公开(公告)号：US20100170953A1

公开(公告)日：2010-07-08

申请号：US12294658

申请日：2006-04-03

Applicant: Stephan Schaade

Inventor： Stephan Schaade

IPC: G06K19/077 ,  H05K7/00 ,  B23P19/00

CPC classification number: H05K1/0266 ,  H05K1/0293 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10098 ,  H05K2201/10159 ,  H05K2201/10212 ,  H05K2203/175 ,  Y10T29/49815

Abstract: The electronic module (BG) incorporates a specified separation edge (SAK, SAK1, SAK2, SAK3) for the mechanical, irreversible separation of a separable part (AT, AT1, AT2, AT3) of the module (BG) from the remainder of the module (BGR), both the separable part (AT, AT1, AT2, AT3) and the module remainder (BGR) incorporating essentially interacting circuit components (ST1, ST2) for an intended electrotechnical operation of the module (BG). By separating the separable part (AT, AT1, AT2, AT3) the electrotechnical operation of the module (BG) can be permanently deactivated.

Abstract translation: 电子模块（BG）包含用于将模块（BG）的可分离部分（AT，AT1，AT2，AT3）与其余部分（AT，AT1，AT2，AT3）的机械不可逆分离的指定分离边缘（SAK，SAK1，SAK2，SAK3） 模块（BGR），可分离部分（AT，AT1，AT2，AT3）和包含基本上相互作用的电路部件（ST1，ST2）的模块余量（BGR），用于模块（BG）的预期电工操作。 通过分离可分离部分（AT，AT1，AT2，AT3），模块（BG）的电工操作可以永久停用。

公开(公告)号：US07712210B2

公开(公告)日：2010-05-11

申请号：US11808140

申请日：2007-06-07

Applicant: Thomas R. Miller ,  Duane A. Stanke ,  Robert J. Testa

Inventor： Thomas R. Miller ,  Duane A. Stanke ,  Robert J. Testa

IPC: H05K3/36

CPC classification number: H05K1/117 ,  H05K3/4611 ,  H05K2201/09127 ,  H05K2201/09845 ,  H05K2203/061 ,  H05K2203/1147 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: A method of making a printed circuit board in which at least two circuitized substrates are aligned and bonded together (e.g., using lamination). A gasket is provided on one of these and a facing circuitized portion on the other. The gasket forms an effective seal about the circuitized portion to prevent heated dielectric material from contacting the circuitry. After bonding, parts of the bonded structure, including the gasket, are removed to leave a projecting edge portion having circuitry thereon. This edge portion is then adapted for being positioned within an edge connector.

Abstract translation: 制造印刷电路板的方法，其中至少两个电路化基板对准并结合在一起（例如，使用层压）。 在其中一个和另一个面上的电路部分上设有垫片。 垫圈围绕电路部分形成有效的密封，以防止加热的电介质材料接触电路。 在粘合之后，去除包括垫圈的粘合结构的部分，以留下其上具有电路的突出边缘部分。 然后该边缘部分适于定位在边缘连接器内。

公开(公告)号：US20100091539A1

公开(公告)日：2010-04-15

申请号：US12576561

申请日：2009-10-09

Applicant: Kwang-kyu BANG ,  Kwan-jong PARK

Inventor： Kwang-kyu BANG ,  Kwan-jong PARK

IPC: G11C5/02 ,  H01S4/00 ,  G11C29/00

CPC classification number: G11C29/48 ,  G11C5/04 ,  G11C29/1201 ,  H05K1/0268 ,  H05K2201/09127 ,  H05K2201/10159 ,  Y10T29/49002

Abstract: Example embodiments of the inventive concept are directed to solid state device products, intermediate solid state devices, and methods of manufacturing and testing the same, with removable test terminals, which may permit in situ testing of one or more components of the solid state device products.

Abstract translation: 本发明构思的示例性实施例涉及固态器件产品，中间固态器件及其制造和测试方法，具有可移除的测试端子，其可允许对固态器件产品的一个或多个部件进行原位测试 。

公开(公告)号：US20100085755A1

公开(公告)日：2010-04-08

申请号：US12311478

申请日：2007-09-26

Applicant: Angel Sanabra Cunill

Inventor： Angel Sanabra Cunill

IPC: F21S4/00

CPC classification number: H05K1/0286 ,  F21K9/00 ,  H05K1/142 ,  H05K3/0052 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09845 ,  H05K2201/09963 ,  H05K2201/10106

Abstract: This device includes boards housing a large number of LEDs electrically connected with the tracks of a printed circuit, arranged in the board according to an equilateral triangular distribution and separated from one another at a fixed distance ‘a’, these light emitting diodes project beams of light interlacing from a certain distance ‘d’ of the board, giving even mass of light to the device at the above mentioned distance ‘d’, without points or appreciable zones of shadow. The boards are equipped with interlocking sections on both edges which are used as a guide for centering for the side connection of successive boards, as in a jigsaw puzzle, and the formation of a lighting panel having a larger surface.

