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    METHOD AND STRUCTURE OF MONOLITHETICALLY INTEGRATED INERTIAL SENSOR USING IC FOUNDRY-COMPATIBLE PROCESSES
    161.
    发明申请
    METHOD AND STRUCTURE OF MONOLITHETICALLY INTEGRATED INERTIAL SENSOR USING IC FOUNDRY-COMPATIBLE PROCESSES 有权
    使用集成电路兼容过程的单一集成惯性传感器的方法和结构

    公开(公告)号：US20120248506A1

    公开(公告)日：2012-10-04

    申请号：US13494986

    申请日：2012-06-12

    Applicant: XIAO (CHARLES) YANG

    Inventor： XIAO (CHARLES) YANG

    IPC: H01L21/66 ,  H01L29/84 ,  H01L21/02

    CPC classification number: H01L22/12 ,  B81B2201/025 ,  B81C1/0023 ,  B81C1/00246 ,  B81C2203/0145 ,  B81C2203/0735 ,  H01L22/26 ,  H01L27/0688

    Abstract: The present invention relates to integrating an inertial mechanical device on top of a CMOS substrate monolithically using IC-foundry compatible processes. The CMOS substrate is completed first using standard IC processes. A thick silicon layer is added on top of the CMOS. A subsequent patterning step defines a mechanical structure for inertial sensing. Finally, the mechanical device is encapsulated by a thick insulating layer at the wafer level.Comparing to the incumbent bulk or surface micromachined MEMS inertial sensors, the vertically monolithically integrated inertial sensors have smaller chip size, lower parasitics, higher sensitivity, lower power, and lower cost.

    Abstract translation: 本发明涉及使用IC代工厂兼容的工艺将一个惯性机械装置整体地集成在CMOS衬底之上。 CMOS基板首先使用标准IC工艺完成。 在CMOS的顶部添加厚的硅层。 随后的图案化步骤限定了用于惯性感测的机械结构。 最后，机械装置由晶圆级的厚绝缘层封装。 与现有的体积或表面微加工MEMS惯性传感器相比，垂直单片集成的惯性传感器具有更小的芯片尺寸，更低的寄生效应，更高的灵敏度，更低的功率和更低的成本。

    MEMS device and MEMS spring element
    162.
    发明授权
    MEMS device and MEMS spring element 有权
    MEMS器件和MEMS弹簧元件

    公开(公告)号：US08183650B2

    公开(公告)日：2012-05-22

    申请号：US12756305

    申请日：2010-04-08

    Applicant: Chuan-Wei Wang ,  Sheng-Ta Lee ,  Hsin-Hui Hsu

    Inventor： Chuan-Wei Wang ,  Sheng-Ta Lee ,  Hsin-Hui Hsu

    IPC: H01L21/02

    CPC classification number: B81B3/0072 ,  B81B2201/025 ,  B81B2203/0118

    Abstract: A micro electromechanical system (MEMS) spring element is disposed on a substrate, and includes a fixing portion and a moveable portion. The fixing portion is fixed on the substrate, and includes an insulating layer, a plurality of metal-fixing layers and a plurality of supporting-fixing layers. The insulating layer is disposed on the substrate. The metal-fixing layers are disposed above the insulating layer. The supporting-fixing layers are connected between the metal-fixing layers. The moveable portion has a first end and a second end. The first end is connected with the fixing portion, and the second end is suspended above the substrate. The moveable portion includes a plurality of metal layers and at least a supporting layer. The supporting layer is connected between the adjacent metal layers, and a hollow region is formed between the supporting layer and the adjacent metal layers. The deformation of the MEMS spring element generated because of the different thermal expansion may be avoided and the working performance of the MEMS spring element can be improved.

    Abstract translation: 微机电系统（MEMS）弹簧元件设置在基板上，并且包括固定部分和可移动部分。 固定部固定在基板上，具有绝缘层，多个金属固定层和多个支撑固定层。 绝缘层设置在基板上。 金属固定层设置在绝缘层的上方。 支撑固定层连接在金属固定层之间。 可移动部分具有第一端和第二端。 第一端与固定部分连接，第二端悬挂在基板上。 可移动部分包括多个金属层和至少一个支撑层。 支撑层连接在相邻的金属层之间，并且在支撑层和相邻金属层之间形成中空区域。 可以避免由于不同的热膨胀而产生的MEMS弹簧元件的变形，并且可以提高MEMS弹簧元件的工作性能。

    VIBRATION TRANSDUCER AND ITS MANUFACTURING METHOD
    164.
    发明申请
    VIBRATION TRANSDUCER AND ITS MANUFACTURING METHOD 有权
    振动传感器及其制造方法

