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公开(公告)号:US11848315B2
公开(公告)日:2023-12-19
申请号:US17646821
申请日:2022-01-03
Applicant: ROHM CO., LTD.
Inventor: Kanako Mimori , Yusuke Nakakohara , Okimoto Kondo
CPC classification number: H01L25/167 , H01L33/62 , H05B45/40 , H05K1/181 , G01S7/4814 , G01S17/10 , H05K2201/10015 , H05K2201/10053 , H05K2201/10106
Abstract: A semiconductor light-emitting device includes: a board including a front surface, a back surface facing an opposite side of the front surface, a first wiring pattern formed on the front surface, and a second wiring pattern formed on the side of the back surface with respect to the first wiring pattern; and a light-emitting element, a switching element, and a capacitor, which are electrically connected to one another by both the first wiring pattern and the second wiring pattern. Among the light-emitting element, the switching element, and the capacitor, a first predetermined element and a second predetermined element are arranged in a first direction and the second predetermined element and a third predetermined element are arranged in a second direction. The second wiring pattern forms a second current path opposite to a direction of a first current path. The second current path overlaps the first current path.
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公开(公告)号:US11828662B2
公开(公告)日:2023-11-28
申请号:US16918780
申请日:2020-07-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Toru Shimuta
CPC classification number: G01K7/22 , G01K1/024 , G01K1/14 , H05K1/181 , H05K7/1427 , G01K2215/00 , H05K2201/10053
Abstract: A core body thermometer that includes a wiring substrate on which a power supply switch and electronic components are mounted. The power supply switch is housed so as to face a back surface of an upper exterior body in a space formed by the upper exterior body and a lower exterior body. Moreover, a lining member is formed in a thin plate shape and disposed on the back surface of the upper exterior body, and a buffer member is disposed between the wiring substrate and the lining member. The lining member has a through-hole in which the power supply switch is placed in an inner side in a thickness direction when viewed in a plan view, and has flexibility in an operation direction of the power supply switch).
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公开(公告)号:US20230380120A1
公开(公告)日:2023-11-23
申请号:US18366008
申请日:2023-08-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kunitoshi HANAOKA
IPC: H05K9/00 , H03H9/00 , H03H9/02 , H03H9/05 , H03H9/10 , H03H9/64 , H03H9/72 , H05K1/18 , H05K1/02
CPC classification number: H05K9/0022 , H03H9/0009 , H03H9/02913 , H03H9/0576 , H03H9/059 , H03H9/1085 , H03H9/6483 , H03H9/725 , H05K1/181 , H05K1/023 , H05K2201/10053 , H05K2201/10015 , H05K2201/1003 , H05K2201/1006 , H05K2201/10371
Abstract: The radio frequency module includes a mounting board, a first metal member, and a second metal member. The first metal member and the second metal member are disposed on the mounting board. The first metal member has a longitudinal direction along a first direction in plan view from a thickness direction of the mounting board. The second metal member has a longitudinal direction along a second direction in plan view from the thickness direction of the mounting board. The first or second metal member is placed between a first electronic component and a second electronic component. The first metal member has a first recessed portion. The second metal member has a through hole and a second recessed portion. The through hole passes through the second metal member in the direction intersecting with the second direction. The second recessed portion faces and is in contact with the first recessed portion.
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公开(公告)号:US20230380054A1
公开(公告)日:2023-11-23
申请号:US17990985
申请日:2022-11-21
Applicant: Chicony Electronics Co., Ltd.
Inventor: Chia-Hsin Chen
CPC classification number: H05K1/0271 , H01H13/83 , H05K2201/10113 , H05K2201/10106 , H05K2201/10053 , H01H2219/04
Abstract: A backlight module of an illuminated keyboard device includes a circuit board and a plurality of light-emitting elements. The circuit board has a top surface and a bottom surface opposite to the top surface. The top surface has a plurality of key assembling regions. Each of the key assembling regions has a stress release hole defined through the top surface and the bottom surface. The light-emitting elements are respectively disposed on the key assembling regions. Each of the light-emitting elements includes a main body and a conductive portion connected to the main body. The conductive portion is electrically connected to the circuit board, and the stress release hole is adjacent to the conductive portion of each of the light-emitting elements.
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公开(公告)号:US20230344460A1
公开(公告)日:2023-10-26
申请号:US18342743
申请日:2023-06-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Masanari MIURA , Kiyoshi AIKAWA , Hiroyuki NAGAMORI , Takanori UEJIMA , Yuji TAKEMATSU , Takahiro YAMASHITA , Ryo WAKABAYASHI , Yoshihiro YOSHIMURA , Takashi HIROSE
IPC: H04B1/40 , H05K1/18 , H05K9/00 , H01L25/16 , H01L23/552
CPC classification number: H04B1/40 , H05K1/181 , H05K9/0022 , H01L25/16 , H01L23/552 , H05K2201/1006 , H05K2201/10015 , H05K2201/1003 , H05K2201/10053 , H05K2201/10371
Abstract: A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.
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公开(公告)号:US20230319982A1
公开(公告)日:2023-10-05
申请号:US18190462
申请日:2023-03-27
Applicant: Qorvo US, Inc.
Inventor: Jan-Willem Zweers , Richard Perkins , Bror Peterson
IPC: H05K1/02
CPC classification number: H05K1/0243 , H05K2201/10053 , H05K2201/10098
Abstract: In some embodiments, a printed circuit board is disclosed. The printed circuit board includes a substrate, a conductive plane, and at least one switch. The conductive plane includes an edge enabled void construction (EEVC) along a geometric perimeter of the conductive plane, the EEVC having an EEVC void that defines an EEVC perimeter that extends into the conductive plane.
