公开(公告)号：US20110180206A1

公开(公告)日：2011-07-28

申请号：US13001024

申请日：2009-07-01

Applicant: Andreas Heinrich Dietzel ,  Jeroen Van Den Brand

Inventor： Andreas Heinrich Dietzel ,  Jeroen Van Den Brand

IPC: H05K1/11 ,  B32B38/04 ,  G02B6/12

CPC classification number: H05K3/361 ,  H05K3/0035 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/058 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10977 ,  H05K2203/063 ,  Y10T156/1056

Abstract: According to one aspect, the invention provides a method of providing conductive structures between two foils in a multi-foil system. The system comprises at least two foils, from which at least one foil comprises a terminal. The method comprises the steps of (in any order) providing at least one solid state adhesive layer, patterning adhesive layer with through-holes; filling the through-holes with conductive material, so as to form the conductive structure, connected to the terminal; and bonding the at least two foils.One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.

Abstract translation: 根据一个方面，本发明提供了一种在多箔系统中在两个箔之间提供导电结构的方法。 该系统包括至少两个箔，至少一个箔包括一个端子。 该方法包括以下步骤（以任何顺序）提供至少一个固态粘合剂层，图案化具有通孔的粘合剂层; 用导电材料填充通孔，以形成连接到端子的导电结构; 以及接合所述至少两个箔。 本发明的一个优点是可以用于多箔系统的制造过程中。

公开(公告)号：US07948762B2

公开(公告)日：2011-05-24

申请号：US12027751

申请日：2008-02-07

Applicant: Marta Castillo Garcia ,  Miguel Angel Herrero Perez

Inventor： Marta Castillo Garcia ,  Miguel Angel Herrero Perez

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/058 ,  H05K2201/1028 ,  H05K2201/10356

Abstract: Wiring system which comprises: a flexible printed circuit board (1) with a surface (2) in turn comprising one or more electrical circuits formed by conductive strips (4) and a plurality of electronic components (5) connected to said conductive strips (4) and with at least one extension or branch (6) extending directly from said surface (2) and also comprising conductive strips (7); characterized in that it further comprised: at least one flexible flat cable (8) joined to said at least one extension or branch (6), such that an electrical connection is formed between said flexible flat cable (8) and said extension or branch (6). A vehicle door which internally comprises this wiring system.

Abstract translation: 一种布线系统，包括：具有表面（2）的柔性印刷电路板（1），其又包括由导电条（4）形成的一个或多个电路和连接到所述导电条（4）的多个电子元件（5） ）和至少一个从所述表面（2）直接延伸并且还包括导电条（7）的延伸部分（6）; 其特征在于，还包括：连接到所述至少一个延伸部或分支（6）的至少一个柔性扁平电缆（8），使得在所述柔性扁平电缆（8）和所述延伸部或分支（6）之间形成电连接 6）。 内部包括该接线系统的车门。

公开(公告)号：US20110113618A1

公开(公告)日：2011-05-19

申请号：US12620544

申请日：2009-11-17

Applicant: Alberto F. Viscarra ,  Ethan S. Heinrich ,  Melvin S. Campbell ,  David T. Winslow ,  Kevin C. Rolston ,  Rosalio S. Vidaurri

Inventor： Alberto F. Viscarra ,  Ethan S. Heinrich ,  Melvin S. Campbell ,  David T. Winslow ,  Kevin C. Rolston ,  Rosalio S. Vidaurri

IPC: H01P11/00

CPC classification number: H05K3/0014 ,  H01Q1/38 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/0129 ,  H05K2201/058 ,  H05K2203/0113 ,  H05K2203/0353 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49126 ,  Y10T29/4913

Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.

Abstract translation: 提供了一种制造折纸形天线辐射结构的方法。 在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道， 衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

公开(公告)号：US07722386B2

公开(公告)日：2010-05-25

申请号：US11978408

申请日：2007-10-29

Applicant: Wen-Bin Lin ,  Chih-Hung Chang

Inventor： Wen-Bin Lin ,  Chih-Hung Chang

IPC: H01R12/24

CPC classification number: H01R12/61 ,  H01R12/52 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/058 ,  H05K2201/09918

Abstract: An exemplary flexible printed circuit (20) includes a primary body (210) and a secondary body (220). The primary body includes a primary connection portion (211), and a primary engaging portion. The secondary body includes a secondary connection portion (221) and a secondary engaging portion (223). The primary body and the secondary body are electrically connected by connecting the primary engaging portion and the secondary engaging portion together.

