Abstract:
Embodiments of the present invention relate to a backlight module, a display device and a method for manufacturing the display device. The backlight module includes: a backlight module body and a conductive light-shielding adhesive for bonding the backlight module body and a display panel, the backlight module body is provided with a connecting wire for electrically connecting to the display panel circuit board arranged on the display panel, the display panel circuit board is provided with a ground terminal. According to the present invention, static electricity on the display panel may flow to the ground terminal through the conductive light-shielding adhesive, the backlight module body and the display panel circuit board, by providing the conductive light-shielding adhesive and the connecting wire on the backlight module, such that the effects of increasing the static electricity protection capability to the backlight module and the life of the display panel are achieved.
Abstract:
A display apparatus includes a printed circuit board (PCB). A power management integrated circuit (PMIC) is mounted on the PCB and is configured to generate first to fourth gate clock signals and first to fourth inversion gate clock signals. A phase of the first gate clock signal partially overlaps a phase of the second to fourth gate clock signal. Each of the first to fourth inversion gate clock signals has a phase opposite to that of a respective one of the first to fourth gate clock signals. A gate driver generates a plurality of gate signals based on the first to fourth gate clock signals and the first to fourth inversion gate clock signals and applies the plurality of gate signals to a plurality of gate lines. A display panel is connected to the plurality of gate lines.
Abstract:
A conductive nanowire film based on a high aspect-ratio metal is disclosed. The nanowire film is produced by inducing metal reduction in a concentrated surfactant solution containing metal precursor ions, a surfactant and a reducing agent. The metal nanostructures demonstrate utility in a great variety of applications.
Abstract:
A stacked body including an organic film stacked on and in contact with an inorganic substrate, a wiring pattern, a first resin layer, a light-emitting element layer, and a second resin layer is prepared. The inorganic substrate is detached from the organic film. The stacked body from which the inorganic substrate is detached, an anisotropic conductive layer containing conductive particles having a diameter larger than the thickness of the organic film, and a wiring terminal of a flexible wiring board are disposed on top one another. The stacked body, the anisotropic conductive layer, and the flexible wiring board disposed are thermocompression bonded to cause the conductive particles to enter the organic film, and the wiring pattern and the wiring terminal are electrically connected by means of the conductive particles.
Abstract:
A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.
Abstract:
A conductive ink path on a peripheral portion of one surface of a substrate is provided. The conductive ink path comprises a body portion located along an edge of the peripheral portion of the substrate; and at least one extension portion protruded in a direction toward the edge of the substrate, wherein the extension portion includes at least one first segment extended in a first direction and at least two second segments neighboring on the first segment, the first segment includes a connector portion for receiving an electrical signal from the outside, and the first segment is located between the second segments in order to disperse ink in the first segment to the second segments during a manufacturing process.
Abstract:
A bezel structure for a display device includes a first resin layer capable of being cured by ultraviolet radiation, an ink layer including a non-volatile solvent disposed on the first resin layer, a second resin layer disposed in the ink layer, and an upper structure disposed on the ink layer. The second resin layer prevents an uncured portion of the first resin layer from permeating into a cavity in the ink layer.
Abstract:
A encapsulating structure of a display panel includes a substrate, a frit layer disposed around a periphery of the substrate, and a touch cover lens mounted on the substrate. A metal mesh is mounted in the touch cover lens for receiving a touch control signal. A plurality of touch wires is disposed between the frit layer and the substrate and is electrically connected to the metal mesh. A method for encapsulating a display panel includes producing a plurality of touch wires on a substrate and electrically connecting the touch wires to a flexible circuit board on a side of the substrate. A glass frit is applied on the touch wires and covers the touch wires. A touch cover lens is disposed on the substrate and includes a metal mesh. The touch cover lens is bonded to the substrate by the glass frit.
Abstract:
This invention provides an electro-optical module with reduced noise in driving voltage. The invention can include a power supply substrate that is arranged separately from the flexible substrate having a driver, so that the noise of the driving voltage supplied from the power supply substrate is reduced.
Abstract:
A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side.