公开(公告)号：US11678538B2

公开(公告)日：2023-06-13

申请号：US17523153

申请日：2021-11-10

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Shunpei Yamazaki ,  Kensuke Yoshizumi

IPC: H05K1/18 ,  H01L27/32 ,  H01L51/00 ,  G04G9/00 ,  H05K1/02 ,  H05K1/14 ,  H01L27/12

CPC classification number: H01L27/3276 ,  G04G9/0088 ,  H01L27/3262 ,  H01L51/0097 ,  H01L27/1244 ,  H01L2227/323 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/0277 ,  H05K1/0283 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/051 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  Y02E10/549

Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

公开(公告)号：US09899715B2

公开(公告)日：2018-02-20

申请号：US15256818

申请日：2016-09-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui ,  Takahiro Baba ,  Kosuke Nishino

IPC: H05K7/00 ,  H01P1/203 ,  H01P3/02 ,  H01P3/08 ,  H01P5/02 ,  H05K1/18 ,  H05K5/00 ,  H05K1/02 ,  H05K1/14

CPC classification number: H01P1/203 ,  H01P1/2039 ,  H01P3/026 ,  H01P3/08 ,  H01P5/02 ,  H05K1/0216 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/028 ,  H05K1/147 ,  H05K1/18 ,  H05K5/0086 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/0715 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09727

Abstract: A transmission line member includes a dielectric base body. At an intermediate point in a thickness direction of the dielectric base body, first and second signal conductors are disposed. A reference ground conductor is disposed at one side of the first and second signal conductors in the thickness direction, and an auxiliary ground conductor is disposed at the other side. At intermediate points of the first signal conductor, a coil conductor and a capacitor-defining plate conductor are disposed. The capacitor-defining plate conductor faces the reference ground conductor and the auxiliary ground conductor to connect a low pass filter and the first transmission line. A coil conductor is disposed between the second signal conductor and the reference ground conductor, and connected to the second signal conductor and the reference ground conductor to connect a high pass filter and the second transmission line.

公开(公告)号：US09826624B2

公开(公告)日：2017-11-21

申请号：US14731145

申请日：2015-06-04

Applicant: Samsung Display Co., Ltd.

Inventor： Hyun Seop Song ,  Hyun Jung Son ,  Kwang Hyun Baek

IPC: H05K5/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/0269 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/09918 ,  H05K2201/10128 ,  H05K2203/166

Abstract: A display device includes: a panel substrate configured to display an image; a control printed circuit board to receive an image signal from an external source, to generate data and a control signal based on the image signal, and to provide the data and the control signal to the panel substrate; and a flexible printed circuit board (FPCB) electrically connected to the panel substrate and electrically connected to the control printed circuit board. A first align mark is disposed on the FPCB and a second align mark is disposed on the control printed circuit board.

公开(公告)号：US20170257938A1

公开(公告)日：2017-09-07

申请号：US15446727

申请日：2017-03-01

Applicant: LENOVO (SINGAPORE) PTE. LTD.

Inventor： HIROHIDE KOMIYAMA ,  HIDESHI TSUKAMOTO ,  YASUSHI YOSHIKAWA ,  MITSURU OGAWA

IPC: H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0277 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/09245 ,  H05K2201/09254 ,  H05K2201/09418

Abstract: A flexible printed circuit board (FPCB) is disclosed. The FPCB can be employed to connect an interface card having connectors with a two-stage configuration to a connection destination of a portable information equipment. The FPCB includes a bend line located between an upper-stage terminal group and a lower-stage terminal group. The FPCB can be bent along the bend line to allow the upper-stage terminal group and the lower-stage terminal group to be mutually superimposed over each other. In addition, the upper-stage terminal group of the FPCB is connected to the upper-stage-side connector terminal group of the interface card, and the lower-stage terminal group of the FPCB is connected to the lower-stage-side connector terminal group of the interface card.

