公开(公告)号：US07727818B2

公开(公告)日：2010-06-01

申请号：US11972633

申请日：2008-01-11

Applicant: Chueh-An Hsieh ,  Li-Cheng Tai

Inventor： Chueh-An Hsieh ,  Li-Cheng Tai

IPC: H01L21/00

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82001 ,  H01L2224/82047 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/181 ,  H01L2924/18162 ,  H05K3/0067 ,  H05K2201/0108 ,  H05K2201/10674 ,  H05K2203/0108 ,  H05K2203/0152 ,  H05K2203/0191 ,  H05K2203/1469 ,  Y10T29/49146 ,  H01L2224/82 ,  H01L2924/00

Abstract: A first dielectric layer is formed on a mold having a surface and protruding components and covers the protruding components. At least one electronic component having an active surface, a back surface, and contacts formed on the active surface is disposed on the first dielectric layer. The active surface is faced to the first dielectric layer, and the contacts are corresponding to the protruding components. A second dielectric layer is formed on the first dielectric layer and a carrier is disposed on the back surface of the electronic component. Openings located corresponding to the contacts are further formed within the first dielectric layer by the protruding components in an imprinting step, such that when the mold is removed, the contacts are exposed from the openings.

Abstract translation: 在具有表面和突出部件的模具上形成第一介电层并覆盖突出部件。 至少一个具有活性表面的电子部件，背面和形成在有源表面上的触点设置在第一电介质层上。 活性表面面向第一介电层，并且触点对应于突出的部件。 在第一电介质层上形成第二电介质层，并且载体设置在电子部件的背面上。 通过在压印步骤中的突出部件在第一电介质层内进一步形成与触点相对应的开口，使得当模具被移除时，触头从开口露出。

公开(公告)号：US20100129036A1

公开(公告)日：2010-05-27

申请号：US12622894

申请日：2009-11-20

Applicant: Masayuki HODONO

Inventor： Masayuki HODONO

IPC: G02B6/36 ,  B32B37/12

CPC classification number: B32B38/1841 ,  B32B2309/02 ,  B32B2309/04 ,  B32B2309/105 ,  B32B2310/0831 ,  B32B2367/00 ,  B32B2457/20 ,  G02B6/42 ,  G02B6/4214 ,  G02B6/4224 ,  G02B6/43 ,  H05K1/0269 ,  H05K1/0274 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/09918 ,  H05K2203/063 ,  H05K2203/1394 ,  H05K2203/166 ,  H05K2203/167

Abstract: An opto-electric hybrid board which includes an optical waveguide portion 2, an electric circuit board 1, and optical elements mounted on this electric circuit board 1. In the optical waveguide portion 2, a linear core 22 for an optical path and protruding alignment marks 24 for positioning of the optical elements and each having a surface formed with a recessed portion 24a for identification are formed on a surface of a translucent under cladding layer 21. The above-mentioned core 22 is covered with an over cladding layer 23. The above-mentioned alignment marks 24 are covered with a translucent resin film 25 so that the recessed portion 24a of each of the above-mentioned alignment marks 24 is formed as a hollow portion A filled with air.

Abstract translation: 一种光电混合板，其包括光波导部分2，电路板1和安装在该电路板1上的光学元件。在光波导部分2中，用于光路的线性芯22和突出的对准标记 在透明的下敷层21的表面上形成有用于光学元件的定位的24，并且每个具有形成有用于识别的凹部24a的表面。上述芯22被上敷层23覆盖。上述 上述对准标记24被半透明树脂膜25覆盖，使得每个上述对准标记24的凹部24a形成为填充有空气的中空部分A.

公开(公告)号：US20100078663A1

公开(公告)日：2010-04-01

申请号：US12239516

申请日：2008-09-26

Applicant: Wei Shi ,  Alex Shaikevitch

Inventor： Wei Shi ,  Alex Shaikevitch

IPC: H01L33/00 ,  H01L21/00

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2224/49175 ,  H05K1/0274 ,  H05K3/28 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A substrate for an LED assembly can have a plurality of cups formed therein. At least one cup can be formed within another cup. The cups can be co-axial with respect to one another, for example. A machined surface of the substrate can enhance reflectivity of the LED assembly. A transparent and/or non-global solder mask can enhance reflectivity of the LED assembly. A transparent ring can enhance reflectivity of the LED assembly. By enhancing reflectivity of the LED assembly, the brightness of the LED assembly can be increased. Brighter LED assemblies can be used in applications such as flashlights, displays, and general illumination.