Abstract translation: 示例性的柔性印刷电路（20）包括主体（210）和次体（220）。 主体包括主连接部分（211）和主接合部分。 次级体包括二次连接部分（221）和次接合部分（223）。 主体和次体通过将主接合部和次接合部连接在一起而电连接。

公开(公告)号：US07690104B2

公开(公告)日：2010-04-06

申请号：US12062855

申请日：2008-04-04

Applicant: Michael N. Rosenblatt ,  Amir Salehi

Inventor： Michael N. Rosenblatt ,  Amir Salehi

IPC: H05K3/36 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34 ,  H05K1/00 ,  H05K1/03 ,  H01R12/00

CPC classification number: H05K1/148 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/323 ,  H05K3/341 ,  H05K3/3494 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/10393 ,  H05K2203/0152 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53265

Abstract: A process for assembling a rigid-flex printed circuit board (PCB) is presented. During operation, the process receives rigid-flex PCBs that are to be coupled together, wherein a rigid-flex PCB includes flexible PCBs coupled to rigid PCBs. The process then places the PCBs onto a carrier which is configured to: align the PCBs so that bond regions located on the flexible PCBs overlap with bond regions located on corresponding flexible PCBs, and apply pressure to the overlapped bond regions. The process then sends the carrier through a reflow oven which reflows solder on the PCBs so that the components become mechanically and electrically coupled to the PCBs. The temperature profile generated by the reflow oven and the pressure applied by the carrier cures and sets an anisotropic conductive film located in the bond regions so that the overlapped flexible PCBs become mechanically and electrically coupled together.

Abstract translation: 提出了一种用于组装刚性柔性印刷电路板（PCB）的工艺。 在操作过程中，该过程接收要耦合在一起的刚性柔性PCB，其中刚性柔性PCB包括耦合到刚性PCB的柔性PCB。 然后，该过程将PCB放置在载体上，该载体被配置为：对准PCB，使得位于柔性PCB上的结合区域与位于相应的柔性PCB上的结合区域重叠，并且向重叠的结合区域施加压力。 然后，该过程通过回流炉发送载体，该回流炉在PCB上重新焊接焊料，使得部件变得机械地和电耦合到PCB。 由回流炉产生的温度曲线和由载体施加的压力固化并设置位于接合区域中的各向异性导电膜，使得重叠的柔性PCB变得机械和电耦合在一起。

公开(公告)号：US20100073274A1

公开(公告)日：2010-03-25

申请号：US12318051

申请日：2008-12-19

Applicant: Myung Woo Jung

Inventor： Myung Woo Jung

IPC: G09G3/36

CPC classification number: H05K1/147 ,  G02B6/0073 ,  G02B6/0083 ,  G02F1/1336 ,  G02F1/133615 ,  G02F1/133621 ,  G02F2001/133322 ,  G02F2001/133325 ,  H05K1/028 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/058 ,  H05K2201/10106 ,  H05K2201/2027

Abstract: An LCD device includes: a backlight unit including a plurality of light emitting diodes (LEDs) which generate light, and emit the light to a liquid crystal panel; a main flexible circuit board on which driving circuits to drive the LEDs and the liquid crystal panel; a sub-flexible circuit board on which the LEDs are mounted and electrically connected to a wire pattern formed on the main flexible circuit board by being soldered to a side surface of the main flexible circuit board to electrically connect the light emitting diodes and the driving circuits for the light emitting diodes; and a support main encompassing the liquid crystal panel and the backlight unit and including a step portion at a side surface thereof to accommodate a soldering portion between the side surface of the main flexible circuit board and the sub-flexible circuit board which are connected by soldering.

Abstract translation: LCD装置包括：背光单元，包括产生光的多个发光二极管（LED），并将光发射到液晶面板; 主要柔性电路板，驱动电路驱动LED和液晶面板; 子弹性电路板，其上安装有LED，并通过焊接到主柔性电路板的侧表面电连接到形成在主柔性电路板上的导线图案，以电连接发光二极管和驱动电路 用于发光二极管; 以及包括液晶面板和背光单元的支撑主体，并且在其侧表面上包括台阶部，以容纳通过焊接连接的主柔性电路板的侧表面和副柔性电路板之间的焊接部分 。

公开(公告)号：US07551448B2

公开(公告)日：2009-06-23

申请号：US11343296

申请日：2006-01-31

Applicant: William P. Roberts

Inventor： William P. Roberts

IPC: H05K1/14

CPC classification number: H05K3/365 ,  G01D9/005 ,  G01D11/245 ,  H05K2201/058 ,  H05K2201/0999

Abstract: The invention is directed to a method and apparatus for electrically interconnecting multiple electronic components together by disposing the electronic components between two opposing plurality of protrusions that hold the electrical components together and establish an electrical connection therebetween. Each plurality of protrusions may be disposed in an offset arrangement with the opposing protrusions. The opposing protrusions cause the electronic components to bend and adopt a deflected geometry when they are positioned between the opposing sets of protrusions. This bending results in the electronic components being biased against each other so that electrical contacts on each electronic component may be held together and thereby form an electrical connection. As a result, the opposing sets of protrusions can be used to electrically interconnect a plurality of electrical components in the absence of clamping, adhesion, soldering, or pinching.

