公开(公告)号：US09601448B2

公开(公告)日：2017-03-21

申请号：US15094759

申请日：2016-04-08

Applicant: Waseda University

Inventor： Kohei Tatsumi

IPC: H01L23/48 ,  H01L21/44 ,  H01L23/00 ,  H01L21/52 ,  H01L23/498

CPC classification number: H01L24/10 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/75 ,  H01L24/76 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L2224/0345 ,  H01L2224/03464 ,  H01L2224/04 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05173 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05673 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/13012 ,  H01L2224/13017 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13411 ,  H01L2224/136 ,  H01L2224/13611 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/24225 ,  H01L2224/24245 ,  H01L2224/245 ,  H01L2224/2499 ,  H01L2224/29012 ,  H01L2224/29017 ,  H01L2224/29147 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/3716 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40991 ,  H01L2224/40996 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48873 ,  H01L2224/48991 ,  H01L2224/48996 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/73273 ,  H01L2224/73277 ,  H01L2224/75754 ,  H01L2224/76754 ,  H01L2224/81002 ,  H01L2224/81205 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81473 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2224/81901 ,  H01L2224/8192 ,  H01L2224/82002 ,  H01L2224/82101 ,  H01L2224/82399 ,  H01L2224/83002 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/83464 ,  H01L2224/83473 ,  H01L2224/83815 ,  H01L2224/8384 ,  H01L2224/83901 ,  H01L2224/8392 ,  H01L2224/8492 ,  H01L2224/85205 ,  H01L2224/85447 ,  H01L2224/8592 ,  H01L2224/9201 ,  H01L2924/00011 ,  H01L2924/3656 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2924/01074 ,  H01L2924/01023 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/01045 ,  H01L2224/18 ,  H01L2224/24 ,  H01L2224/82 ,  H01L2224/83205

Abstract: An electrode connection structure includes: a first electrode of an electrical circuit; and a second electrode of the electrical circuit that is electrically connected to the first electrode. The first and second electrodes are oppositely disposed in direct or indirect contact with each other. A plated lamination is substantially uniformly formed by plating process from a surface of a contact region and opposed surfaces of the first and second electrodes. A void near the surface of the contact region is filled by formation of the plated lamination. Portions of the plated lamination formed from the opposed surfaces of the first and second electrodes in a region other than the contact region are not joined together.

公开(公告)号：US20170029049A1

公开(公告)日：2017-02-02

申请号：US15290368

申请日：2016-10-11

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD. ,  WASEDA UNIVERSITY

Inventor： Atsuo TAKANISHI ,  Kenji HASHIMOTO ,  Kazuhiro URYU ,  Tomotaka TERAMACHI ,  Takashi MATSUZAWA ,  Ayanori KOIZUMI ,  Shinya HAMAMOTO ,  Takuya OTANI ,  Tatsuhiro KISHI ,  Tomohiro TAMI ,  Hiroyuki YAMADA ,  Shigetoshi SHIOTANI ,  Yusuke KINOUCHI ,  Yasuo FUJISHIMA

IPC: B62D57/032 ,  B25J9/08

CPC classification number: B62D57/032 ,  B25J9/08 ,  Y10S901/01 ,  Y10S901/02 ,  Y10S901/28 ,  Y10S901/30

Abstract: A mobile robot 1 having a plurality of kinds of moving forms includes a body unit 11 having a front face and a back face, four limb units 12 having a plurality of limb-side drive shafts, and front end tools 13 provided on a front end side of the limb units 12. A base end side of the limb unit 12 is connected to the body unit 11. The four limb units 12 are the same units. The body unit 11 and the four limb units 12 are movable by switching a front face side and a back face side so that a moving operation of the front face side and a moving operation of the back face side are symmetrical across the center of a thickness direction of the body unit 11.