Abstract translation: 用于LED组件的基板可以具有形成在其中的多个杯。 至少一杯可以在另一杯内形成。 例如，杯可以相对于彼此共轴。 衬底的加工表面可以增强LED组件的反射率。 透明和/或非全局焊接掩模可以增强LED组件的反射率。 透明环可以增强LED组件的反射率。 通过提高LED组件的反射率，可以提高LED组件的亮度。 较亮的LED组件可用于手电筒，显示屏和一般照明等应用中。

公开(公告)号：US20100018756A1

公开(公告)日：2010-01-28

申请号：US12518302

申请日：2007-12-03

Applicant: Katsuya Shimeno ,  Takeshi Ito ,  Tomohiro Aoyama ,  Akira Nishimoto ,  Shoko Nagata ,  Tomoharu Kurita

Inventor： Katsuya Shimeno ,  Takeshi Ito ,  Tomohiro Aoyama ,  Akira Nishimoto ,  Shoko Nagata ,  Tomoharu Kurita

IPC: H05K1/00 ,  B32B15/08 ,  B32B15/04 ,  C08G73/10

CPC classification number: H05K1/0346 ,  B32B5/147 ,  B32B7/12 ,  B32B15/08 ,  B32B15/088 ,  B32B15/18 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/281 ,  B32B27/34 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/412 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2457/08 ,  B32B2457/20 ,  C08G73/14 ,  C09D179/08 ,  H05K1/0393 ,  H05K2201/0108 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/065 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: [Object] To provide a flexible metal-clad laminate having excellent heat resistance, flexibility and low thermal expansion together with sufficient colorless transparency and a flexible printed circuit board using the same.[Constitution] A colorless and transparent flexible metal-clad laminate where metal foil is directly laminated or is laminated via an adhesive layer on at least one side of the polyamideimide resin layer in which cyclohexane tricarboxylic acid anhydride is a main monomer, characterized in that said polyamideimide resin has an inherent viscosity of 0.8 dl/g or more and 2.5 dl/g or less.

Abstract translation: 本发明提供具有优异的耐热性，柔软性和低热膨胀性的柔性金属覆层层叠体以及足够的无色透明性和使用其的柔性印刷电路板。 [结构]在环己烷三羧酸酐为主要单体的聚酰胺酰亚胺树脂层的至少一面上通过粘合剂层直接层叠或层压金属箔的无色透明柔性金属箔层压体，其特征在于，所述 聚酰胺酰亚胺树脂的特性粘度为0.8dl / g以上且2.5dl / g以下。

公开(公告)号：US20090314525A1

公开(公告)日：2009-12-24

申请号：US11915990

申请日：2006-05-31

Applicant: Hitoshi Kajino ,  Takeo Taguchi ,  Kanji Sato ,  Masahito Ishii ,  Tatsuo Kataoka

Inventor： Hitoshi Kajino ,  Takeo Taguchi ,  Kanji Sato ,  Masahito Ishii ,  Tatsuo Kataoka

IPC: H05K1/03 ,  H01K3/22 ,  H01R43/16 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K3/107 ,  H05K1/0265 ,  H05K3/0014 ,  H05K3/0055 ,  H05K3/007 ,  H05K3/045 ,  H05K3/06 ,  H05K3/244 ,  H05K3/421 ,  H05K3/465 ,  H05K3/4682 ,  H05K2201/0108 ,  H05K2201/0317 ,  H05K2201/0352 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/09727 ,  H05K2203/0108 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0723 ,  H05K2203/073 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49204

Abstract: A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process. Further, described is a process for producing a wiring board, comprising bringing a precision mold having a mold pattern on a surface of a mold base into contact with a surface of a metal thin film formed on an organic insulating base, pressing the mold to form a depression having a shape corresponding to the mold pattern of the precision mold in the organic insulating base, thereafter forming a metal plating layer having a thickness larger than the depth of the depression to fill the plating metal in the depression, and then polishing the metal plating layer until the organic insulating base is exposed, to form a wiring pattern, and a wiring pattern produced by this process.

