Method of manufacturing microneedle structures using soft lithography and photolithography
    152.
    发明申请
    Method of manufacturing microneedle structures using soft lithography and photolithography 有权
    使用软光刻和光刻制造微针结构的方法

    公开(公告)号:US20040146611A1

    公开(公告)日:2004-07-29

    申请号:US10727124

    申请日:2003-12-03

    Abstract: A method for manufacturing microneedle structures is disclosed using soft lithography and photolithography, in which micromold structures made of a photoresist material or PDMS are created. The micromold manufacturing occurs quite quickly, using inexpensive materials and processes. Once the molds are available, using moldable materials such as polymers, microneedle arrays can be molded or embossed in relatively fast procedures. In some cases a sacrificial layer is provided between the forming micromold and its substrate layer, for ease of separation. The microneedles themselves can be solid projections, hollow nullmicrotubes,null or shallow nullmicrocups.null Electrodes can be formed on the microneedle arrays, including individual electrodes per hollow microtube.

    Abstract translation: 公开了使用软光刻和光刻技术制造微针结构的方法,其中制造由光致抗蚀剂材料或PDMS制成的微型结构。 使用廉价的材料和工艺,微型制造相当快速地发生。 一旦模具可用,使用可模塑材料如聚合物,微针阵列可以以相对较快的程序模制或压花。 在一些情况下,为了易于分离,在成形微胶体与其基底层之间提供牺牲层。 微针本身可以是固体突起,中空的“微管”或浅的“微型杯”。 电极可以形成在微针阵列上,包括每个中空微管的单个电极。

    Patterned structure reproduction using nonsticking mold
    157.
    发明申请
    Patterned structure reproduction using nonsticking mold 审中-公开
    图案化结构复制使用非标准模具

    公开(公告)号:US20030071016A1

    公开(公告)日:2003-04-17

    申请号:US10267953

    申请日:2002-10-08

    Abstract: Novel nonstick molds and methods of forming and using such molds are provided. The molds are formed of a nonstick material such as those selected from the group consisting of fluoropolymers, fluorinated siloxane polymers, silicones, and mixtures thereof. The nonstick mold is imprinted with a negative image of a master mold, where the master mold is designed to have a topography pattern corresponding to that desired on the surface of a microelectronic substrate. The nonstick mold is then used to transfer the pattern or image to a flowable film on the substrate surface. This film is subsequently cured or hardened, resulting in the desired pattern ready for further processing.

    Abstract translation: 提供了新型不粘模具以及形成和使用这种模具的方法。 模具由不粘材料形成,例如选自含氟聚合物,氟化硅氧烷聚合物,硅酮及其混合物的那些。 不粘模具印有主模具的负像,其中主模具被设计成具有对应于微电子衬底表面上期望的形状图案。 然后使用不粘模具将图案或图像转印到基底表面上的可流动的薄膜上。 随后该膜被固化或硬化,导致所需的图案准备进一步加工。

    Methods for forming recessed patterns in a multilayered ceramic package and devices produced by such methods
    159.
    发明申请
    Methods for forming recessed patterns in a multilayered ceramic package and devices produced by such methods 审中-公开
    在多层陶瓷封装中形成凹陷图案的方法和通过这种方法制造的器件

    公开(公告)号:US20020174936A1

    公开(公告)日:2002-11-28

    申请号:US09865925

    申请日:2001-05-25

    Applicant: Motorola, Inc.

    Abstract: A cast-on-resist (COR) method of forming a ceramic layer (114) with a recessed pattern is provided according to a preferred exemplary embodiment of the present invention. The COR method is comprised of depositing a resist (102) on a substrate (104) and selectively exposing the resist (102) to a radiation source such that a first portion (106) of the resist (102) having a positive image of the pattern is soluble in a solvent and a second portion (108) of the resist (102) having a negative image of the pattern is insoluble in the solvent. The COR method is further comprised of immersing the resist (102) in the solvent to remove the first portion (106) to form a casting substrate (110) having the negative image of the pattern, applying ceramic slurry (112) on the casting substrate (110), curing the ceramic slurry (112) on the casting substrate (110) and removing the ceramic layer (114) from the casting substrate (110) after the curing.

    Abstract translation: 根据本发明的优选示例性实施例提供了形成具有凹陷图案的陶瓷层(114)的耐蚀刻(COR)方法。 COR方法包括在衬底(104)上沉积抗蚀剂(102)并选择性地将抗蚀剂(102)暴露于辐射源,使得抗蚀剂(102)的第一部分(106)具有正像 图案可溶于溶剂,并且具有图案的负像的抗蚀剂(102)的第二部分(108)不溶于溶剂。 COR方法还包括将抗蚀剂(102)浸入溶剂中以去除第一部分(106)以形成具有图案的负像的流延基底(110),将陶瓷浆料(112)施加到流延基底 (110),固化所述铸塑基材(110)上的陶瓷浆料(112)并在固化后从所述铸塑基材(110)除去所述陶瓷层(114)。

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