公开(公告)号：US09609761B2

公开(公告)日：2017-03-28

申请号：US14505516

申请日：2014-10-03

Applicant: Hung-Chang Chen

Inventor： Hung-Chang Chen

IPC: H05K3/30 ,  H05K1/02 ,  F21V19/00 ,  H05K1/18 ,  H05K3/00 ,  F21Y101/00 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: H05K3/305 ,  F21V19/005 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/0064 ,  H05K3/0097 ,  H05K2201/053 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/2054

Abstract: A method of mounting a self-adhesive substrate on an electronic device comprising steps of: (S01) providing a base for mounting at least one self-adhesive substrate thereon, wherein each self-adhesive substrate includes a copper circuit layer formed thereon, an insulated adhering layer adhered with the copper circuit layer and made of glue with thermal conductive powders, and a release layer attached with the insulated adhering layer; (S02) forming the at least one self-adhesive substrate on the base based on a profile or a circuit configuration of a fixing portion of an accommodating member of an electronic device; (S03) welding a plurality of electronic elements on the copper circuit layer of each self-adhesive substrate; (S04) removing each self-adhesive substrate; (S05) removing the release layer from each self-adhesive substrate to adhere each self-adhesive substrate on the fixing portion of the accommodating member of the electronic device.

公开(公告)号：US09583445B2

公开(公告)日：2017-02-28

申请号：US14218384

申请日：2014-03-18

Applicant: Apple Inc.

Inventor： Richard H. Dinh ,  Ashutosh Y. Shukla ,  Scott A. Myers

IPC: H01L23/552 ,  H01L27/146 ,  H01L23/498 ,  H05K1/02 ,  H05K1/18 ,  H01L23/13 ,  H01L23/15 ,  H01L23/00 ,  H05K3/00 ,  H05K3/36

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L27/14618 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/81801 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K1/0218 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/363 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09145 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09618 ,  H05K2201/10378 ,  H05K2201/2018 ,  H01L2924/014 ,  H01L2924/00

Abstract: An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The electrical component may be soldered to the contacts on the upper surface. The contacts on the lower surface may be used to solder the substrate to a printed circuit. During manufacturing, it may be desirable to use metal traces on a ceramic panel to make connections to contacts on the substrate. Following singulation of the ceramic panel to form the ceramic substrate, some of the metal traces may run to the edge of the ceramic substrate. A folded tab of the printed circuit may form a shield that covers these exposed traces. A divided metal-coated groove or a row of divided metal-coated vias running along each edge of the substrate may also provide shielding.

Abstract translation: 电气部件可以安装在诸如陶瓷基板的基板上。 可以在基板的上表面和下表面上形成接触。 电气部件可以焊接到上表面上的触点。 下表面上的触点可用于将基板焊接到印刷电路。 在制造过程中，可能需要在陶瓷板上使用金属迹线来连接到基板上的触点。 在陶瓷面板分层以形成陶瓷衬底之后，一些金属迹线可以流到陶瓷衬底的边缘。 印刷电路的折叠片可以形成覆盖这些暴露痕迹的屏蔽。 沿着衬底的每个边缘延伸的划分的金属涂覆的凹槽或一排划分的金属涂覆的通孔也可以提供屏蔽。

公开(公告)号：US20160330829A1

公开(公告)日：2016-11-10

申请号：US15109423

申请日：2014-12-29

Applicant: KUNSHAN VISIONOX DISPLAY CO., LTD.

Inventor： Leping AN ,  Long WANG ,  Ming GAO ,  Yao HONG ,  Bin PU

IPC: H05K1/02

CPC classification number: H05K1/028 ,  G06F3/041 ,  G06F2203/04107 ,  H05K1/0213 ,  H05K1/0215 ,  H05K2201/053 ,  H05K2201/09009

Abstract: The present invention discloses a flexible circuit board. The flexible circuit board comprises a base portion and a grounding soft board extending from the base portion, the grounding soft board comprising a board body connected to the base portion and a contact end provided at a free end of the board body, the contact end comprising a bonding region and a windowing copper exposure region arranged inside the bonding region, and the board body being in a curved shape. According to the present invention, by making improvements on the bonding area between the grounding soft board and the shielding layer and on the shape of the soft board, and by increasing the bonding power and dispersing the folding stress, the grounding soft board is prevented from falling off at portions contacting the shielding layer when folded or transported.