Abstract translation: 具有多种移动形式的移动式机器人1包括具有前表面和后表面的主体单元11，具有多个肢侧驱动轴的四个肢体单元12和设置在前端的前端工具13 肢体单元12的基端侧连接到主体单元11.四个肢体单元12是相同的单元。 主体单元11和四个肢体单元12可以通过切换正面侧和背面侧而移动，使得正面侧的移动操作和背面侧的移动操作在厚度的中心对称 身体单元11的方向。

公开(公告)号：US20160230285A1

公开(公告)日：2016-08-11

申请号：US14912698

申请日：2014-07-31

Applicant: YAMAMOTO-MS CO., LTD. ,  WASEDA UNIVERSITY

Inventor： Wataru Yamamoto ,  Kimiko Koiwa ,  Takayuki HOMMA ,  Masahiro YANAGISAWA ,  Mikiko Saito ,  Tomoyuki YAMAMOTO

IPC: C23C18/16 ,  C25D17/00 ,  C25D17/10 ,  C25D21/12

CPC classification number: C23C18/1619 ,  C23C18/163 ,  C23C18/1683 ,  C25D17/001 ,  C25D17/002 ,  C25D17/004 ,  C25D17/008 ,  C25D17/06 ,  C25D17/10 ,  C25D17/12 ,  C25D21/12

Abstract: A plating apparatus (1) includes: a holding member (2) that holds a plated object (W); a spacer (4) that is stacked on the holding member (2) via a first seal member (3) in an annular shape surrounding the plated object (W), and has a through portion (45) from which the plated object (W) is exposed and which stores a plating solution; and an anode member (6) that is stacked on the spacer (4) via a second seal member (3) in an annular shape surrounding the through portion (45), and has an anode layer (62) arranged to face the plated object (W) which is exposed from the through portion (45).

Abstract translation: 电镀装置（1）包括：保持电镀对象（W）的保持构件（2）; 经由第一密封构件（3）以包围电镀对象（W）的环状形状堆叠在保持构件（2）上的间隔物（4），并且具有贯通部（45），电镀对象 ）暴露并存储电镀液; 以及阳极部件（6），其经由第二密封部件（3）以围绕所述贯通部（45）的环状形状堆叠在所述间隔件（4）上，并且具有布置成面向所述镀覆对象物的阳极层（62） （W）从所述贯通部（45）露出。

公开(公告)号：US20160107964A1

公开(公告)日：2016-04-21

申请号：US14889834

申请日：2014-04-30

Applicant: WASEDA UNIVERSITY ,  JX NIPPON OIL & ENERGY CORPORATION ,  MITSUBISHI CHEMICAL CORPORATION ,  HITACHI ZOSEN CORPORATION ,  CHIYODA CORPORATION

Inventor： Masahiko MATSUKATA ,  Kenichi KAWAZUISHI ,  Kenichi MIMURA

IPC: C07C29/82 ,  B01D61/36

CPC classification number: C07C29/82 ,  B01D3/145 ,  B01D53/229 ,  B01D61/364 ,  B01D61/366 ,  B01D2257/70 ,  C07C29/76 ,  C07C29/80 ,  Y02P20/126 ,  Y02P20/57 ,  Y02P20/572 ,  C07C31/04 ,  C07C31/08 ,  C07C31/10 ,  C07C31/12

Abstract: A method and a device for condensing a water-soluble organic matter, which can collect a highly concentrated water-soluble organic matter, save energy, and reduce cost of the device by reducing a membrane area.According to the present invention, the permeability ratio of a vapor-permeation separation membrane disposed at least immediately before a final outlet on a non-permeation side in the separation membrane device is lower than those of the other vapor-permeation separation membranes while a hybrid process combining distillation by the distillation column with membrane separation by the separation membrane devices including a plurality of vapor-permeation separation membranes is used and energy saving performance is maintained. Therefore, a highly concentrated and condensed component of a water-soluble organic matter is obtained. In addition, it is possible to reduce a membrane area of the vapor-permeation separation membranes in the whole separation membrane devices and to provide a technology leading to cost reduction.

