Multilayer structures and process for fabricating the same
    161.
    发明授权
    Multilayer structures and process for fabricating the same 失效
    多层结构及其制造方法

    公开(公告)号:US5837380A

    公开(公告)日:1998-11-17

    申请号:US578816

    申请日:1995-12-26

    Abstract: A substantially warp-free laminate polymeric film structure is obtained by a fabrication process in which the individual layers of polymeric film that are to be laminated together to form a card or similar structure are selected such that the mechanical properties of one layer or pair of layers are offset by those of another layer or layer pair wherein each polymeric film layer is bonded to its adjacent polymeric film layers by adhesive layers wherein the adhesive layers have a tack point temperature that is within 10.degree. C. of the glass transition temperature of said polymeric film layers. The properties of the layers which may be subject to this consideration include, for example, the layer thickness, tensile strength, elongation factor, shrinkage rate, and machine processing direction. In an illustrative three-layer substrate embodiment of the present invention, the tensile strength, elongation factor, and shrinkage rate of the outer film layers of the substrate are the same, with the outer layers having a higher tensile strength value than the inner layer tensile strength. The orientation of the film's processing and machine direction and the orientation of the coil set of the film are also considered in arriving at a matched layer set.

    Abstract translation: 通过制造方法获得基本无翘曲的层压聚合物膜结构,其中将要层压在一起以形成卡或类似结构的聚合物膜的各个层被选择为使得一层或一层的机械性能 被另一层或层对的那些偏移,其中每个聚合物膜层通过粘合剂层与其相邻的聚合物膜层结合,其中粘合剂层的粘着温度在所述聚合物的玻璃化转变温度的10℃以内 电影层。 可以考虑的层的性质包括例如层厚度,拉伸强度,伸长率,收缩率和机器加工方向。 在本发明的示例性三层基板实施例中,基板的外膜层的拉伸强度,延伸率和收缩率相同,外层的拉伸强度值比内层拉伸强度高 强度。 薄膜的加工方向和机器方向以及薄膜的线圈组的取向也被认为是达到匹配层组。

    Conductor-filled thermosetting resin
    163.
    发明授权
    Conductor-filled thermosetting resin 失效
    导体填充的热固性树脂

    公开(公告)号:US5475048A

    公开(公告)日:1995-12-12

    申请号:US163398

    申请日:1993-12-07

    Abstract: Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach adhesive. The thermosetting resins exhibit rheological properties that allow them to be substituted for state-of-the-art solder paste and die attach adhesives. The conductor filled resins can be thermally cured in in-line processing operations to provide a low stress, substrate adherent, electrically conductive resin matrix.

    Abstract translation: 制备具有基于自由基的固化化学物质的导体填充的热固性树脂,用作用于表面安装电子部件到印刷电路板的导电附着物的焊膏替代物和作为芯片附着粘合剂。 热固性树脂具有流变性能,可以替代最先进的焊膏和管芯粘合剂。 导体填充树脂可以在线处理操作中热固化,以提供低应力,基底粘附的导电树脂基质。

    Glass cloth and prepreg containing same
    170.
    发明授权
    Glass cloth and prepreg containing same 失效
    玻璃布和含有它的预浸料

    公开(公告)号:US4428995A

    公开(公告)日:1984-01-31

    申请号:US427582

    申请日:1982-09-29

    Abstract: At both ends of glass cloth comprising warp yarns consisting of a number of glass monofilaments and weft yarns consisting of a number of glass monofilaments, the weft yarns being cut at the ends of the glass cloth, glass monofilament-fixing portions are formed by fusing the ends of the weft yarns, by substituting a synthetic resin yarn for the warp yarn at the end of the glass cloth and melting the synthetic resin yarn or by attaching an adhesive tape to the ends of the glass cloth. The glass cloth having the glass monofilament-fixing portions at both ends thereof is advantageous in that no broken pieces of glass monofilament were formed when preparing prepreg or laminate using the glass cloth, and the laminate has excellent accuracy of thickness.

    Abstract translation: 在玻璃布的两端,包括由多根玻璃单丝组成的经纱和由多根玻璃单丝组成的纬纱,纬纱在玻璃布的端部被切割,玻璃单丝固定部分通过将 通过在玻璃布的末端代替合成树脂纱用于经纱并熔化合成树脂纱线或者通过将粘合带粘附到玻璃布的端部来使纬纱的端部。 在其两端具有玻璃单丝固定部分的玻璃布的优点在于,当使用玻璃布制备预浸料或层压体时,不形成玻璃单丝的破碎片,并且层压板具有优异的厚度精度。

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