closing layer which closes the opening. Also, a suitable manufacturing method.

Abstract translation: 具有硅衬底的微机械部件; 设置在所述基板中的空腔; 以及设置在所述基板的表面上的隔膜，其关闭所述空腔; 所述隔膜的特征在于具有通过彼此指向的氧化硅楔形成的开口的氧化硅层; 并且所述隔膜具有封闭所述开口的至少一个封闭层。 另外，合适的制造方法。

公开(公告)号：US06655834B1

公开(公告)日：2003-12-02

申请号：US09613131

申请日：2000-07-10

Applicant: Wilhelm Frey ,  Karsten Funk

Inventor： Wilhelm Frey ,  Karsten Funk

IPC: G01K702

CPC classification number: H01L35/32 ,  B81B2201/0278 ,  B81B2203/0127 ,  B81B2207/07 ,  B81C1/00246 ,  B81C2203/0735 ,  G01J5/20

Abstract: A sensor, in particular thermal sensor, having a silicon element and a largely self-supporting membrane layer equipped with at least one sensor element, is proposed. The membrane layer is furthermore spaced away from the silicon element by way of at least one contact column and is at least largely supported thereby. The contact column moreover makes electrical contact to the sensor element. Also proposed is a method for manufacturing a largely self-supporting membrane, a polymer layer first being deposited on a base element, patterned, and equipped with at least one cutout. The cutout is subsequently filled with a filler material, and a membrane layer is applied onto the polymer layer. Lastly, the polymer layer is removed again. The proposed method for manufacturing a largely self-supporting membrane layer is suitable in particular for constructing a sensor, in particular a thermal sensor or a thermal sensor array.

Abstract translation: 提出了一种具有硅元件和大部分自支撑膜层的传感器，特别是热传感器，其具有至少一个传感器元件。 膜层还通过至少一个接触柱与硅元件隔开，并且至少大部分被支撑。 接触柱还与传感器元件电接触。 还提出了一种用于制造大部分自支撑膜的方法，首先沉积在基底元件上的聚合物层被图案化并且装备有至少一个切口。 切口随后填充有填充材料，并且将膜层施加到聚合物层上。 最后，再次除去聚合物层。 所提出的用于制造大部分自支撑膜层的方法特别适用于构造传感器，特别是热传感器或热传感器阵列。

公开(公告)号：US20020086540A1

公开(公告)日：2002-07-04

申请号：US09682894

申请日：2001-10-30

Inventor： Kyle Lebouitz

IPC: H01L021/311

CPC classification number: G01J5/40 ,  B81B3/0081 ,  B81B2201/0278 ,  B81B2201/032 ,  B81B2203/0118 ,  G01J5/02 ,  G01J5/0225 ,  G01J5/023 ,  G01J5/06

Abstract: This invention relates to the construction of microfabricated devices and, in particular, to types of microfabricated devices requiring thermal isolation from the substrates upon which they are built. This invention discloses vertical thermal isolators and methods of fabricating the vertical thermal isolators. Vertical thermal isolators offer an advantage over thermal isolators of the prior art, which were substantially horizontal in nature, in that less wafer real estate is required for the use of the vertical thermal isolators, thereby allowing a greater density per unit area of the microfabricated devices.

Abstract translation: 本发明涉及微制造装置的构造，特别涉及需要从其构建基板的热隔离的微加工装置的类型。 本发明公开了垂直热隔离器和垂直隔热器的制造方法。 垂直隔热器具有优于现有技术的隔热装置的优点，其本质上基本上是水平的，因为使用垂直热隔离器需要更少的晶片实际尺寸，从而允许每单位面积的微加工装置的密度更大 。