Abstract translation: 用于冷凝水溶性有机物的方法和装置，其可以收集高浓度的水溶性有机物质，通过减少膜面积来节省能量并降低装置的成本。 根据本发明，至少配置在分离膜装置的非渗透侧的最终出口之前的透气分离膜的渗透率比其他透湿分离膜的渗透率低，而混合 使用通过蒸馏塔进行蒸馏和通过包括多个蒸气渗透分离膜的分离膜装置进行膜分离的方法，并且保持节能性能。 因此，得到水溶性有机物的高浓缩浓缩成分。 此外，可以减少整个分离膜装置中的蒸汽渗透分离膜的膜面积，并提供导致成本降低的技术。

公开(公告)号：US20150276889A1

公开(公告)日：2015-10-01

申请号：US14671200

申请日：2015-03-27

Applicant: WASEDA UNIVERSITY

Inventor： Tetsuya OSAKA ,  Toshiyuki MOMMA ,  Tokihiko YOKOSHIMA ,  Daikichi MUKOYAMA ,  Hiroki NARA

IPC: G01R31/36

CPC classification number: G01R31/389 ,  G01R31/367

Abstract: An electrochemical analysis apparatus includes a power controller, a Fourier transform unit, and a calculating unit. The power controller generates a rectangular-wave signal, a first frequency F and a duty ratio D, and applies the signal to an electrochemical cell. The Fourier transform unit performs Fourier transform on first data obtained by sampling a response signal of the cell to calculate a first frequency characteristic including a component of a second frequency integer times as high as the first frequency. The Fourier transform unit performs Fourier transform on second data, a sampling start time of which is (1/F)·D (seconds) different from the first data from which the first frequency characteristic is calculated, to calculate a second frequency characteristic including a component of the second frequency. The calculating unit calculates an impedance characteristic of the cell based on the first frequency characteristic and the second frequency characteristic.

Abstract translation: 电化学分析装置包括功率控制器，傅立叶变换单元和计算单元。 功率控制器产生矩形波信号，第一频率F和占空比D，并将该信号施加到电化学电池。 傅立叶变换单元对通过对单元的响应信号进行采样而获得的第一数据执行傅立叶变换，以计算包括第一频率的第二频率的分量的整数倍的第一频率特性。 傅立叶变换单元对与第一频率特性的第一数据不同的采样开始时间为（1 / F）·D（秒）的第二数据执行付里叶变换，以计算第二频率特性，其包括 第二频率的分量。 计算单元基于第一频率特性和第二频率特性来计算小区的阻抗特性。

公开(公告)号：US09013023B2

公开(公告)日：2015-04-21

申请号：US14114490

申请日：2012-12-18

Applicant: Panasonic Corporation ,  Waseda University

Inventor： Michio Suzuka ,  Takashi Sekiguchi ,  Naoki Hayashi ,  Hiroyuki Nishide ,  Kenichi Oyaizu ,  Fumiaki Kato

IPC: H01L31/06 ,  H01G9/20 ,  H01L51/50

CPC classification number: H01G9/2018 ,  H01G9/2031 ,  H01G9/2059 ,  H01L51/5064 ,  H01L51/508 ,  Y02E10/542

Abstract: A photoelectric element includes a first electrode; and a second electrode positioned so as to face the first electrode; and a semiconductor disposed on a face of the first electrode, the face being positioned so as to face the second electrode; and a photosensitizer carried on the semiconductor; and a first charge-transport layer interposed between the first electrode and the second electrode; and a second charge-transport layer interposed between the first charge-transport layer and the second electrode. The first charge-transport layer and the second charge-transport layer contain different oxidation-reduction materials. The oxidation-reduction material in the first charge-transport layer has an oxidation-reduction potential higher than an oxidation-reduction potential of the oxidation-reduction material in the second charge-transport layer.

