Abstract:
Methods and apparatus are provided for controlling a depth of a cavity between two layers of a light modulating device. A method of making a light modulating device includes providing a substrate, forming a sacrificial layer over at least a portion of the substrate, forming a reflective layer over at least a portion of the sacrificial layer, and forming one or more flexure controllers over the substrate, the flexure controllers configured so as to operably support the reflective layer and to form cavities, upon removal of the sacrificial layer, of a depth measurably different than the thickness of the sacrificial layer, wherein the depth is measured perpendicular to the substrate.
Abstract:
A microelectromechanical system (MEMS) device and a method for fabricating the same are described. The MEMS device includes a first electrode and a second electrode. The first electrode is disposed on a substrate, and includes at least two metal layers, a first protection ring and a dielectric layer. The first protection ring connects two adjacent metal layers, so as to define an enclosed space between two adjacent metal layers. The dielectric layer is disposed in the enclosed space and connects two adjacent metal layers. The second electrode is disposed on the first electrode, wherein a cavity is formed between the first electrode and the second electrode.
Abstract:
The micromechanical device comprises a mobile beam attached via the two ends thereof to a rigid frame comprising two arms each having two ends. The ends of an arm are respectively secured to the two ends of the mobile beam. Each arm has a middle part arranged between the two ends of the corresponding arm. A rear face of the middle part of each arm is attached to a base support. The frame comprises at least one stressed element enabling the state of stress of the beam to be adjusted. The stressed element can be centered between the front face and the rear face of the corresponding arm. The frame can comprise pairs of front and rear stressed elements arranged facing one another respectively on the front face and on the rear face of the arms.
Abstract:
A method for forming a thin film structure, which has small tensile stress due to controlled mechanical stress, and is made to be conductive, is provided. A lower film including polysilicon thin film is formed on a substrate such as Si substrate, then an impurity such as P is doped into the lower film and thermally diffused, thereby the lower film is made conductive. Then, an upper film is deposited on the lower film, the upper film including a polysilicon thin film that is simply deposited and not made to be conductive. The upper film has a tensile stress in an approximately the same level as compressive stress of the lower film, and a thin film structure as a whole, the structure including the lower film and the upper film, is adjusted to have small tensile stress.
Abstract:
An actuator is provided. The actuator comprises a base portion, a cantilever beam connected to the base portion, and an actuator cell adjacent to the cantilever beam. The actuator cell comprises a first metal electrode positioned on the cantilevered beam, a second metal electrode positioned near the first metal electrode, and phase change material between the first and second metal electrodes, wherein the phase change material connects the first metal electrode to the second metal electrode, wherein applying a burst of energy to the phase change material causes the phase change material to change between an amorphous state and a crystalline state, causing the cantilevered beam to move between a first position and a target position, wherein the cantilevered beam remains at the target position upon removal of the energy.
Abstract:
The micromechanical device comprises a mobile beam attached via the two ends thereof to a rigid frame comprising two arms each having two ends. The ends of an arm are respectively secured to the two ends of the mobile beam. Each arm has a middle part arranged between the two ends of the corresponding arm. A rear face of the middle part of each arm is attached to a base support. The frame comprises at least one stressed element enabling the state of stress of the beam to be adjusted. The stressed element can be centered between the front face and the rear face of the corresponding arm. The frame can comprise pairs of front and rear stressed elements arranged facing one another respectively on the front face and on the rear face of the arms.
Abstract:
An optical device having a high reflector tunable stress coating includes a micro-electromechanical system (MEMS) platform, a mirror disposed on the MEMS platform, and a multiple layer coating disposed on the mirror. The multiple layer coating includes a layer of silver (Ag), a layer of silicon dioxide (SiO2) deposited on the layer of Ag, a layer of intrinsic silicon (Si) deposited on the layer of SiO2, and a layer of silicon oxynitride (SiOxNy) deposited on the layer of Si. The concentration of nitrogen is increased and/or decreased to tune the stress (e.g., tensile, none, compressive).
Abstract translation:具有高反射器可调应力涂层的光学装置包括微机电系统(MEMS)平台,设置在MEMS平台上的反射镜和设置在反射镜上的多层涂层。 多层涂层包括沉积在Ag层上的银(Ag)层,二氧化硅层(SiO 2 SiO 2),沉积在SiO 2层上的本征硅(Si)层 以及沉积在Si层上的氮氧化硅层(SiO x x N y Y y)。 氮的浓度增加和/或降低以调节应力(例如,拉伸,无,压缩)。
Abstract:
A method for forming a thin film structure, which has small tensile stress due to controlled mechanical stress, and is made to be conductive, is provided. A lower film including polysilicon thin film is formed on a substrate such as Si substrate, then an impurity such as P is doped into the lower film and thermally diffused, thereby the lower film is made conductive. Then, an upper film is deposited on the lower film, the upper film including a polysilicon thin film that is simply deposited and not made to be conductive. The upper film has a tensile stress in an approximately the same level as compressive stress of the lower film, and a thin film structure as a whole, the structure including the lower film and the upper film, is adjusted to have small tensile stress.
Abstract:
A MEMS device and method of fabrication including a plurality of structural tie bars for added structural integrity. The MEMS device includes an active layer and a substrate having an insulating material formed therebetween, first and second pluralities of stationary electrodes and a plurality of moveable electrodes in the active layer. A plurality of interconnects are electrically coupled to a second surface of each of the first and second pluralities of stationary electrodes. A plurality of anchors fixedly attach a first surface of each of the first and second pluralities of stationary electrodes to the substrate. A first structural tie bar couples a second surface of each of the first plurality of stationary electrodes and a second structural tie bar couples a second surface of each of the second plurality of stationary electrodes.
Abstract:
A micromechanical structural element, having a very stable diaphragm, implemented in a pure front process and in a layer construction on a substrate. The layer construction includes at least one sacrificial layer and one diaphragm layer above the sacrificial layer, which is structured for laying bare the diaphragm and generating stabilizing elements on the diaphragm, at least one recess being generated for a stabilizing element of the diaphragm. The structure generated in the sacrificial layer is then at least superficially closed with at least one material layer being deposited above the structured sacrificial layer, this material layer forming at least a part of the diaphragm layer and being structured to generate at least one etch hole for etching the sacrificial layer, which is removed from the region under the etch hole, the diaphragm and the at least one stabilizing element being laid bare, a cavity being created under the diaphragm.