Abstract translation: 提供了一种制造布线板的方法，包括允许包括支撑基底和在支撑基底的一个表面上形成为突出形状的模具图案的布线板形成模具，其中模具图案的截面宽度 在支撑基侧，在模具图案的同一部分的前端侧的截面宽度大于其，以渗透到固化树脂层中以转移模具图案，固化固化树脂层，从模具中释放层压体 ，沉积导电金属，并抛光沉积的金属层以形成凹陷的布线图案，以及通过该工艺生产的布线板。 此外，描述了一种制造布线板的方法，包括将具有模具图案的精密模具在模具基体的表面上与形成在有机绝缘基底上的金属薄膜的表面接触，压制模具以形成 具有与有机绝缘基体中的精密模具的模具图案对应的形状的凹部，然后形成厚度大于凹陷深度的金属镀层，以填充凹陷中的电镀金属，然后研磨金属 直到有机绝缘基底露出，形成布线图案，以及通过该工艺制造的布线图案。

公开(公告)号：US20090309202A1

公开(公告)日：2009-12-17

申请号：US12483528

申请日：2009-06-12

Applicant: Shin-Ping Hsu ,  Kan-Jung Chia

Inventor： Shin-Ping Hsu ,  Kan-Jung Chia

IPC: H01L23/08 ,  H01L21/58

CPC classification number: H05K1/185 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L31/0203 ,  H01L2224/45144 ,  H01L2224/48235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/281 ,  H05K2201/0108 ,  H05K2201/10121 ,  H05K2203/1147 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A packaging substrate having a semiconductor chip embedded and a fabrication method thereof are provided. The method includes forming a semiconductor chip in a through cavity of a core board and exposing a photosensitive portion of the semiconductor chip from the through cavity; sequentially forming a first dielectric layer and a first circuit layer on the core board, the first circuit layer being electrically connected to the electrode pads of the semiconductor chip; forming a light-permeable window on the first dielectric layer to expose the photosensitive portion of the semiconductor chip and adhering a light-permeable layer onto the light-permeable window, thereby permitting light to penetrate through the light-permeable layer to reach the photosensitive portion. Therefore, when fabricated with the method, the packaging substrate dispenses with conductive wires and dams and thus can be downsized.

Abstract translation: 提供具有嵌入式半导体芯片的封装基板及其制造方法。 该方法包括在芯板的通孔中形成半导体芯片，并将半导体芯片的感光部分从通孔暴露出来; 在芯板上依次形成第一电介质层和第一电路层，第一电路层电连接到半导体芯片的电极焊盘; 在第一电介质层上形成透光窗，露出半导体芯片的感光部分，并将透光层粘附到透光窗上，从而允许光穿过透光层到达光敏部分 。 因此，当使用该方法制造时，封装基板不需要导线和堤坝，因此可以减小尺寸。

公开(公告)号：US20090304324A1

公开(公告)日：2009-12-10

申请号：US12232899

申请日：2008-09-25

Applicant: Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho ,  Sang-Hoon Kim

Inventor： Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho ,  Sang-Hoon Kim

IPC: G02B6/12 ,  G02B6/02

CPC classification number: G02B6/43 ,  G02B6/4224 ,  H05K1/0269 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/09781 ,  H05K2201/09918

Abstract: An optical waveguide, an optical printed circuit board equipped with the optical waveguide, and methods of manufacturing the optical waveguide and the optical printed circuit board are disclosed. The optical waveguide can include: a first cladding layer; a core formed on the first cladding layer; an alignment pattern, having a predefined positional relationship to the core, formed on the first cladding layer; a target mark formed on the alignment pattern to indicate a position of the alignment pattern; and a second cladding layer formed on the first cladding layer to cover the core, the alignment pattern, and the target mark. In such an optical waveguide, circuit patterns, etc., formed over the second cladding layer may be precisely and efficiently aligned with the core.

Abstract translation: 公开了一种光波导，配备有光波导的光学印刷电路板以及制造光波导和光学印刷电路板的方法。 光波导可以包括：第一包层; 形成在第一包层上的芯; 形成在所述第一包层上的与所述芯部具有预定位置关系的对准图案; 形成在所述对准图案上以指示所述对准图案的位置的目标标记; 以及形成在所述第一包覆层上以覆盖所述芯，所述对准图案和所述目标标记的第二包层。 在这种光波导中，形成在第二覆层上的电路图案等可以精确且有效地与芯对准。

