公开(公告)号：US20180084646A1

公开(公告)日：2018-03-22

申请号：US15708519

申请日：2017-09-19

Applicant: Black & Decker Inc.

Inventor： Madhur M. PUROHIT ,  Joshua M. LEWIS ,  Marcell E. COATES ,  Michael D. GROVE ,  Victor A. DORADO

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  H05K7/14 ,  H05K5/02 ,  H05K5/06 ,  H05K3/28 ,  H02K7/14 ,  H02K5/22 ,  H02K11/33 ,  H02K11/215

CPC classification number: H02K9/22 ,  B25F5/008 ,  B25F5/02 ,  H02K5/08 ,  H02K5/22 ,  H02K5/225 ,  H02K7/145 ,  H02K11/215 ,  H02K11/33 ,  H02K29/08 ,  H02K2203/03 ,  H02K2211/03 ,  H05K1/0203 ,  H05K1/115 ,  H05K1/181 ,  H05K3/284 ,  H05K5/0073 ,  H05K5/0086 ,  H05K5/0247 ,  H05K5/061 ,  H05K7/1427 ,  H05K7/2039 ,  H05K7/209 ,  H05K2201/066 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: An electronic module is provided for a power tool having an electric motor. The electronic module includes a printed circuit board (PCB) being substantially disc-shaped; power switches mounted on the PCB forming an inverter bridge circuit for driving the electric motor; a controller mounted on the PCB and configured to control a switching operation of the power switches; positional sensors mounted on the PCB substantially equidistantly from a center of the PCB within the control portion and in communication with the controller to provide positional signals related to a rotational position of the electric motor to the controller; and a module housing arranged to receive the PCB therein. The module housing includes a planar portion in parallel to the PCB and openings disposed in the planar portion angularly around a center of the module housing to receive the positional sensors therein.

公开(公告)号：US20180080610A1

公开(公告)日：2018-03-22

申请号：US15822574

申请日：2017-11-27

Applicant: Molex, LLC

Inventor： Daniel B. McGowan ,  Michael C. Picini

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H05K1/18 ,  H01L33/64 ,  H05K3/00 ,  H05K1/05 ,  H05K3/12 ,  H01L33/62 ,  H05K1/11

CPC classification number: F21K9/20 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/05 ,  H05K1/117 ,  H05K1/183 ,  H05K3/0026 ,  H05K3/12 ,  H05K2201/09018 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

公开(公告)号：US20170344082A1

公开(公告)日：2017-11-30

申请号：US15163386

申请日：2016-05-24

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kenneth Charles Boman ,  Kanth Kurumaddali

IPC: G06F1/20 ,  H05K1/02 ,  H05K5/00 ,  H05K5/02

CPC classification number: G06F1/20 ,  H05K1/021 ,  H05K1/0272 ,  H05K1/0278 ,  H05K2201/064 ,  H05K2201/09018

Abstract: A curved printed circuit board (PCB) of a computing device is described herein. The computing device includes a housing and a PCB positioned in or on the housing. The computing device also includes a plurality of connectors physically connecting the PCB to a surface of the housing or another surface, such that at least a portion of the PCB is bent.

公开(公告)号：US09713256B2

公开(公告)日：2017-07-18

申请号：US14656837

申请日：2015-03-13

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Man Bok Jeon

IPC: H05K1/00 ,  H05K1/14 ,  H05K1/02 ,  G02F1/1345 ,  H01L27/32

CPC classification number: H05K1/147 ,  G02F1/13452 ,  G09G2300/0408 ,  H01L27/3276 ,  H01L2251/5338 ,  H05K1/0281 ,  H05K2201/09018 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: A curved display device includes a semiconductor chip package including a base film, a plurality of driving chips on the base film, and an input wire unit and an output wire unit connected to the driving chips, a printed circuit board (PCB) connected to the input wire unit of the semiconductor chip package, and a display panel including a display unit and a pad unit connected to the output wire unit of the semiconductor chip package, wherein the display panel, the semiconductor chip package, and the PCB are bendable in a first direction, and the driving chips of the of the semiconductor chip package are separated from each other in the first direction.