Abstract translation: 该装置包括容纳大量与印刷电路的轨道电连接的LED的板，其布置在根据等边三角形分布的板中并以固定距离'a'彼此分离，这些发光二极管投射光束 从板的一定距离d的光交织，在上述距离d处给设备提供均匀的光，没有点或明显的阴影区域。 这些板在两个边缘上配备有互锁部分，其用作用于连续板的侧连接的定心的引导件，如在拼图中，以及形成具有较大表面的照明面板。

公开(公告)号：US20100009178A1

公开(公告)日：2010-01-14

申请号：US12449606

申请日：2008-01-30

Applicant: Gerald Weidinger ,  Günther Weichslberger ,  Markus Leitgeb ,  Johannes Stahr

Inventor： Gerald Weidinger ,  Günther Weichslberger ,  Markus Leitgeb ,  Johannes Stahr

IPC: B32B5/00 ,  B32B43/00 ,  H05K1/00 ,  C08L83/00 ,  C08L77/00 ,  C09K3/00

CPC classification number: B32B37/26 ,  C08L91/06 ,  H05K1/183 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  Y10T156/1064 ,  Y10T156/1153 ,  Y10T156/1195 ,  Y10T428/24802 ,  Y10T428/265

Abstract: The invention relates to a nonstick material for use during removal of a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least on further, substantially planar material layer (9). According to the invention, the nonstick material (8) has a different polarity than the adjoining, substantially planar material layers (2, 9). The invention also relates to a method for removing a part (11) of a substantially planar material layer (2) which is connected in a connecting step to at least one further, substantially planar material layer (9), to a multilayer structure which consists of at least two substantially planar material layers (2, 9) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.

Abstract translation: 本发明涉及一种不粘材料，用于在移除基本平坦的材料层（2）的部分（11）时使用，所述部分（11）在连接步骤中至少在至少另外基本平坦的材料层（9）上连接。 根据本发明，不粘材料（8）具有与相邻的基本平坦的材料层（2,9）不同的极性。 本发明还涉及一种用于去除基本平坦的材料层（2）的部分（11）的方法，所述部分（11）在连接步骤中连接到至少一个其它基本平坦的材料层（9）上，所述多层结构包括 至少两个基本平坦的材料层（2,9）要互连，并且使用该材料层，特别是在多层印刷电路板中。

公开(公告)号：US20100006323A1

公开(公告)日：2010-01-14

申请号：US12585467

申请日：2009-09-16

Applicant: Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

IPC: H05K1/14

CPC classification number: H05K3/4691 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09127

Abstract: A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.

Abstract translation: 刚性柔性PCB包括至少一个刚性PCB（RPCB）和至少一个柔性PCB（FPCB）。 每个RPCB都有一个连接部分; 第一和第二部分分别从连接部分的两个侧边缘延伸并且每个具有至少一个FPCB接合侧; 以及沿着连接部分和第一和第二部分的每个接头形成的弱化结构。 每个FPCB具有对应于RPCB上的连接部分的弯曲部分; 第一和第二部分分别从弯曲部分的两个侧边缘延伸并且具有至少一个RPCB接合侧，每个RPCB接合侧对应于RPCB的第一和第二部分的FPCB接合侧。 当对弱化结构施加适当的压力时，RPCB可以容易地在弱化结构处弯曲断裂以从其中移除连接部分。

公开(公告)号：US20090283301A1

公开(公告)日：2009-11-19

申请号：US12453627

申请日：2009-05-18

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K1/142 ,  H05K3/36 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/096

Abstract: A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has a conductive pattern formed on the rigid substrate and/or the flexible substrate. The conductive pattern of the main substrate is electrically connected to the conductive pattern of the flex-rigid printed wiring board.