Abstract translation: 光电元件包括​​第一电极; 和与第一电极相对定位的第二电极; 以及设置在所述第一电极的表面上的半导体，所述面被定位成与所述第二电极相对; 和在半导体上承载的光敏剂; 以及插入在所述第一电极和所述第二电极之间的第一电荷传输层; 以及插入在第一电荷输送层和第二电极之间的第二电荷输送层。 第一电荷输送层和第二电荷输送层含有不同的氧化还原材料。 第一电荷输送层中的氧化还原材料具有比第二电荷输送层中的氧化还原材料的氧化还原电位高的氧化还原电位。

公开(公告)号：US20140327018A1

公开(公告)日：2014-11-06

申请号：US14364555

申请日：2013-02-22

Applicant: NIPPON MICROMETAL CORPORATION ,  WASEDA UNIVERSITY

Inventor： Kohei Tatsumi ,  Takashi Yamada ,  Daizo Oda

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/03444 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/04042 ,  H01L2224/05007 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/05184 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05684 ,  H01L2224/32245 ,  H01L2224/43 ,  H01L2224/4312 ,  H01L2224/43125 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45005 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45611 ,  H01L2224/45618 ,  H01L2224/45624 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45666 ,  H01L2224/45669 ,  H01L2224/45671 ,  H01L2224/45672 ,  H01L2224/45684 ,  H01L2224/45686 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48818 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48866 ,  H01L2224/48869 ,  H01L2224/48871 ,  H01L2224/48872 ,  H01L2224/48884 ,  H01L2224/73265 ,  H01L2224/78313 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/20103 ,  H01L2924/351 ,  H01L2924/00015 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/01202 ,  H01L2924/20107 ,  H01L2924/20106 ,  H01L2224/29099 ,  H01L2924/01023 ,  H01L2924/01074 ,  H01L2924/01049

Abstract: It is an object of the present invention to provide a power semiconductor device, which is capable of being operable regardless of thermal stress generation, reducing a heat generation from wire, securing the reliability of bonding portion when the device is used for dealing with a large amount current and/or under a high temperature atmosphere, a method of manufacturing the device and a bonding wire. In a power semiconductor device in which a metal electrode (die electrode 3) on a power semiconductor die 2 and another metal electrode (connection electrode 4) are connected by metal wire 5 using wedge bonding connection, the metal wire is Ag or Ag alloy wire of which diameter is greater than 50 μm and not greater than 2 mm and the die 3 has thereon one or more metal and/or alloy layers, each of the layer(s) being 50 Å or more in thickness and a metal for the layer is selected from Ni, Cr, Cu, Pd, V, Ti, Pt, Zn, Ag, Au, W and Al.

Abstract translation: 本发明的目的是提供一种功率半导体器件，该功率半导体器件能够在不受热应力产生的情况下运行，从而减少线材的发热，确保当器件用于处理大的时候的接合部分的可靠性 量电流和/或在高温气氛下，制造该装置的方法和接合线。 在功率半导体器件中，功率半导体管芯2上的金属电极（管芯电极3）和另一个金属电极（连接电极4）通过金属线5使用楔形接合连接，金属线是Ag或Ag合金线 其直径大于50μm且不大于2mm，并且模具3上具有一个或多个金属和/或合金层，每个层的厚度均为50或更大，并且该层的金属 选自Ni，Cr，Cu，Pd，V，Ti，Pt，Zn，Ag，Au，W和Al。

公开(公告)号：US20140048786A1

公开(公告)日：2014-02-20

申请号：US14008025

申请日：2012-12-10

Applicant: WASEDA UNIVERSITY ,  PANASONIC CORPORATION

Inventor： Michio Suzuka ,  Takashi Sekiguchi ,  Hiroyuki Nishide ,  Kenichi Oyaizu ,  Fumiaki Kato

IPC: H01L51/52 ,  H01B1/00 ,  H01L51/44

CPC classification number: H01L51/5209 ,  H01B1/00 ,  H01B1/20 ,  H01G9/2009 ,  H01G9/2022 ,  H01G9/2031 ,  H01G9/2059 ,  H01L31/022425 ,  H01L51/004 ,  H01L51/0043 ,  H01L51/0059 ,  H01L51/441 ,  H01L51/442 ,  H01L2251/306 ,  Y02E10/542 ,  Y02E10/549

Abstract: The present invention provides an electrode composite that has a reaction interface with a large area and can constitute a photoelectric element having high electron transport properties between the reaction interface and the electrode. The electrode composite of the present invention includes a first electrode and a conductive particle layer stacked on the first electrode. The conductive particle layer includes conductive particles containing acicular particles. The conductive particle layer has a three-dimensional porous network structure that is formed by the interconnection of the conductive particles. The three-dimensional network structure is joined to the first electrode. The conductive particle layer contains pores having a pore size of 50 nm or more in a total volume of 50% or more based on the volume of all pores in the conductive particle layer.

