公开(公告)号：US09788124B2

公开(公告)日：2017-10-10

申请号：US15244347

申请日：2016-08-23

Applicant: Robert Bosch GmbH

Inventor： Christoph Schelling ,  Stefan Singer ,  Jochen Zoellin

IPC: H01L29/84 ,  H04R19/00 ,  H04R19/04 ,  B81B7/00

CPC classification number: H04R19/005 ,  B81B7/0041 ,  B81B2201/0257 ,  H01L29/84 ,  H04R19/04 ,  H04R2201/003

Abstract: Measures are provided for increasing the resistance to compression of a component having a micromechanical microphone pattern. In particular, the robustness of the microphone pattern to highly dynamic pressure fluctuations is to be increased, without the microphone sensitivity, i.e. the microphone performance, being impaired. The microphone pattern of such a component is implemented in a layer construction on a semiconductor substrate and includes at least one acoustically active diaphragm, which spans a sound hole on the substrate backside, and a stationary acoustically penetrable counterelement having through hole openings, which is situated above/below the diaphragm in the layer construction. At least one outflow channel is developed which makes possible a rapid pressure equalization between the two sides of the diaphragm. In addition, at least one controllable closing element is provided, with which the at least one outflow channel is optionally able to be opened or closed.

公开(公告)号：US20170284825A1

公开(公告)日：2017-10-05

申请号：US15628057

申请日：2017-06-20

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： John Paul LESSO ,  Emmanuel Philippe Christian HARDY ,  James Thomas DEAS ,  Toru IDO

IPC: H04R3/06 ,  G01D5/24 ,  G01D5/244 ,  G01P15/125 ,  H03M1/06 ,  H03M3/00 ,  H04R19/00 ,  H04R19/04 ,  G01D3/02 ,  G01P15/08 ,  H03M1/12 ,  H04R29/00

CPC classification number: H04R3/06 ,  G01D3/02 ,  G01D5/24 ,  G01D5/24476 ,  G01P15/125 ,  G01P2015/0865 ,  H03M1/0609 ,  H03M1/12 ,  H03M3/352 ,  H03M3/458 ,  H04R19/005 ,  H04R19/04 ,  H04R29/004 ,  H04R2201/003 ,  H04R2499/11

Abstract: This application relates to circuitry for processing sense signals generated by MEMS capacitive transducers for compensating for distortion in such sense signals. The circuitry has a signal path between an input (204) for receiving the sense signal and an output (205) for outputting an output signal based on said sense signal. Compensation circuitry (206, 207) is configured to monitor the signal at a first point along the signal path and generate a correction signal (Scorr); and modify the signal at at least a second point along said signal path based on said correction signal. The correction signal is generated as a function of the value of the signal at the first point along the signal path so as to introduce compensation components into the output signal that compensate for distortion components in the sense signal. The first point in the signal path may be before or after the second point in the signal path. The monitoring may be performed in an analogue or a digital part of the signal path and in either case the modification may be applied in an analogue or a digital part of the signal path.

公开(公告)号：US20170260040A1

公开(公告)日：2017-09-14

申请号：US15066741

申请日：2016-03-10

Applicant: Infineon Technologies AG

Inventor： Arnaud Walther ,  Alfons Dehe ,  Johann Strasser ,  Gerhard Metzger-Brueckl

IPC: B81B3/00 ,  H04R19/04

CPC classification number: B81B3/0086 ,  B81B2201/0257 ,  B81B2203/0127 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003

Abstract: In accordance with an embodiment, a MEMS device includes a first membrane element, a second membrane element spaced apart from the first membrane element, a low pressure region between the first and second membrane elements, the low pressure region having a pressure less than an ambient pressure, and a counter electrode structure comprising a conductive layer, which is at least partially arranged in the low pressure region or extends in the low pressure region. The conductive layer includes a segmentation providing an electrical isolation between a first portion of the conductive layer and a second portion of the conductive layer.

公开(公告)号：US09762202B2

公开(公告)日：2017-09-12

申请号：US14177571

申请日：2014-02-11

Applicant: Analog Devices, Inc.

Inventor： Florian Thalmayr ,  Jan H. Kuypers ,  Klaus Juergen Schoepf

IPC: H04R31/00 ,  H03H9/02 ,  H03H9/24 ,  H01L41/253 ,  H01L41/27 ,  G01P15/09 ,  G01P15/097 ,  H01F3/04 ,  H01L41/04

CPC classification number: H03H9/02102 ,  G01P15/0922 ,  G01P15/097 ,  H01F3/04 ,  H01L41/04 ,  H01L41/253 ,  H01L41/27 ,  H03H9/02228 ,  H03H9/02244 ,  H03H9/02275 ,  H03H9/02535 ,  H03H9/02574 ,  H03H9/02834 ,  H03H9/02984 ,  H03H9/02992 ,  H03H9/2405 ,  H03H2009/241 ,  H04R31/00 ,  H04R2201/003 ,  H04R2217/00 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908

Abstract: Methods are described for constructing a mechanical resonating structure by applying an active layer on a surface of a compensating structure. The compensating structure comprises one or more materials having an adaptive resistance to deform that reduces a variance in a resonating frequency of the mechanical resonating structure, wherein at least the active layer and the compensating structure form a mechanical resonating structure having a plurality of layers of materials A thickness of each of the plurality of layers of materials results in a plurality of thickness ratios therebetween.