Abstract translation: 一种布线基板，包括具有基材的主基板和形成在基材上的导电图案，以及柔性刚性印刷布线板，其设置在主基板上，并具有彼此连接的刚性基板和柔性基板。 柔性刚性印刷线路板具有形成在刚性基板和/或柔性基板上的导电图案。 主基板的导电图形电连接到柔性刚性印刷线路板的导电图案。

公开(公告)号：US20090232925A1

公开(公告)日：2009-09-17

申请号：US12131753

申请日：2008-06-02

Applicant: Yu-Lun Lin ,  Chih-Ming Lin ,  Sung-Feng Yeh ,  Yu-Min Chen

Inventor： Yu-Lun Lin ,  Chih-Ming Lin ,  Sung-Feng Yeh ,  Yu-Min Chen

IPC: H01L21/301

CPC classification number: H05K3/4691 ,  H05K3/0044 ,  H05K3/4652 ,  H05K2201/09127 ,  H05K2203/0228 ,  Y10T83/0333 ,  Y10T83/2133 ,  Y10T83/8694

Abstract: A cutting mold for removing two opposite superfluous rigid circuit boards from a rigid-flexible circuit board. A first cutter is connected to a first moldboard. A first barricade is connected to the first moldboard. The maximum vertical distance from the first barricade to the first moldboard exceeds that from the first cutter to the first moldboard. A second moldboard is opposite the first moldboard. The first and second moldboards move with respect to each other. A second cutter is connected to the second moldboard and corresponds to the first cutter. A second barricade is connected to the second moldboard and detachably abuts the first barricade. The maximum vertical distance from the second barricade to the second moldboard exceeds that from the second cutter to the second moldboard. The first and second cutters cut the superfluous rigid circuit boards when the first and second moldboards move toward each other.

Abstract translation: 用于从刚性柔性电路板移除两个相对的多余刚性电路板的切割模具。 第一切割器连接到第一切割板。 第一个路障连接到第一个铺板。 从第一路障到第一刨花板的最大垂直距离超过从第一切割器到第一刨花板的垂直距离。 第二个刨花板与第一个刨花板相对。 第一和第二剥离板相对于彼此移动。 第二切割器连接到第二模板并对应于第一切割器。 第二路障连接到第二移动板并且可拆卸地邻接第一路障。 从第二轨道到第二模板的最大垂直距离超过从第二切割器到第二模板的垂直距离。 第一和第二切割器在第一和第二移印板朝向彼此移动时切割多余的刚性电路板。

公开(公告)号：US20090229876A1

公开(公告)日：2009-09-17

申请号：US12401141

申请日：2009-03-10

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K9/00 ,  H05K1/00 ,  H05K3/10

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A flexible wiring board includes a first flexible base material with a conductor pattern formed thereon, a second flexible base material disposed adjacent to the first flexible base material and an insulating layer covering the first flexible base material and the second flexible base material. The insulating layer exposes at least one portion of the first flexible base material. A conductor pattern is formed on the insulating layer, and a plating layer is provided connecting the conductor pattern of the first flexible base material and the conductor pattern on the insulating layer.

Abstract translation: 柔性布线板包括：形成有导体图案的第一柔性基底材料，邻近第一柔性基底材料设置的第二柔性基底材料和覆盖第一柔性基底材料和第二柔性基底材料的绝缘层。 绝缘层暴露第一柔性基材的至少一部分。 在绝缘层上形成导体图案，并且在绝缘层上连接第一柔性基底材料的导体图形和导体图案的镀层。

公开(公告)号：US07581312B2

公开(公告)日：2009-09-01

申请号：US11877585

申请日：2007-10-23

Applicant: Chih-Yi Tu ,  Cheng-Hsien Lin ,  Ming Wang

Inventor： Chih-Yi Tu ,  Cheng-Hsien Lin ,  Ming Wang

IPC: H05K3/20

CPC classification number: H05K3/4697 ,  H05K1/0393 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract translation: 制造多层FPCB的方法包括以下步骤：提供第一覆铜层压板，第二覆铜层压板和粘合剂层; 在粘合剂层上限定开口; 在所述第一覆铜层压板上限定第一狭缝; 层压第一覆铜层压板，粘合剂层和第二覆铜层压板; 限定用于在所述第一覆铜层压板和所述第二覆铜层压板之间建立电连接的通孔; 切割第一覆铜层压板，粘合剂层和第二覆铜层压板，从而形成在不同区域中具有不同层数的多层柔性印刷电路板。