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    Moulding assembly for forming at least one protective cap
    141.
    发明授权
    Moulding assembly for forming at least one protective cap 有权
    用于形成至少一个保护盖的成型组件

    公开(公告)号：US07284976B2

    公开(公告)日：2007-10-23

    申请号：US11064006

    申请日：2005-02-24

    Applicant: Kia Silverbrook

    Inventor： Kia Silverbrook

    IPC: B29C33/42

    CPC classification number: H01L23/315 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81B2201/0235 ,  B81B2207/056 ,  B81C1/00269 ,  B81C1/00333 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: The present invention relates to a moulding assembly to form at least one protective cap for a device. The moulding assembly includes a first mould wafer including at least one first recess and a second mould wafer including at least one pair of second recesses. The second mould wafer is able to be positioned relative to the first mould wafer so that each first recess is in register with a corresponding pair of second recesses. In use, thermosplastic material is located between the first and second mould wafers; the first and second mould wafers are positioned relative to one another so that each first recess is in register with a corresponding pair of second. recesses; the thermoplastic material is heated; and the first and second mould wafers are pressed together so that heated thermosplastic material enters the first and second recesses. Each first recess and corresponding second pair of recesses thereby combine to define a mould chamber in which a respective cap is formed.

    Abstract translation: 本发明涉及一种用于形成装置的至少一个保护帽的模制组件。 该模制组件包括包括至少一个第一凹部和包括至少一对第二凹槽的第二模具晶片的第一模具晶片。 第二模具晶片能够相对于第一模具晶片定位，使得每个第一凹槽与相应的一对第二凹槽对准。 在使用中，热塑性材料位于第一和第二模具晶片之间; 第一和第二模具晶片相对于彼此定位，使得每个第一凹部与相应的一对第二凹槽对准。 凹槽 热塑性材料被加热; 并且第一和第二模具晶片被压在一起，使得加热的热塑性材料进入第一和第二凹部。 每个第一凹槽和相应的第二对凹槽由此组合以限定其中形成相应盖的模腔。

    Resin microchannel array, method of manufacturing the same and blood test method using the same
    142.
    发明申请
    Resin microchannel array, method of manufacturing the same and blood test method using the same 审中-公开
    树脂微通道阵列，制造方法及使用其的血液检测方法

    公开(公告)号：US20070202560A1

    公开(公告)日：2007-08-30

    申请号：US11360672

    申请日：2006-02-24

    Applicant: Yuji Kikuchi ,  Taiji Nishi ,  Motohiro Fukuda

    Inventor： Yuji Kikuchi ,  Taiji Nishi ,  Motohiro Fukuda

    IPC: C12Q1/54 ,  C12M3/00

    CPC classification number: B01L3/502707 ,  B01L3/502746 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0681 ,  B01L2300/0816 ,  B01L2400/086 ,  B81B2201/0214 ,  B81B2201/058 ,  B81C1/00071 ,  B81C99/009 ,  B81C2201/034

    Abstract: A resin microchannel array includes a first substrate having a plurality of depressions, each depression having an inlet port at one end and an outlet port at another end, and walls sectioning the depressions, each wall having a micro groove connecting the depressions, and a second substrate having a flat surface bonded or pressure-contacted to a surface of the first substrate. Spaces created by the depressions and the grooves in a bonded or pressure contacted part between the first substrate and the second substrate serve as flow channels. Each of a width and a depth of the flow channel is within a range of 1 to 50 μm, and a ratio of the width and the depth of the flow channel is within a range of 1:10 to 10:1.

    Abstract translation: 树脂微通道阵列包括具有多个凹陷的第一基底，每个凹陷部分在一端具有入口端口和另一端部的出口端口，以及分隔凹陷部分的壁，每个壁具有连接凹部的微凹槽， 衬底，其具有与第一衬底的表面结合或压力接触的平坦表面。 由第一基板和第二基板之间的结合或压力接触部分中的凹陷和凹槽产生的空间用作流动通道。 流路的宽度和深度各自在1〜50μm的范围内，流路的宽度和深度的比例在1:10〜10:1的范围内。

    Imprinting of supported and free-standing 3-D micro- or nano-structures
    145.
    发明申请
    Imprinting of supported and free-standing 3-D micro- or nano-structures 有权
    支持和独立的3-D微结构或纳米结构的印刷

    公开(公告)号：US20050258570A1

    公开(公告)日：2005-11-24

    申请号：US10852448

    申请日：2004-05-24

    Applicant: Yen Kong ,  Hong Low ,  Stella Pang ,  Albert Yee

    Inventor： Yen Kong ,  Hong Low ,  Stella Pang ,  Albert Yee

    IPC: B28B11/08 ,  B29C59/02 ,  B81C1/00 ,  B81C99/00 ,  B82B3/00 ,  G03C5/00 ,  G03F7/00

    CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

    Abstract: The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a “latch-on” assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.

    Abstract translation: 本发明涉及微尺度和纳米级压印方法，并且使用这种方法来制造聚合物，陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构 。 在一些实施例中，在制造这些结构中采用双模方法。 在这种方法中，使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部分。 这种表面处理允许通过压印形成三维（3-D）结构并将这种结构转移到基底上。 在一些或其它实施方案中，所使用的聚合物的这种表面处理和玻璃化转变温度的变化可促进3-D结构与模具的分离，以单独形成独立的和/或纳米结构，并且/ 电影。 在一些或其它实施方案中，使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构，其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热 组装热塑性聚合物。

    Method and apparatus for manufacturing a device
    149.
    发明申请
    Method and apparatus for manufacturing a device 有权
    用于制造装置的方法和装置

    公开(公告)号：US20040222349A1

    公开(公告)日：2004-11-11

    申请号：US10626391

    申请日：2003-07-24

    Inventor： Kenneth G. Powell ,  Larry A. Monahan ,  Burton H. Sage JR.

    IPC: B29C033/38 ,  B29C033/56 ,  B29C043/02 ,  B29C045/37

    CPC classification number: B29C33/405 ,  A61M37/0015 ,  A61M2037/0046 ,  A61M2037/0053 ,  B29C33/424 ,  B29C45/372 ,  B29C2045/0094 ,  B29K2883/00 ,  B29L2031/7544 ,  B29L2031/756 ,  B81B2201/055 ,  B81C1/00111 ,  B81C2201/034

    Abstract: A device, preferably a micro-device, is molded from a plastic material by injection molding, compression molding or embossing. A microabrader can be molded having microneedles for abrading the stratum corneum of the skin to form an abraded site in the tissue for enhancing drug delivery. The micro-device is molded using a mold assembly having a silicon molding surface. The silicon molding surface can include a recess corresponding to the desired shape and length of the microneedles. The silicon molding surface enables micron and submicron size features to be molded from polymeric materials without the polymeric material adhering to the mold surface. Micro-devices having molded features having micron and submicron dimensions can be rapidly produced without the use of a release agent.

    Abstract translation: 一种装置，优选一种微型装置，通过注塑，压塑或压花由塑料材料模制。 微型造型机可以模制成具有用于研磨皮肤角质层的微针，以在组织中形成用于增强药物递送的磨损部位。 使用具有硅模制表面的模具组件来模制微型装置。 硅成型表面可以包括对应于所需形状和长度的微针的凹部。 硅成型表面使得微米和亚微米尺寸的特征能够由聚合物材料模制而不会使聚合材料粘附到模具表面。 具有微米和亚微米尺寸的模制特征的微型装置可以在不使用脱模剂的情况下快速生产。

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