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161.
公开(公告)号:US11835106B2
公开(公告)日:2023-12-05
申请号:US16772406
申请日:2018-11-15
Applicant: ASML Netherlands B.V.
Inventor: Derk Ten Hoopen , Francois-Xavier Debiesme , Eric Pierre-Yves Vennat
CPC classification number: F16F9/306 , F16F9/3207 , G03F7/70808
Abstract: The invention relates a method for manufacturing a damper device including a first part and a second part, said method comprising the following steps: a) providing a damping material in a space in between the first part and the second part, such that the damping material is in a compressed state in the space; and b) heating the device to a predetermined temperature in order to adhere the damping material to the first part and the second part.
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公开(公告)号:US20230386696A1
公开(公告)日:2023-11-30
申请号:US18326935
申请日:2023-05-31
Applicant: ASML Netherlands B.V.
CPC classification number: G21K5/04 , H01J37/3007 , G21K1/02 , H01J37/3177 , H01J37/16 , H01J37/12 , H01J2237/0216 , H01J2237/0262 , H01J2237/1215 , H01J2237/002 , H01J2237/032 , H01J2237/30472 , H01J2237/16 , H01J2237/1825 , H01J2237/0213 , H01J2237/1207 , H01J2237/024
Abstract: The invention relates to charged particle beam generator comprising a charged particle source for generating a charged particle beam, a collimator system comprising a collimator structure with a plurality of collimator electrodes for collimating the charged particle beam, a beam source vacuum chamber comprising the charged particle source, and a generator vacuum chamber comprising the collimator structure and the beam source vacuum chamber within a vacuum, wherein the collimator system is positioned outside the beam source vacuum chamber. Each of the beam source vacuum chamber and the generator vacuum chamber may be provided with a vacuum pump.
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163.
公开(公告)号:US11828585B2
公开(公告)日:2023-11-28
申请号:US17692974
申请日:2022-03-11
Applicant: ASML Netherlands B.V.
Inventor: Henricus Petrus Maria Pellemans , Arie Jeffrey Den Boef
CPC classification number: G01B11/24 , G03F7/7085 , G03F7/70191 , G03F7/70633
Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.
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公开(公告)号:US11828344B2
公开(公告)日:2023-11-28
申请号:US17633000
申请日:2020-07-09
Applicant: ASML Netherlands B.V.
Inventor: Jeroen Johan Maarten Van De Wijdeven , Johannes Petrus Martinus Bernardus Vermeulen , Jeroen Pieter Starreveld , Stan Henricus Van Der Meulen
CPC classification number: F16F15/022 , F16F13/005 , G03F7/709 , G03F7/70833 , F16F2222/08
Abstract: The invention provides a support with first and second end portions. The second end portion is on the side opposite to the first end portion in a longitudinal direction of the support. A coil spring is arranged between the first and second end portions. The coil spring comprises a first spiral member that extends between the first and second end portions in a circumferential direction of the support, and a second spiral member that extends between the first and second end portions in a circumferential direction of the support. The first and second spiral members extend in the longitudinal direction around a longitudinal axis of the support, wherein the first spiral member of the coil spring and the second spiral member of the coil spring are moveable relative to each other, and wherein the support further comprises a damper device that is attached to the first spiral member.
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公开(公告)号:USRE49732E1
公开(公告)日:2023-11-21
申请号:US16427228
申请日:2019-05-30
Applicant: ASML Netherlands B.V.
Inventor: Paul IJmert Scheffers , Jan Andries Meijer , Erwin Slot , Vincent Sylvester Kuiper , Niels Vergeer
CPC classification number: H01J37/3045 , B82Y10/00 , B82Y40/00 , G03F7/707 , H01J2237/1502
Abstract: A multi-beamlet charged particle beamlet lithography system for transferring a pattern to a surface of a substrate. The system comprises a projection system (311) for projecting a plurality of charged particle beamlets (7) onto the surface of the substrate; a chuck (313) moveable with respect to the projection system; a beamlet measurement sensor (i.a. i.e., 505, 511) for determining one or more characteristics of one or more of the charged particle beamlets, the beamlet measurement sensor having a surface (501) for receiving one or more of the charged particle beamlets; and a position mark measurement system for measuring a position of a position mark (610, 620, 635), the position mark measurement system comprising an alignment sensor (361, 362). The chuck comprises a substrate support portion for supporting the substrate, a beamlet measurement sensor portion (460) for accommodating the surface of the beamlet measurement sensor, and a position mark portion (470) for accommodating the position mark.
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公开(公告)号:US11822252B2
公开(公告)日:2023-11-21
申请号:US17155951
申请日:2021-01-22
Applicant: ASML NETHERLANDS B.V.