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公开(公告)号:US11774387B2
公开(公告)日:2023-10-03
申请号:US17688620
申请日:2022-03-07
Applicant: Nabtesco Corporation
Inventor: Masaki Harada , Atsushi Koike , Kazuhiko Sakurai
CPC classification number: G01N27/07 , G01N33/2858 , H05K1/0277 , H05K1/18 , H01F7/02 , H05K2201/10053 , H05K2201/10151
Abstract: A wiring structure includes a wiring such as a flexible printed wiring board, a permanent magnet, and a relay piece. The wiring has a conductive portion. The permanent magnet has electrical conductivity. The relay piece is formed of a conductive metal and connected to the conductive portion of the wiring. The relay piece has the permanent magnet fixed thereto by magnetic attraction.
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公开(公告)号:US11754096B2
公开(公告)日:2023-09-12
申请号:US16774637
申请日:2020-01-28
Applicant: Robert Bosch GmbH
Inventor: Benjamin Nemes , Carl Dissoubray , Christoph Keyl , Gergely Laszlo Hegedus-Fuchs , Jan-Peter Reibert , Matthias Beck , Peter Pozsega , Steffen Knapper , Matthias Lang , Liebhart Zaiser , Thomas Haas
IPC: F15B13/04 , H01R13/405 , H05K7/14 , H01F27/24 , H01F27/28 , H05K1/18 , F15B13/043 , H01F7/08 , H01F27/30 , F16K37/00 , F16K31/06 , F16K31/02
CPC classification number: F15B13/0402 , F15B13/0433 , F16K37/0041 , H01F7/08 , H01F27/24 , H01F27/28 , H01F27/306 , H01R13/405 , H05K1/181 , H05K7/1427 , F15B2013/0409 , F15B2211/30 , F15B2211/329 , F16K31/02 , F16K31/0613 , F16K37/0033 , H05K2201/10053 , H05K2201/10151 , Y10T137/5987 , Y10T137/8242
Abstract: A pilot device for a hydraulic directional valve includes a displacement sensor, a pilot valve, an actuating device, a coil assembly, and a circuit board. The displacement sensor has a sensor axis and the pilot valve has a valve axis. The valve axis and the sensor axis are arranged substantially parallel to one another so as to lie in a reference plane. The actuating device and the coil assembly are arranged adjacent to one another. The circuit board is arranged parallel to the reference plane. In each case, to establish an electrical contact, the coil assembly, the actuating device, and an electrical plug connection are either soldered directly to the circuit board or are in breakable electrical contact with a respectively associated, rigid contact assembly. The contact assembly is soldered directly to the circuit board.
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公开(公告)号:US20230275537A1
公开(公告)日:2023-08-31
申请号:US18173516
申请日:2023-02-23
Applicant: Dometic Sweden AB
Inventor: Kyle Cameron , Taylor Townsend , Sean O'Connor
CPC classification number: H02S10/20 , H02J7/0013 , H02J7/35 , H02M3/1582 , H05K7/1427 , H05K1/18 , H02S10/10 , B60R16/033 , H05K2201/10053
Abstract: Present embodiments relate to a power controller for charging at least two battery banks. More specifically, the present embodiments relate to a power controller which provides for at least two input sources and may charge the at least two battery banks simultaneously or independently.
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公开(公告)号:US11689082B2
公开(公告)日:2023-06-27
申请号:US17885333
申请日:2022-08-10
Applicant: Black & Decker Inc.
Inventor: Madhur M. Purohit , Joshua M. Lewis , Marcell E. Coates , Michael D. Grove , Victor A. Dorado
IPC: H02K11/215 , B25F5/00 , H02K9/22 , H02K11/33 , B25F5/02 , H02K5/08 , H02K5/22 , H02K7/14 , H05K1/02 , H05K1/11 , H05K1/18 , H05K5/00 , H05K7/20 , H05K3/28 , H05K5/02 , H05K5/06 , H05K7/14 , H02K29/08
CPC classification number: H02K11/215 , B25F5/008 , B25F5/02 , H02K5/08 , H02K5/22 , H02K5/225 , H02K7/145 , H02K9/22 , H02K9/227 , H02K11/33 , H05K1/0203 , H05K1/115 , H05K1/181 , H05K3/284 , H05K5/0073 , H05K5/0247 , H05K5/061 , H05K7/1427 , H05K7/209 , H05K7/2039 , H02K9/223 , H02K29/08 , H02K2203/03 , H02K2211/03 , H05K5/0086 , H05K2201/066 , H05K2201/09018 , H05K2201/09036 , H05K2201/10053 , H05K2201/10151 , H05K2201/10166 , H05K2201/10522
Abstract: A power tool including an electric motor is provided. The tool includes a substantially disc-shaped printed circuit board (PCB), power switches mounted on the PCB; magnetic sensors mounted on the PCB facing the motor; a heat sink in thermal communication with the power switches disposed between the PCB and the electric motor; and a molded casing structurally securing the heat sink relative to the PCB. The molded casing includes a center opening, at least one first opening provided at a first radial distance from the center opening arranged to receive the magnetic sensors therein, and at least one second opening provided at a second radial distance from the center opening arranged to securely receive the heat sink therein.
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