公开(公告)号：US20170257687A1

公开(公告)日：2017-09-07

申请号：US15600148

申请日：2017-05-19

Applicant: ANALOG DEVICES, INC.

Inventor： Oliver J. Kierse ,  Christian Lillelund

IPC: H04R1/02 ,  B81B7/00

CPC classification number: H04R1/02 ,  B81B7/0061 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/092 ,  B81C2201/0185 ,  H01L23/053 ,  H01L29/84 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/13062 ,  H01L2924/1461 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.

公开(公告)号：US09756429B2

公开(公告)日：2017-09-05

申请号：US15470107

申请日：2017-03-27

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： Colin Robert Jenkins ,  Tsjerk Hans Hoekstra ,  Euan James Boyd

IPC: H01L21/00 ,  H04R19/00 ,  H04R1/22 ,  H01L41/09 ,  B81B3/00 ,  B81C1/00

CPC classification number: H04R19/005 ,  B81B3/0021 ,  B81B3/0075 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  H01L41/09 ,  H01L41/0926 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1461 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R1/222 ,  H04R23/006 ,  H04R2201/003 ,  Y10T29/49005 ,  H01L2924/00014

Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalization of the air volumes above and below the membrane.

公开(公告)号：US20170251318A1

公开(公告)日：2017-08-31

申请号：US15516053

申请日：2015-10-06

Applicant: THE ROYAL INSTITUTION FOR THE ADVANCEMENT OF LEARNING/MCGILL UNIVERSITY

Inventor： Peter GASKELL ,  Robert-Eric GASKELL ,  Thomas SZKOPEK ,  Jung Wook HONG

IPC: H04R31/00 ,  H04R7/04 ,  H04R7/14 ,  H01B1/04

CPC classification number: H04R31/003 ,  H01B1/04 ,  H04R7/04 ,  H04R7/14 ,  H04R9/048 ,  H04R2201/003 ,  H04R2307/023

Abstract: Materials used in acoustic transducer membranes need very specific qualities that in any real system require many tradeoffs to be made. Graphene and graphene related materials are a newly discovered class of materials with some exceptional properties that offer the potential for significant contributions to the performance of many acoustical transduction systems. Accordingly the inventors have established graphene oxide based transducers as the basis of ribbon microphones and diaphragm loudspeakers using low cost manufacturing and processing techniques.

公开(公告)号：US20170251303A1

公开(公告)日：2017-08-31

申请号：US15439480

申请日：2017-02-22

Applicant: Cirrus Logic International Semiconductor Ltd.

Inventor： John Paul LESSO ,  John Laurence MELANSON

IPC: H04R3/06 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R3/06 ,  H04R3/00 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2217/03 ,  H04R2410/00 ,  H04R2420/09 ,  H04R2430/03 ,  H04R2499/11

Abstract: This application relates to methods and apparatus for digital microphones. Disclosed is a digital microphone apparatus (300) for outputting a digital output signal (DATA) at a sample rate defined by a received clock signal (CLK). The apparatus includes a band splitter (302) configured to receive a microphone signal (SMD) indicative of an output of a microphone transducer and split said microphone signal into first signal path (SP1) for frequencies in a first band and a second signal path (SP2) for frequencies in a second band, the frequencies of the second band being higher than the frequencies in the first band. A modulation block (304) is configured to operate on the second signal path to apply a selective gain modulation to signals in the second signal path.

公开(公告)号：US09743205B2

公开(公告)日：2017-08-22

申请号：US15339267

申请日：2016-10-31

Applicant: Robert Bosch GmbH

Inventor： Philip Sean Stetson

IPC: H04R29/00 ,  H04R19/00

CPC classification number: H04R29/005 ,  H04R19/005 ,  H04R29/004 ,  H04R2201/003 ,  H04R2410/05

Abstract: A method is provided for testing a MEMS microphone. The MEMS microphone includes a pressure sensor positioned within a housing and a pressure input port to direct acoustic pressure from outside the housing towards the pressure sensor. An acoustic pressure source provides acoustic pressure to the MEMS microphone. A reference microphone is positioned proximal to the MEMS microphone. An output signal of the MEMS microphone and an output signal of the reference microphone are compared. A common signal component is removed from the output signal of the MEMS microphone and the output signal of the MEMS microphone is analyzed for noise due to the construction of the device and for a signal-to-noise ratio of the device. Based on the noise signal and the signal-to-noise ratio, the MEMS microphone is rejected or accepted.

公开(公告)号：US09743196B2

公开(公告)日：2017-08-22

申请号：US15059338

申请日：2016-03-03

Applicant: Infineon Technologies AG

Inventor： Michael Kropfitsch

IPC: H04R3/00 ,  H04R19/04 ,  H02M3/07

CPC classification number: H04R19/04 ,  H02M3/07 ,  H02M3/073 ,  H04R2201/003

Abstract: In accordance with an embodiment, a method of operating a charge pump includes providing a first programmable voltage to a plurality of clock generators having outputs coupled to first nodes of corresponding groups of charge pump capacitors, and selecting a second node of one capacitor from one of the corresponding groups of charge pump capacitors. The clock generators produce a plurality of clock signals having amplitudes proportional to the first programmable voltage.