Inventor: Dzmitry Labetski , Christianus Wilhelmus Johannes Berendsen , Rui Miguel Duarte Rodreigues Nunes , Alexander Igorevich Ershov , Kornelis Frits Feenstra , Igor Vladimirovich Fomenkov , Klaus Martin Hummler , Arun Johnkadaksham , Matthias Kraushaar , Andrew David Laforge , Marc Guy Langlois , Maksim Loginov , Yue Ma , Seyedmohammad Mojab , Kerim Nadir , Alexander Shatalov , John Tom Stewart , Henricus Gerardus Tegenbosch , Chunguang Xia
CPC classification number: G03F7/70033 , G03F7/70916 , H05G2/003 , H05G2/008
Abstract: An extreme ultraviolet radiation (EUV) source, including: a vessel having an inner vessel wall and an intermediate focus (IF) region; an EUV collector disposed inside the vessel, the EUV collector including a reflective surface configured to reflect EUV radiation toward the intermediate focus region, the reflective surface configured to directionally face the IF region of the vessel; a showerhead disposed along at least a portion of the inner vessel wall, the showerhead including a plurality of nozzles configured to introduce gas into the vessel; and one or more exhausts configured to remove gas introduced into the vessel, the one or more exhausts being oriented along at least a portion of the inner vessel wall so that the gas is caused to flow away from the EUV collector.
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公开(公告)号:US11815402B2
公开(公告)日:2023-11-14
申请号:US17425646
申请日:2019-12-19
Applicant: ASML Netherlands B.V.
Inventor: Sietse Thijmen Van Der Post , Peter Danny Van Voorst
CPC classification number: G01J9/00 , G01N23/207 , G02B3/0037 , G02B5/1819 , G02B5/1838 , G03F7/70616 , G21K1/065 , G01J2009/002
Abstract: Disclosed is a wavefront sensor for measuring a tilt of a wavefront at an array of locations across a beam of radiation, wherein said wavefront sensor comprises a film, for example of Zirconium, having an indent array comprising an indent at each of said array of locations, such that each indent of the indent array is operable to perform focusing of said radiation. Also disclosed is a radiation source and inspection apparatus comprising such a wavefront sensor.
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公开(公告)号:US20230359127A1
公开(公告)日:2023-11-09
申请号:US18026115
申请日:2021-08-24
Applicant: ASML NETHERLANDS B.V. , ASML HOLDING N.V.
Inventor: Hans BUTLER , Arie Jeffrey DEN BOEF , Mark Constant Johannes BAGGEN , Jeroen Arnoldus Leonardus Johannes RAAYMAKERS , Richard Carl ZIMMERMAN
IPC: G03F7/00
CPC classification number: G03F7/70625 , G03F7/706835
Abstract: A metrology tool that includes a substrate table to hold a substrate; a projection system configured to project a beam on a target portion of the substrate; an actuator configured to adjust a position of the projection system relative to the substrate on the substrate table; a sensor configured to determine a position of the substrate table; and a one or more processors configured to: determine, based on the position of the substrate table, a position error of the substrate table with respect to a reference; and control, via the actuator, a position of the projection system to compensate for the position error of the substrate table so that the beam projects on the target portion of the substrate.
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169.
公开(公告)号:US11804358B2
公开(公告)日:2023-10-31
申请号:US17493837
申请日:2021-10-04
Applicant: ASML Netherlands B.V.
CPC classification number: H01J37/20 , H01L21/67288 , H01J2237/2001 , H01J2237/2814
Abstract: An improved particle beam inspection apparatus, and more particularly, a particle beam inspection apparatus including a thermal conditioning station for preconditioning a temperature of a wafer is disclosed. The charged particle beam apparatus may scan the wafer to measure one or more characteristics of the structures on the wafer and analyze the one or more characteristics. The charged particle beam apparatus may further determine a temperature characteristic of the wafer based on the analysis of the one or more characteristics of the structure and adjust the thermal conditioning station based on the temperature characteristic.
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170.
公开(公告)号:US11803127B2
公开(公告)日:2023-10-31
申请号:US17295193
申请日:2019-11-04
Applicant: ASML NETHERLANDS B.V.
Inventor: Chenxi Lin , Cyrus Emil Tabery , Hakki Ergün Cekli , Simon Philip Spencer Hastings , Boris Menchtchikov , Yi Zou , Yana Cheng , Maxime Philippe Frederic Genin , Tzu-Chao Chen , Davit Harutyunyan , Youping Zhang
IPC: G03F7/00 , G05B13/02 , G05B19/418 , H01L21/66
CPC classification number: G03F7/705 , G05B13/027 , G05B19/41875 , H01L22/20 , G05B2219/32193 , G05B2219/32368 , G05B2219/45031
Abstract: A method for determining a root cause affecting yield in a process for manufacturing devices on a substrate, the method including: obtaining yield distribution data including a distribution of a yield parameter across the substrate or part thereof; obtaining sets of metrology data, each set including a spatial variation of a process parameter over the substrate or part thereof corresponding to a different layer of the substrate; comparing the yield distribution data and metrology data based on a similarity metric describing a spatial similarity between the yield distribution data and an individual set out of the sets of the metrology data; and determining a first similar set of metrology data out of the sets of metrology data, being the first set of metrology data in terms of processing order for the corresponding layers, which is determined to be similar to the yield distribution data.
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