Abstract translation: 本发明提供一种电极复合体，其具有大面积的反应界面，并且可以构成在反应界面和电极之间具有高电子传输性能的光电元件。 本发明的电极复合体包括层叠在第一电极上的第一电极和导电性粒子层。 导电性粒子层包含含有针状粒子的导电性粒子。 导电性粒子层具有通过导电性粒子的互连形成的三维多孔质网状结构体。 三维网络结构与第一电极连接。 基于导电性粒子层的全部孔的体积，导电性粒子层的总体积为50％以上，孔径为50nm以上的孔。

公开(公告)号：US20040033180A1

公开(公告)日：2004-02-19

申请号：US10641086

申请日：2003-08-15

Applicant: WASEDA UNIVERSITY, BIO NANOTEC RESEARCH INSTITUTE INC.

Inventor： Masahiko Matsukata ,  Shuji Tsuruoka ,  Shiro Ikeda

IPC: B01J008/00 ,  B01J035/00

CPC classification number: B01D67/0051 ,  B01D71/027 ,  B01D71/028 ,  B01D2323/08 ,  B01D2323/10 ,  B01J19/22 ,  B01J29/035 ,  B01J29/06 ,  B01J29/08 ,  B01J29/40 ,  B01J35/065 ,  B01J37/0238 ,  B01J2219/1941 ,  B01J2229/64 ,  C04B35/18 ,  C04B2235/3201 ,  C04B2235/3222 ,  C04B2235/3427 ,  C04B2235/3463 ,  C04B2235/94

Abstract: A method for producing a silicon oxide-based ceramic membrane on a surface of a porous substrate from a silica source and an aqueous alkaline solution (or an aqueous alkaline solution of an alumina source) by a gas phase reaction comprises the step of heating the silica source and the aqueous alkaline solution (or the aqueous alkaline solution of an alumina source) in an airtight vessel without mixing them.

Abstract translation: 通过气相反应从二氧化硅源和碱性水溶液（或氧化铝源的碱性水溶液）在多孔质基材的表面上制造氧化硅系陶瓷膜的方法包括：将二氧化硅 来源和碱性水溶液（或氧化铝源的碱性水溶液）在气密容器中而不混合。

公开(公告)号：US20030008075A1

公开(公告)日：2003-01-09

申请号：US10154812

申请日：2002-05-28

Applicant: WASEDA UNIVERSITY, NEC CORPORATION

Inventor： Kazuyoshi Ueno ,  Tetsuya Osaka ,  Nao Takano

IPC: B05D005/12 ,  B05D001/36 ,  B05D003/10

CPC classification number: H01L21/76843 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1879 ,  C23C18/36 ,  C23C18/50 ,  H01L21/288 ,  H01L21/76807 ,  H01L21/76814 ,  H01L21/76826 ,  H01L21/76831 ,  H01L21/76849 ,  H01L21/76874

Abstract: A method of manufacturing ULSI wiring in which wiring layers are separately formed via a diffusion prevention layer with an insulating interlayer portion made of SiO2. The method comprises the steps of treating, with a silane compound, an SiO2 surface on which the insulating interlayer portion is to be formed, performing catalyzation with an aqueous solution containing a palladium compound, forming the diffusion prevention layer by electroless plating, and then forming the wiring layer on this diffusion prevention layer. Furthermore, a capping layer is formed on the wiring layer by electroless plating. In consequence, the diffusion prevention layer having good adhesive properties can all be formed through a simple process by wet processes, and further, the wiring layer can directly be formed on this diffusion prevention layer by the wet process. In addition, the capping layer can directly be formed on this wiring layer by the electroless plating.