公开(公告)号：US20170094785A1

公开(公告)日：2017-03-30

申请号：US15155668

申请日：2016-05-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Li Sun ,  Wei Cui ,  Xiaohu Wang

IPC: H05K1/02 ,  H01L51/52

CPC classification number: H05K1/0281 ,  H01L51/5237 ,  H01L51/524 ,  H01L51/5253 ,  H01L2251/5338 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A support back plate and a curved display device are disclosed. The support back plate including a first end and a second end in opposition to each other, wherein the support back plate is bent into a shape of an arc face; and a thickness in the middle region of the support back plate is greater than that at the first end and the second end. The above-mentioned support back plate is used in a curved display device to solve the problem of a usual curved display device with more thickness and weight.

公开(公告)号：US20160295664A1

公开(公告)日：2016-10-06

申请号：US15022570

申请日：2014-09-19

Applicant: OSRAM GMBH ,  SITECO BELEUCHTUNGSTECHNIK GMBH

Inventor： Matthias Loster ,  Gertrud Kraeuter ,  Clemens Meyer

IPC: H05B37/02 ,  G01J1/44 ,  F21V23/00 ,  H05B33/08 ,  F21V23/04

CPC classification number: H05B37/0227 ,  F21V23/005 ,  F21V23/0464 ,  F21V23/0471 ,  F21Y2101/00 ,  F21Y2107/10 ,  F21Y2115/10 ,  G01J1/44 ,  H03K17/94 ,  H05B33/0806 ,  H05B33/0854 ,  H05B37/0218 ,  H05K1/181 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: Various embodiments may relate to a sensor unit having a plurality of sensor elements, the detection data of which are used for controlling an opto-electronic light source. According to various embodiments, the plurality of sensor elements are arranged on a substrate body, which is provided in the form of a molded circuit carrier made of a plastic material, and detect different regions and/or sizes.

Abstract translation: 各种实施例可以涉及具有多个传感器元件的传感器单元，其检测数据用于控制光电光源。 根据各种实施例，多个传感器元件布置在基板主体上，该基板体以由塑料材料制成的模制电路载体的形式提供，并且检测不同的区域和/或尺寸。

公开(公告)号：US20160219708A1

公开(公告)日：2016-07-28

申请号：US15000432

申请日：2016-01-19

Applicant: Koito Manufacturing Co., Ltd.

Inventor： Yoshiaki Aiso ,  Koji Uchino ,  Hiromi Nakamura ,  Takayuki Otsubo

IPC: H05K1/18 ,  B60Q1/34 ,  H05K1/02 ,  H05K3/02 ,  H05K1/11

CPC classification number: H05K3/105 ,  B60Q1/2696 ,  B60Q1/34 ,  F21S43/13 ,  F21S43/14 ,  F21S43/195 ,  F21S43/31 ,  F21S45/47 ,  H05K1/0206 ,  H05K1/0209 ,  H05K3/0014 ,  H05K3/182 ,  H05K2201/0236 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/107

Abstract: Provided is a light source unit including a base unit formed on a front surface thereof with a first circuit pattern by irradiating laser light to a resin molded article, and a light emitting element mounted on the base unit and electrically connected to the first circuit pattern. The base unit includes a mounting surface portion directed in a prescribed direction such that the light emitting element is mounted thereon, and a sidewall surface portion connected to the mounting surface portion in a plane intersection state, and the sidewall surface portion is formed as an inclined surface intersecting with the mounting surface portion at an obtuse angle.