Abstract translation: 本发明公开了一种柔性电路板。 柔性电路板包括从基部延伸的基部和接地软板，接地软板包括连接到基部的板本体和设置在板本体的自由端的接触端，所述接触端包括 接合区域和布置在接合区域内的开窗铜曝光区域，并且板体呈弯曲形状。 根据本发明，通过改善接地软板和屏蔽层之间的接合面积以及软板的形状，通过增加接合力和分散折叠应力，可以防止接地软板 在折叠或运输时与屏蔽层接触的部分脱落。

公开(公告)号：US20160309579A1

公开(公告)日：2016-10-20

申请号：US15089696

申请日：2016-04-04

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Ki Hyuk KIM ,  Cheol-Ho LEE ,  Hee-Kwon LEE ,  Seuk Whan LEE

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/189 ,  H05K1/0219 ,  H05K1/0227 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/118 ,  H05K3/4007 ,  H05K2201/05 ,  H05K2201/053 ,  H05K2201/10136

Abstract: A flexible printed circuit board including a body portion, a connector, and a protrusion. The body portion has a circuit area with a circuit pattern and a peripheral area adjacent to the circuit area. The connector is for an external device and is coupled to a first side of the body portion. The protrusion protrudes from a second side of the body portion and includes an exposed part of a metal layer.

Abstract translation: 一种柔性印刷电路板，包括主体部分，连接器和突起。 主体部分具有电路图案和邻近电路区域的周边区域的电路区域。 连接器用于外部装置，并且连接到主体部分的第一侧。 突起从主体部分的第二侧突出并且包括金属层的暴露部分。

公开(公告)号：US09439302B2

公开(公告)日：2016-09-06

申请号：US13975276

申请日：2013-08-23

Applicant: NANCHANG O-FILM TECH CO., LTD. ,  SUZHOU O-FILM TECH CO., LTD. ,  SHENZHEN O-FILM TECH CO., LTD.

Inventor： Yunhua Zhao ,  Yulong Gao ,  Yunliang Yang ,  Ying Gu

IPC: G06F3/045 ,  H05K3/36 ,  H05K1/02 ,  H05K1/03 ,  H05K3/10 ,  H05K3/12 ,  G06F3/044

CPC classification number: H05K3/361 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0228 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/053 ,  H05K2201/09036 ,  H05K2201/09681 ,  H05K2201/09827 ,  H05K2203/1572

Abstract: A transparent conductive film, includes: a transparent substrate, wherein a transparent substrate includes a body and a flexible board, a width of flexible board is less than that of the body, and the body includes a sensing area and a border area located at an edge of the sensing area; a conduction line, disposed on a transparent flexible substrate; a first conductive layer and a second conductive layer, disposed on two sides of the sensing area opposite to each other; a first electrode trace and a second electrode trace, disposed on the border area, and the first conductive layer and the conduction line are electrically connected through a first electrode trace; the second conductive layer and the conduction line are electrically connected through a second electrode trace. The production efficiency of the above transparent conductive film is improved.

Abstract translation: 一种透明导电膜，包括：透明基板，其中透明基板包括主体和柔性板，柔性板的宽度小于主体的宽度，并且主体包括感测区域和位于 传感区域的边缘; 导线，设置在透明柔性基板上; 第一导电层和第二导电层，设置在彼此相对的感测区域的两侧; 设置在边界区域上的第一电极迹线和第二电极迹线以及第一导电层和导电线通过第一电极迹线电连接; 第二导电层和导线通过第二电极迹线电连接。 上述透明导电膜的制造效率提高。

公开(公告)号：US09398686B2

公开(公告)日：2016-07-19

申请号：US14454850

申请日：2014-08-08

Applicant: Samsung Display Co., LTD.

Inventor： Ki-Hae Shin ,  Jeong-Hun Go ,  Hee-Un Ku ,  Young-Sun Kim ,  Hoe-Seok Na

IPC: H05K1/11 ,  H05K1/02 ,  H05K3/36 ,  H01L23/498 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32

CPC classification number: H05K1/028 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/189 ,  H05K3/282 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/053 ,  H05K2201/09154 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09727 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/1147 ,  H01L2924/00

Abstract: A tape package includes a base substrate including a signal transmitting area and a protruding area protruded from the signal transmitting area, an integrated circuit chip mounted on the base substrate, and a lead line disposed on the base substrate and including a first portion electrically connected with the integrated circuit chip, a second portion electrically connected with the first portion and extending in a first direction, and a third portion electrically connected with the second portion and extending in a second direction crossing the first direction.

Abstract translation: 一种带包装，包括：基底基板，包括信号传输区域和从信号传输区域突出的突出区域;安装在基底基板上的集成电路芯片;以及设置在基底基板上的引线， 集成电路芯片，与第一部分电连接并沿第一方向延伸的第二部分，以及与第二部分电连接并沿与​​第一方向交叉的第二方向延伸的第三部分。