公开(公告)号：US20090269075A1

公开(公告)日：2009-10-29

申请号：US12108898

申请日：2008-04-24

Applicant: Tom Sheau Tung Wong ,  Adrianus Van Haasteren ,  Tze Wei Lim

Inventor： Tom Sheau Tung Wong ,  Adrianus Van Haasteren ,  Tze Wei Lim

IPC: H04B10/00

CPC classification number: G02B6/4246 ,  G02B6/4204 ,  G02B6/423 ,  H05K1/0274 ,  H05K1/18 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/10121

Abstract: An electro-optical assembly (EA) is provided in which the transmitter and receiver components are integrated together on a single circuit board, which is encapsulated in a single molded EA package. Integrating the transmitter and receiver components on a single circuit board allows the size and complexity of the EA to be greatly reduced as compared to the traditional TO-can and FOT architectures. A standard semiconductor inline automation system and process may be used to manufacture the EA packages so that they may be mass produced with improved throughput, yield and quality as compared to the method currently used to manufacture and assemble the known EA used in the traditional TO-can and FOT architectures.

Abstract translation: 提供了一种电光学组件（EA），其中发射器和接收器部件在单个电路板上集成在一起，其被封装在单个模制的EA封装中。 与传统的TO-can和FOT架构相比，将发射器和接收器组件集成在单个电路板上可以大大减少EA的尺寸和复杂性。 可以使用标准半导体在线自动化系统和方法来制造EA封装，使得它们可以与目前用于制造和组装传统TO-中使用的已知EA的方法相比，可以以改进的生产量，产量和质量批量生产， 可以和FOT架构。

公开(公告)号：US07604377B2

公开(公告)日：2009-10-20

申请号：US11641879

申请日：2006-12-20

Applicant: Sam Yu ,  Dalong Cheng

Inventor： Sam Yu ,  Dalong Cheng

IPC: F21S13/14

CPC classification number: H05K1/0274 ,  F21S4/24 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/10106 ,  H01L2924/01047 ,  H01L2924/00 ,  H01L2924/01006 ,  H01L2924/0002 ,  H01L2224/45099

Abstract: A light-emitting diode (LED) lighting apparatus includes a transparent flexible tape with a first transparent pattern and a second transparent pattern, the first transparent pattern being insulated from the second transparent pattern. A plurality of light-emitting diodes is electrically connected with the first transparent pattern. The LED lighting apparatus can also form the first transparent pattern and the second transparent pattern on two sides of the transparent flexible tape, or, furthermore, to form the first transparent pattern and the second transparent pattern stack to generate a multi-story LED lighting apparatus. Such a plane of emitting diode is applied to various display, furniture decoration and lighting.

Abstract translation: 发光二极管（LED）照明装置包括具有第一透明图案和第二透明图案的透明柔性带，第一透明图案与第二透明图案绝缘。 多个发光二极管与第一透明图案电连接。 LED照明装置还可以在透明柔性带的两侧上形成第一透明图案和第二透明图案，或者还形成第一透明图案和第二透明图案叠层，以产生多层LED照明装置 。 这种发光二极管应用于各种显示器，家具装饰和照明。

公开(公告)号：US20090242506A1

公开(公告)日：2009-10-01

申请号：US12457183

申请日：2009-06-03

Applicant: Kei Nakamura ,  Hitoshi Ishizaka

Inventor： Kei Nakamura ,  Hitoshi Ishizaka

IPC: H05K3/06

CPC classification number: H05K1/0269 ,  H01L21/4846 ,  H01L23/4985 ,  H01L23/544 ,  H01L2223/54473 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/056 ,  H05K3/303 ,  H05K2201/0108 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00

Abstract: A wired circuit board is provided having a high-reliability conductive pattern formed thereon and mounting an electronic component thereon with high accuracy, and a method is provided for manufacturing the wired circuit board and mounting the electronic component thereon. An insulating layer including a mounting portion is formed on a metal supporting layer having a specular gloss of 150 to 500% at an incidence angle of 45°. A conductive pattern is formed on the insulating layer. By a reflection-type optical sensor, a defective shape of the conductive pattern is inspected. Then, an opening is formed by etching the portion of the metal supporting layer which is overlapping the mounting portion such that the mounting portion of the insulating layer exposed by etching has a haze value of 20 to 50%, whereby a TAB tape carrier is obtained. Thereafter, an electronic component is aligned with the mounting portion by a reflection-type optical sensor such that the electronic component is mounted on the mounting portion.