Abstract translation: 提供了一种光源单元，其包括：通过向树脂模制品照射激光而在其前表面上形成有第一电路图案的基座单元和安装在基座单元上并电连接到第一电路图案的发光元件。 基座单元包括以规定方向指向安装在其上的发光元件的安装表面部分和在平面交叉状态下连接到安装表面部分的侧壁表面部分，并且侧壁表面部分形成为倾斜 表面以钝角与安装表面部分相交。

公开(公告)号：US20160095206A1

公开(公告)日：2016-03-31

申请号：US14851795

申请日：2015-09-11

Applicant: AU OPTRONICS CORPORATION

Inventor： Ming-Sheng Lai ,  Pei-Ling Chiang

IPC: H05K1/02 ,  H05K5/00

CPC classification number: H05K1/0271 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A display module includes a display panel which includes a substrate and a periphery circuit. The substrate has a display area and a strip region beside the display area. The substrate is bent with respect to an axis to form a curved shape. The maximum value of the curvature of the display area in a direction perpendicular to the axis is a first curvature. The periphery circuit is disposed on the strip region. The strip region in a direction perpendicular to the axis has a second curvature smaller than the first curvature.

Abstract translation: 显示模块包括显示面板，显示面板包括基板和外围电路。 基板在显示区域旁边具有显示区域和条带区域。 基板相对于轴线弯曲以形成弯曲的形状。 显示区域在与轴垂直的方向上的曲率的最大值为第一曲率。 外围电路设置在带状区域上。 条带区域在垂直于轴线的方向上具有小于第一曲率的第二曲率。

公开(公告)号：US20160073507A1

公开(公告)日：2016-03-10

申请号：US14939761

申请日：2015-11-12

Applicant: United States of America as Represented by the Secretary of the Army

Inventor： Bruce V. Hughes

IPC: H05K3/10

CPC classification number: H05K3/107 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/4682 ,  H05K2201/056 ,  H05K2201/09018 ,  H05K2201/10583 ,  Y10T29/49155

Abstract: A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.

Abstract translation: 非平面印刷电路板具有内表面和外表面。 在内表面和外表面之间是导电和介电材料层。 被动和有源的电气部件嵌入在内部和外部表面。 中空区域由非平面电路板的内表面限定。 非平面印刷电路板在具有非平面形状的心轴上制造，例如圆柱体或球体，以便形成中空弯曲的非平面结构。

公开(公告)号：US20160029492A1

公开(公告)日：2016-01-28

申请号：US14771512

申请日：2014-01-31

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Nozomu HIKINO ,  Hiroyuki TAKEBE

IPC: H05K3/00 ,  H04M1/02 ,  H05K1/03 ,  H05K1/11 ,  B29C45/14 ,  B29C45/16

CPC classification number: H05K3/0014 ,  B29C45/14 ,  B29C45/16 ,  B29C45/1671 ,  B29C2045/0079 ,  B29C2045/1687 ,  B29K2055/02 ,  B29K2069/00 ,  B29L2009/00 ,  B29L2031/3456 ,  B29L2031/3481 ,  H01Q1/243 ,  H04M1/0202 ,  H04M1/0249 ,  H05K1/0284 ,  H05K1/032 ,  H05K1/119 ,  H05K1/165 ,  H05K3/36 ,  H05K2201/09018 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2201/10265 ,  H05K2201/2036 ,  H05K2203/1322 ,  H05K2203/1476

Abstract: A first resin layer (1) has: a covered region which is covered by a second resin layer (2) and an exposed region (1a); a contact part (1b) which is provided in the exposed region (1a); and a bend part (1c) which is provided between (a) a boundary between the covered region and the exposed region (1a) and (b) the contact part (1b).

Abstract translation: 第一树脂层（1）具有被第二树脂层（2）和暴露区域（1a）覆盖的被覆区域。 设置在所述露出区域（1a）中的接触部（1b） 以及设置在（a）被覆盖区域与露出区域（1a）之间的边界和（b）接触部分（1b）之间的弯曲部分（1c）。