公开(公告)号：US08218325B2

公开(公告)日：2012-07-10

申请号：US12591920

申请日：2009-12-04

Applicant: Yoo-Jin Song

Inventor： Yoo-Jin Song

IPC: H05K5/00

CPC classification number: H05K7/20963 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10446 ,  H05K2201/2036

Abstract: A plasma display apparatus includes a plasma display panel (PDP), a chassis base secured on a first side to the PDP and having a driving circuit board mounted on a second side, a tower-shaped fixing unit that protrudes above the second side of the chassis base, and a back cover secured to a tower unit of the tower-shaped fixing unit to cover the driving circuit board.

Abstract translation: 一种等离子体显示装置，包括等离子体显示面板（PDP），固定在PDP的第一面上并具有安装在第二面上的驱动电路板的底架，在第二侧上方突出的塔形固定单元 底座，以及固定在塔形固定单元的塔架单元上以覆盖驱动电路板的后盖。

公开(公告)号：US08153477B2

公开(公告)日：2012-04-10

申请号：US13194909

申请日：2011-07-30

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/00 ,  H01L23/12

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48639 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01007 ,  H01L2924/01031 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/0104 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first post extends from the dielectric base in a first vertical direction into a first opening in the first adhesive and is aligned with a first aperture in the first conductive layer, the second post extends from the dielectric base in a second vertical direction into a second opening in the second adhesive and is aligned with a second aperture in the second conductive layer and the dielectric base is sandwiched between and extends laterally from the posts, then flowing the first adhesive in the first vertical direction and the second adhesive in the second vertical direction, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal and selected portions of the conductive layers, wherein the pad extends beyond the dielectric base in the first vertical direction and the terminal extends beyond the dielectric base in the second vertical direction, providing a heat spreader that includes the posts and the dielectric base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供第一和第二柱，第一和第二粘合剂，第一和第二导电层和电介质基底，其中第一柱从第一垂直方向的电介质基底延伸到第一和第二导电层中的第一开口 第一粘合剂并且与第一导电层中的第一孔对准，第二柱在第二垂直方向上从电介质基底延伸到第二粘合剂中的第二开口中，并且与第二导电层中的第二孔对准， 电介质基底夹持在支柱之间并从支柱横向延伸，然后在第一垂直方向上流动第一粘合剂并使第二粘合剂沿第二垂直方向流动，固化粘合剂，然后提供包括垫，端子和选定的导电迹线 导电层的部分，其中焊盘在第一垂直方向a延伸超过电介质基底 并且端子在第二垂直方向上延伸超过电介质基底，提供包括柱和电介质基底的散热器，然后将半导体器件安装在第一柱上，将半导体器件电连接到导电迹线并热连接 半导体器件到散热器。

公开(公告)号：US08110446B2

公开(公告)日：2012-02-07

申请号：US12617725

申请日：2009-11-13

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/00

CPC classification number: H01L23/3677 ,  H01L21/486 ,  H01L24/45 ,  H01L24/48 ,  H01L33/483 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上，包括使导柱与导电 然后使粘合剂在位于柱和导电层之间的孔中的间隙中并向上流动，固化粘合剂，然后提供包括导电层的焊盘，端子和选定部分的导电迹线，安装 包括柱和基座的散热器上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20120002374A1

公开(公告)日：2012-01-05

申请号：US13232358

申请日：2011-09-14

Applicant: Hiroshi KATO ,  Kyohei TAKEUCHI

Inventor： Hiroshi KATO ,  Kyohei TAKEUCHI

IPC: H05K7/20

CPC classification number: H05K7/08 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0061 ,  H05K3/308 ,  H05K7/2049 ,  H05K7/205 ,  H05K2201/09054 ,  H05K2201/10416 ,  H05K2201/1059 ,  H05K2201/10689

Abstract: The electronic control device includes: a printed circuit board; a heat-generating member having a plurality of legs which are mounted on the printed circuit board by connections between the legs and the printed circuit board; and a casing which radiates heat that is transferred from the heat-generating member, wherein: the legs are connected via press-fit connections with the printed circuit board.

Abstract translation: 电子控制装置包括：印刷电路板; 具有多个腿部的发热部件，其通过腿部和印刷电路板之间的连接安装在印刷电路板上; 以及辐射从发热部件传递的热量的壳体，其中：腿部通过压配合连接到印刷电路板。

公开(公告)号：US08067270B2

公开(公告)日：2011-11-29

申请号：US12617723

申请日：2009-11-13

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/00

CPC classification number: H05K1/0204 ,  F21K9/00 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和底座，将粘合剂安装在基座上，包括将柱穿过粘合剂中的开口，将基底安装在粘合剂上，包括将柱插入基底中的孔中， 在柱和基板之间的孔中形成间隙，然后使粘合剂在间隙中向上流动，固化粘合剂，然后将半导体器件安装在包括柱和基座的散热器上，将半导体器件 并将半导体器件热连接到散热器上。

公开(公告)号：US08062912B2

公开(公告)日：2011-11-22

申请号：US12558526

申请日：2009-09-13

Applicant: Chia-Chung Wang ,  Charles W. C. Lin

Inventor： Chia-Chung Wang ,  Charles W. C. Lin

IPC: H01L21/00

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a substrate on the adhesive including inserting the post into an aperture in the substrate to form a gap in the aperture between the post and the substrate, then flowing the adhesive into and upward in the gap, solidifying the adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the substrate and thermally connecting the semiconductor device to the heat spreader. The substrate includes first and second conductive layers and a dielectric layer therebetween and provides horizontal signal routing between a pad and a terminal at the first conductive layer.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和底座，将粘合剂安装在基座上，包括将柱穿过粘合剂中的开口，将基底安装在粘合剂上，包括将柱插入基底中的孔中， 在柱和基板之间的孔中形成间隙，然后使粘合剂在间隙中向上流动，固化粘合剂，然后将半导体器件安装在包括柱和基座的散热器上，将半导体器件 并将半导体器件热连接到散热器上。 衬底包括第一和第二导电层以及它们之间的电介质层，并且在第一导电层处提供衬垫和端子之间的水平信号路由。