Abstract translation: 本发明涉及一种用于通过将电子部件设置在将电气部件保持在一起并在其间形成电连接的两个相对的多个突起之间来将多个电子部件电互连在一起的方法和装置。 每个多个突起可以与相对的突起以偏移的方式设置。 当相对的突起位于相对的突起组之间时，电子部件弯曲并采取偏转的几何形状。 这种弯曲导致电子部件彼此偏压，使得每个电子部件上的电触点可以保持在一起，从而形成电连接。 结果，相对的突起组可用于在没有夹紧，粘附，焊接或夹紧的情况下将多个电气部件电连接。

公开(公告)号：US20080138575A1

公开(公告)日：2008-06-12

申请号：US11856858

申请日：2007-09-18

Applicant: Chih-kuang Yang

Inventor： Chih-kuang Yang

IPC: B32B3/10 ,  H01R43/00

CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/19107 ,  H05K1/142 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  H05K2201/09481 ,  Y10T29/417 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T428/24322 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

Abstract translation: 多层基板的混合结构包括第一多层基板和第二多层基板。 第一多层基板交替地堆叠第一金属层，第一介电层并具有VIA。 第一金属层的边界区域与相应的第一介电层的边界区域连接。 边界区域与相邻的第一金属层和相邻的第一介电层分离。 第二多层基板交替堆叠第二金属层和第二电介质层。 第二金属层的边界区域与相应的第二电介质层的边界区域连接。 边界区域与相邻的第二金属层和相邻的第二介电层分离。 VIA位于第一电介质层的边界区，并且每个VIA具有导电体，以将一个第一金属层与一个第二金属层连接。

公开(公告)号：US20080102656A1

公开(公告)日：2008-05-01

申请号：US11978408

申请日：2007-10-29

Applicant: Wen-Bin Lin ,  Chih-Hung Chang

Inventor： Wen-Bin Lin ,  Chih-Hung Chang

IPC: H01R12/00

CPC classification number: H01R12/61 ,  H01R12/52 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/058 ,  H05K2201/09918

Abstract: An exemplary flexible printed circuit (20) includes a primary body (210) and a secondary body (220). The primary body includes a primary connection portion (211), and a primary engaging portion. The secondary body includes a secondary connection portion (221) and a secondary engaging portion (223). The primary body and the secondary body are electrically connected by connecting the primary engaging portion and the secondary engaging portion together.

Abstract translation: 示例性的柔性印刷电路（20）包括主体（210）和次体（220）。 主体包括主连接部分（211）和主接合部分。 次级体包括二次连接部分（221）和次接合部分（223）。 主体和次体通过将主接合部和次接合部连接在一起而电连接。

公开(公告)号：US20080024697A1

公开(公告)日：2008-01-31

申请号：US11829022

申请日：2007-07-26

Applicant: Wal-Hee KIM ,  Se-In Chang ,  Sang-Hee Lee

Inventor： Wal-Hee KIM ,  Se-In Chang ,  Sang-Hee Lee

IPC: G02F1/13357 ,  F21S2/00 ,  H01L21/04 ,  H01L33/00

CPC classification number: H05K1/147 ,  G02B6/0083 ,  G02F1/133603 ,  G02F2001/133612 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/10106

Abstract: A liquid crystal display includes: an LC panel assembly for displaying an image; a backlight assembly 145 for providing light to the LC panel assembly; and at least one optical sheet disposed between the LC panel assembly and the backlight assembly, wherein the backlight assembly comprises at least one flexible printed circuit having a body including the light source and a connection portion separable from the body for connecting the body to a source of power.

Abstract translation: 液晶显示器包括：用于显示图像的LC面板组件; 用于向LC面板组件提供光的背光组件145; 以及设置在所述LC面板组件和所述背光组件之间的至少一个光学片，其中所述背光组件包括至少一个柔性印刷电路，所述至少一个柔性印刷电路具有包括所述光源的主体和与所述主体分离的用于将所述主体连接到源的连接部 的权力。