    公开(公告)号：US20120060607A1

    公开(公告)日：2012-03-15

    申请号：US13228855

    申请日：2011-09-09

    Applicant: Takashi YOSHIDA

    Inventor： Takashi YOSHIDA

    IPC: G01H13/00 ,  H01L21/302

    CPC classification number: G01L9/0019 ,  B81B3/001 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2201/0285 ,  B81B2203/0118 ,  G01L1/106 ,  G01L9/0013 ,  H03H9/2457 ,  H03H2009/02496

    Abstract: A vibration transducer includes a silicon single crystal vibration beam provided over a silicon single crystal substrate, the vibration beam having a sectional shape that is longer in a direction perpendicular to a surface of the silicon single crystal substrate than in a direction parallel with it, a shell made of silicon, surrounding the vibration beam with a gap, and forming a vacuum room together with the silicon single crystal substrate, a plate-like first electrode plate disposed parallel with the surface of the silicon single crystal substrate, the first electrode plate having one end connected to the vibration beam, plate-like second and third electrode plates disposed parallel with the surface of the silicon single crystal substrate so as to be opposed to each other with the vibration beam interposed in between, and asperities formed on confronting side surfaces of the vibration beam and the second and third electrode plates.

    Abstract translation: 振动传感器包括设置在硅单晶衬底上的硅单晶振动束，所述振动束具有在垂直于所述硅单晶衬底的表面的方向上比在与其平行的方向上更长的截面形状， 由硅制成的壳体，围绕振动梁间隙，并与硅单晶基板一起形成真空室，与硅单晶基板的表面平行布置的板状第一电极板，第一电极板具有 一端与振动束相连接，板状的第二和第三电极板与硅单晶衬底的表面平行设置，以便彼此相对地插入振动束，并且形成在相对侧面上的凹凸 的振动束和第二和第三电极板。

    ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHODS FOR MANUFACTURING THE SAME
    165.
    发明申请
    ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHODS FOR MANUFACTURING THE SAME 有权
    电子设备，电子模块及其制造方法

    公开(公告)号：US20110162452A1

    公开(公告)日：2011-07-07

    申请号：US13051279

    申请日：2011-03-18

    Applicant: Atsushi ONO ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Masayuki MATSUNAGA ,  Akitoshi HARA

    Inventor： Atsushi ONO ,  Yoshihiro KOBAYASHI ,  Shojiro KITAMURA ,  Masayuki MATSUNAGA ,  Akitoshi HARA

    IPC: H05K1/00 ,  G01P15/02

    CPC classification number: B81B7/007 ,  B81B7/0074 ,  B81B2201/025 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15156 ,  H01L2924/15313 ,  H01L2924/16195 ,  Y10T29/49155 ,  H01L2924/00014

    Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface.

    Abstract translation: 电子设备包括：轮廓配置，其包括第一表面，与第一表面相对的第二表面和联接到第一和第二表面的安装表面; 第一基板，包括第一电极; 第二基板，包括第二电极; 设置在所述第一和第二基板之间的树脂; 以及用所述树脂密封并具有多面体轮廓构造的电气元件，所述电气元件设置成使得所述多面体的最宽表面面向所述第一基板和所述第二基板之一。 所述第一表面是所述第一基板的一个表面，所述一个表面在与所述树脂相邻的一侧与所述第一基板的另一个表面相对。 所述第二表面是所述第二基板的一个表面，所述一个表面在与所述树脂相邻的一侧与所述第二基板的另一表面相对。 安装表面包括：树脂在第一和第二基板之间的暴露表面以及与暴露表面相邻的第一和第二基板的侧表面。 第一电极设置在与安装表面相邻的第一表面的端部处并且电耦合到电气元件。 第二电极设置在邻近安装表面的第二表面的端部。

    Inertial sensor
    169.
    发明申请
    Inertial sensor 有权
    惯性传感器

    公开(公告)号：US20080196497A1

    公开(公告)日：2008-08-21

    申请号：US12010256

    申请日：2008-01-23

    Applicant: Takeharu Suzuki

    Inventor： Takeharu Suzuki

    IPC: G01C19/00

    CPC classification number: G01C19/56 ,  B81B3/0051 ,  B81B2201/025

    Abstract: An inertial sensor includes a stopper having a first locking member extending from a flame onto a proof-mass, a first recess formed at the proof-mass, including a bottom surface, a second locking member extending from the proof-mass onto the edge of the flame, a second recess formed at the edge of the side member of the flame and a projection member projecting from the flame toward the proof-mass, wherein each of the first locking member and the projection member is disposed on the both sides of the second recess.

    Abstract translation: 惯性传感器包括具有第一锁定构件的止动件，该第一锁定构件从火焰延伸到防爆质量块上，形成在防弹块上的第一凹部包括底面，第二锁定构件从校准块延伸到 火焰，形成在火焰侧部件边缘处的第二凹槽和从火焰朝向防弹块突出的突出部件，其中第一锁定部件和突出部件中的每一个设置在 第二个休息

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