公开(公告)号：US08034645B2

公开(公告)日：2011-10-11

申请号：US12626941

申请日：2009-11-30

Applicant: Charles W. C. Lin ,  Chia-Chung Wang

Inventor： Charles W. C. Lin ,  Chia-Chung Wang

IPC: H01L21/00

CPC classification number: H05K1/0204 ,  H01L21/486 ,  H01L23/3677 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base that include a copper surface layer and an aluminum core, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the post with an aperture in the conductive layer, then flowing the adhesive into and upward in a gap located in the aperture between the post and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供包括铜表面层和铝芯的柱和基座，在基底上安装粘合剂，包括将柱插入粘合剂中的开口中，将导电层安装在粘合剂上 包括使该柱与导电层中的孔对准，然后将粘合剂流入并位于位于柱和导电层之间的孔中的间隙中，固化粘合剂，然后提供导电迹线，其包括垫，端子 以及导电层的选定部分，将半导体器件安装在包括柱和基座的散热器上，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US08003416B2

公开(公告)日：2011-08-23

申请号：US12759699

申请日：2010-04-14

Applicant: Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

Inventor： Charles W. C. Lin ,  Chia-Chung Wang ,  Sangwhoo Lim

IPC: H01L21/00

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L23/49575 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/12041 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10969 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting a first adhesive on the base including inserting the post through an opening in the first adhesive, mounting a conductive layer on the base including aligning the post with an aperture in the conductive layer, providing a conductive trace that includes a pad, a terminal and a selected portion of the conductive layer, then flowing a second adhesive into and downward in a gap between the post and the conductive trace, solidifying the second adhesive, then mounting a semiconductor device on a heat spreader that includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 制造半导体芯片组件的方法包括提供柱和基座，将第一粘合剂安装在基座上，包括将柱穿过第一粘合剂中的开口，将导电层安装在基座上，包括使柱与孔对准 导电层，提供导电迹线，其包括焊盘，端子和导电层的选定部分，然后使第二粘合剂在柱和导电迹线之间的间隙中和向下流动，固化第二粘合剂，然后安装 包括柱和基座的散热器上的半导体器件，将半导体器件电连接到导电迹线并将半导体器件热连接到散热器。

公开(公告)号：US20110201157A1

公开(公告)日：2011-08-18

申请号：US13092913

申请日：2011-04-23

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L21/50

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/15174 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/06 ,  H05K2201/09054 ,  H05K2201/09509 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01007 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/00012

Abstract: A method of making a semiconductor chip assembly includes providing a post and a base, mounting a second adhesive on the base, mounting a substrate with a conductive pattern on the second adhesive, mounting a first adhesive on the substrate and mounting a conductive layer on the first adhesive, then flowing the first adhesive upward between the post and the conductive layer and flowing the second adhesive upward between the post and the substrate, solidifying the adhesives, then providing a conductive trace that includes a pad, a terminal, the conductive pattern, first and second vias and a selected portion of the conductive layer, mounting a semiconductor device on the post, wherein a heat spreader includes the post and the base, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract translation: 一种制造半导体芯片组件的方法包括提供柱和基座，将第二粘合剂安装在基座上，将具有导电图案的基板安装在第二粘合剂上，将第一粘合剂安装在基板上并将导电层安装在 第一粘合剂，然后使第一粘合剂在柱和导电层之间向上流动并使第二粘合剂在柱和基底之间向上流动，固化粘合剂，然后提供包括垫，端子，导电图案的导电迹线， 第一和第二通孔和导电层的选定部分，将半导体器件安装在柱上，其中散热器包括柱和基座，将半导体器件电连接到导电迹线并将半导体器件热连接到热 吊具

公开(公告)号：US20110198662A1

公开(公告)日：2011-08-18

申请号：US13091162

申请日：2011-04-21

Applicant: Charles W.C. Lin ,  Chia-Chung Wang

Inventor： Charles W.C. Lin ,  Chia-Chung Wang

IPC: H01L33/64

CPC classification number: H01L21/486 ,  H01L23/3677 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L33/483 ,  H01L33/642 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85207 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/15174 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/115 ,  H05K3/0061 ,  H05K3/06 ,  H05K2201/09054 ,  H05K2201/09509 ,  H05K2201/10106 ,  H05K2203/0369 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01007 ,  H01L2924/01015 ,  H01L2924/01026 ,  H01L2924/00012

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace, a substrate and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a pad, a terminal, a conductive pattern and first and second vias. The substrate includes the conductive pattern and a dielectric layer. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The conductive trace provides signal routing between the pad and the terminal using the conductive pattern and the vias.

Abstract translation: 半导体芯片组件包括半导体器件，散热器，导电迹线，衬底和粘合剂。 散热器包括一个柱子和一个底座。 导电迹线包括焊盘，端子，导电图案以及第一和第二通孔。 基板包括导电图案和电介质层。 半导体器件电连接到导电迹线并热连接到散热器。 柱从基部向上延伸到粘合剂中的开口和基底中的孔，并且基部从柱横向延伸。 导电迹线使用导电图案和通孔提供焊盘和端子之间的信号路由。