公开(公告)号：US20150061049A1

公开(公告)日：2015-03-05

申请号：US14478117

申请日：2014-09-05

Applicant: Heribert WEBER

Inventor： Heribert WEBER

IPC: G01L1/14 ,  H01L29/66

CPC classification number: G01L1/148 ,  B81B3/007 ,  B81B2201/0235 ,  B81B2201/0264 ,  G01L9/0073 ,  H01L29/66007

Abstract: A micromechanical component for a capacitive sensor device includes first and second electrodes. The first electrode is at least partially formed from a first semiconductor layer and/or metal layer, and at least one inner side of the second electrode facing the first electrode is formed from a second semiconductor layer and/or metal layer. A cavity is between the first and second electrodes. Continuous recesses are structured into the inner side of the second electrode and sealed off with a closure layer. At least one reinforcing layer of the second electrode and at least one contact element which is electrically connected to the first electrode, to the layer of the second electrode which forms the inner side, to at least one printed conductor, and/or to a conductive substrate area, are formed from at least one epi-polysilicon layer. Also described is a micromechanical component manufacturing method for a capacitive sensor device.

Abstract translation: 用于电容传感器装置的微机械部件包括第一和第二电极。 第一电极至少部分地由第一半导体层和/或金属层形成，并且第二电极的面向第一电极的至少一个内侧由第二半导体层和/或金属层形成。 空腔在第一和第二电极之间。 连续的凹部被构造成第二电极的内侧并用闭合层密封。 至少一个第二电极的加强层和至少一个与第一电极电连接到形成内侧的第二电极层的至少一个接触元件到至少一个印刷导体和/或导电 衬底区域由至少一个外延多晶硅层形成。 还描述了一种用于电容式传感器装置的微机械部件制造方法。

公开(公告)号：US08962389B2

公开(公告)日：2015-02-24

申请号：US13906161

申请日：2013-05-30

Applicant: William C. Stermer, Jr. ,  Philip H. Bowles ,  Alan J. Magnus

Inventor： William C. Stermer, Jr. ,  Philip H. Bowles ,  Alan J. Magnus

IPC: H01L21/44 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00325 ,  B81B2201/0264 ,  B81C2203/0154

Abstract: Embodiments of microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the fabrication method includes printing a patterned die attach material onto the backside of a wafer including an array of non-singulated microelectronic die each having an interior keep-out area, such as a central keep-out area. The die attach material, such as a B-stage epoxy, is printed onto the wafer in a predetermined pattern such that the die attach material does not encroaching into the interior keep-out areas. The wafer is singulated to produce singulated microelectronic die each including a layer of die attach material. The singulated microelectronic die are then placed onto leadframes or other package substrates with the die attach material contacting the package substrates. The layer of die attach material is then fully cured to adhere an outer peripheral portion of the singulated microelectronic die to its package substrate.

Abstract translation: 提供了微电子封装的实施例和用于制造微电子封装的方法。 在一个实施例中，制造方法包括将图案化的管芯附着材料印刷到晶片的背面，该晶片包括非均匀化的微电子管芯阵列，每个裸片具有内部保护区域，例如中心保护区域。 诸如B级环氧树脂的管芯附着材料以预定图案印刷到晶片上，使得管芯附着材料不会侵入内部保护区域。 将晶片单片化以产生单独的微电子管芯，每个管芯均包括管芯附着材料层。 然后将分割的微电子管芯放置在引线框架或其他封装衬底上，管芯附着材料与封装衬底接触。 然后将芯片附着材料层完全固化以将单片化微电子管芯的外围部分粘附到其封装衬底上。

公开(公告)号：US20150024536A1

公开(公告)日：2015-01-22

申请号：US14511652

申请日：2014-10-10

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe

IPC: B81C1/00

CPC classification number: B81C1/00269 ,  B81B3/001 ,  B81B3/007 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00166 ,  B81C1/00658 ,  H04R19/005

Abstract: MEMS devices with a rigid backplate and a method of making a MEMS device with a rigid backplate are disclosed. In one embodiment, a device includes a substrate and a backplate supported by the substrate. The backplate includes elongated protrusions.

Abstract translation: 公开了具有刚性背板的MEMS装置和制造具有刚性背板的MEMS装置的方法。 在一个实施例中，装置包括基板和由基板支撑的背板。 背板包括细长突起。

公开(公告)号：US20150001645A1

公开(公告)日：2015-01-01

申请号：US14316583

申请日：2014-06-26

Applicant: STMicroelectronics S.r.I. ,  STMicroelectronics International N.V.

Inventor： Dino Faralli ,  Benedetto Vigna ,  Laura Maria Castoldi

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0061 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00269 ,  B81C2203/0118 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A MEMS device wherein a die of semiconductor material has a first face and a second face. A membrane is formed in or on the die and faces the first surface. A cap is fixed to the first face of the first die and is spaced apart from the membrane by a space. The die is fixed, on its second face, to an ASIC, which integrates a circuit for processing the signals generated by the die. The ASIC is in turn fixed on a support. A packaging region coats the die, the cap, and the ASIC and seals them from the outside environment. A fluidic path is formed through the support, the ASIC, and the first die, and connects the membrane and the first face of the die with the outside, without requiring holes in the cap.

Abstract translation: 一种MEMS器件，其中半导体材料的管芯具有第一面和第二面。 在模具中或模具上形成膜并面向第一表面。 盖子固定在第一模具的第一面上并且与隔膜隔开一个空间。 芯片在其第二面被固定到ASIC，其集成了用于处理由芯片产生的信号的电路。 ASIC依次固定在支持上。 包装区域涂覆模具，盖子和ASIC，并将它们与外部环境密封。 通过支撑件，ASIC和第一模具形成流体路径，并且将膜和模具的第一面与外部连接，而不需要在盖中的孔。

公开(公告)号：US08916944B2

公开(公告)日：2014-12-23

申请号：US13583392

申请日：2011-03-15

Applicant: Bernd Burchard ,  Michael Doelle ,  Zhou Ningning

Inventor： Bernd Burchard ,  Michael Doelle ,  Zhou Ningning

IPC: H01L33/00 ,  B81B3/00

CPC classification number: B81B3/0072 ,  B81B2201/0257 ,  B81B2201/0264

Abstract: The micro-electromechanical device has a substrate. Integrated into the substrate is a micromechanical component that has a bending element which can be bent reversibly and which has a first end connected to the substrate and extends from the first end over a free space. The bending element has at least one web having two side edges, the course of which is defined by depressions introduced into the bending element and adjacent to the side edges. In order to form a homogenization region located within the web, in which mechanical stresses occurring during bending of the bending element are substantially equal, the mutual spacing of the side edges of the web decreases, as viewed from the first end of the bending element. The device further comprises at least one microelectronic component that is sensitive to mechanical stresses and embedded in the web in the homogenization region of the latter.

Abstract translation: 微机电装置具有基板。 集成到衬底中的是一种微机械部件，其具有可逆地弯曲的弯曲元件，并且其具有连接到衬底的第一端并且在第一端部在自由空间上延伸。 弯曲元件具有至少一个腹板，该腹板具有两个侧边缘，其边缘由通过弯曲元件并靠近侧边缘的凹陷限定。 为了形成位于纤维网内的均质化区域，其中在弯曲元件的弯曲期间发生的机械应力基本上相等，从弯曲元件的第一端看，幅材的侧边缘的相互间隔减小。 该装置还包括至少一个对机械应力敏感的微电子部件，并且嵌入在后者的均匀化区域中的网中。

公开(公告)号：US20140341402A1

公开(公告)日：2014-11-20

申请号：US14452067

申请日：2014-08-05

Applicant: Wolfson Microelectronics plc

Inventor： Anthony Bernard Traynor ,  Richard Ian Laming ,  Tsjerk H. Hoekstra

IPC: H04R23/00 ,  B81B3/00

CPC classification number: H04R19/04 ,  B81B3/0021 ,  B81B3/0072 ,  B81B3/0094 ,  B81B2201/00 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  H01L27/00 ,  H04R19/00 ,  H04R19/005 ,  H04R23/00 ,  H04R31/00 ,  H04R2499/11

Abstract: A method of fabricating a micro-electrical-mechanical system (MEMS) transducer comprises the steps of forming a membrane on a substrate, and forming a back-volume in the substrate. The step of forming a back-volume in the substrate comprises the steps of forming a first back-volume portion and a second back-volume portion, the first back-volume portion being separated from the second back-volume portion by a step in a sidewall of the back-volume. The cross-sectional area of the second back-volume portion can be made greater than the cross-sectional area of the membrane, thereby enabling the back-volume to be increased without being constrained by the cross-sectional area of the membrane. The back-volume may comprise a third back-volume portion. The third back-volume portion enables the effective diameter of the membrane to be formed more accurately.

Abstract translation: 制造微机电系统（MEMS）换能器的方法包括以下步骤：在衬底上形成膜，并在衬底中形成后体积。 在基板中形成后部体积的步骤包括以下步骤：形成第一后部体积部分和第二背部体积部分，第一后部体积部分与第二背部体积部分分离， 背部体积的侧壁。 第二后部容积部分的横截面面积可以大于膜的横截面面积，从而能够增加后部体积，而不受膜的横截面面积的约束。 背部容积可以包括第三后部体积部分。 第三后部体积部分能够更准确地形成膜的有效直径。

公开(公告)号：US20140339653A1

公开(公告)日：2014-11-20

申请号：US14070109

申请日：2013-11-01

Applicant: National Tsing Hua University

Inventor： Heng-Chung CHANG ,  Wei-Leun FANG

IPC: B81B3/00

CPC classification number: B81B3/0021 ,  B81B2201/0264 ,  H01L41/125

Abstract: A sensor chip has a supporting structure layer and a micro-inductor layer formed on the supporting structure layer and having an inductance. The micro-inductor layer comprises an insulating layer, at least one magnetic layer, and a micro-coil layer. When an external physical quantity is applied on sensor chip, the micro-inductor layer can deform correspondingly to generate a variation of the inductance. The variation of the inductance can be measured by an inductance measurement circuit. The inductance measurement circuit can be an external circuit or be integrated into the sensor chip.

Abstract translation: 传感器芯片具有支撑结构层和形成在支撑结构层上并具有电感的微电感层。 微电感器层包括绝缘层，至少一个磁性层和微型线圈层。 当在传感器芯片上施加外部物理量时，微电感层可以相应地变形以产生电感的变化。 电感的变化可以通过电感测量电路来测量。 电感测量电路可以是外部电路或集成到传感器芯片中。

公开(公告)号：US20140338460A1

公开(公告)日：2014-11-20

申请号：US14281374

申请日：2014-05-19

Applicant: Matthias LUDWIG ,  Martin ROJAHN

Inventor： Matthias LUDWIG ,  Martin ROJAHN

IPC: B81B7/00 ,  G01L9/00 ,  G01N33/00 ,  B81C1/00

CPC classification number: B81B7/0029 ,  B81B7/0061 ,  B81B2201/0264 ,  B81C1/00341 ,  B81C2203/0154 ,  G01L9/00 ,  G01L13/00 ,  G01L19/0007 ,  G01N33/00 ,  Y10T29/49826

Abstract: A micromechanical component having a sensor chip is described, on and/or in which at least one sensor element is disposed, and a cladding, formed of an injection-molding material, encloses the sensor chip in such a way that at least one partial area of a surface of the sensor chip is covered in airtight fashion by the injection-molding material. At least one channel is formed in the injection-molding material, which takes a course, straight or not straight, from an outer surrounding area of the cladding toward the at least one sensor element of such a length that a change in shape and/or a change in chemical consistency of at least one part of the at least one sensor element is able to be brought about as a function of at least one physical property and/or at least one chemical partial composition of a medium present in the at least one channel.

Abstract translation: 描述了具有传感器芯片的微机械部件，其上设置有至少一个传感器元件和/或其中设置有至少一个传感器元件，并且由注射成型材料形成的包层以这样的方式包围传感器芯片，使得至少一个部分区域 通过注射成型材料以气密方式覆盖传感器芯片的表面。 在注射成型材料中形成至少一个通道，其从包层的外部周围区域朝向至少一个传感器元件采取直线或非直线的过程，其长度与形状和/或 可以使至少一个传感器元件的至少一部分的化学稠度的变化作为至少一种物理性能和/或至少一种传感器元件中存在的介质的至少一种化学部分组成的函数 渠道。

公开(公告)号：US08872288B2

公开(公告)日：2014-10-28

申请号：US13571263

申请日：2012-08-09

Applicant: Edward Fuergut ,  Horst Theuss ,  Rainer Leuschner

Inventor： Edward Fuergut ,  Horst Theuss ,  Rainer Leuschner

IPC: H01L29/84

CPC classification number: B81B7/0041 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00253 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1461 ,  H01L2924/181 ,  H04R19/005 ,  H04R31/006 ,  H04R2201/003 ,  H01L2924/00

Abstract: A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area.

Abstract translation: 公开了一种用于形成封装的MEMS器件的系统和方法。 在一个实施例中，封装的MEMS器件包括具有第一主表面的MEMS器件，第一主表面具有沿着第一方向的第一区域和第二方向，设置在MEMS器件的第一主表面上的膜和邻近膜的背板。 封装的MEMS器件还包括封装MEMS器件并且限定后部体积的封装材料，后部体积具有沿第一方向和第二方向的第二区域，其中第一区域小于第二区域。

公开(公告)号：US08847340B2

公开(公告)日：2014-09-30

申请号：US13907077

申请日：2013-05-31

Applicant: STMicroelectronics S.r.I.

Inventor： Lorenzo Baldo ,  Chantal Combi ,  Mario Francesco Cortese

IPC: H01L29/84 ,  G01L19/14 ,  B81B7/00

CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/141 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Electronic device including a substrate provided with at least one passing opening, a MEMS device with a differential sensor provided with a first and a second surface having at least one portion sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface thereof. The first surface of the MEMS device leaves the first active surface exposed and the second surface being provided with a further opening which exposes said second opposed active surface, the electronic device being characterized in that the first surface of the MEMS device faces the substrate and is spaced therefrom by a predetermined distance, the sensitive portion being aligned to the passing opening of the substrate, and in that it also comprises a protective package, which incorporates at least partially the MEMS device and the substrate.

Abstract translation: 包括设置有至少一个通过开口的基板的电子设备，具有差分传感器的MEMS装置，其具有第一和第二表面，所述第一和第二表面具有至少一部分，其对于与第一和第二表面相对应地存在的流体的化学和/或物理变化敏感; 其第二相对的有效表面。 MEMS器件的第一表面离开暴露的第一有源表面，并且第二表面设置有暴露所述第二相对有效表面的另一开口，该电子器件的特征在于，MEMS器件的第一表面面向衬底，并且是 与其隔开预定距离，敏感部分与衬底的通过开口对准，并且其还包括至少部分地结合MEMS器件和衬底的保护封装。