公开(公告)号：US20060005986A1

公开(公告)日：2006-01-12

申请号：US11221137

申请日：2005-09-07

Applicant: David Alcoe

Inventor： David Alcoe

IPC: H02G3/08 ,  B23K31/00

CPC classification number: H05K13/0465 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/10126 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49204 ,  Y10T29/49211 ,  Y10T29/49213 ,  H01L2924/00014

Abstract: An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.

公开(公告)号：US06879011B1

公开(公告)日：2005-04-12

申请号：US10091529

申请日：2002-03-07

Applicant: Brett J. Hamilton

Inventor： Brett J. Hamilton

IPC: H01L21/00 ,  H01L23/04 ,  H01L23/52 ,  H01L29/00 ,  H01L29/82 ,  H01L43/00 ,  H05K1/02 ,  H05K1/16 ,  H05K9/00

CPC classification number: H05K9/00 ,  H05K1/0233 ,  H05K1/165 ,  H05K2201/10265 ,  H05K2201/10689 ,  H05K2203/304 ,  Y10S438/953

Abstract: A magnetically shielded circuit board having a conductive solenoid to repel high speed charged particles away from an integrated circuit chip. The conductive solenoid is embedded in the circuit board, or located around the circuit board, or located within an integrated circuit package, the integrated circuit package have been connected to the circuit board. The conductive solenoid is used for conducting an electrical current, the electrical current forming a magnetic field. The magnetic field will repel high speed charged particles away from the integrated circuit chip, the integrated circuit chip being within the integrated circuit package. The circuit board can be used in a space vehicle.

公开(公告)号：US20050067687A1

公开(公告)日：2005-03-31

申请号：US10992384

申请日：2004-11-18

Applicant: Robert Canella

Inventor： Robert Canella

IPC: G01R1/04 ,  H05K3/32 ,  H05K3/42 ,  H01L21/48 ,  H01L31/062

CPC classification number: G01R1/0466 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/325 ,  H05K3/42 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2201/10265 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0242 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01004

Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.

公开(公告)号：US06717421B1

公开(公告)日：2004-04-06

申请号：US10070793

申请日：2002-03-08

Applicant: Toshio Kazama

Inventor： Toshio Kazama

IPC: G01R3102

CPC classification number: G01R1/06716 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/10265 ,  Y02P70/613

Abstract: In an electric contact probe assembly, an electroconductive patch is attached to a part of the support sheet so as to cover a through hole formed in the support sheet from a front side thereof, and a base end of an electroconductive resilient probe member is attached to the patch. The patch is connected to a terminal of a circuit board both electrically and physically via a solder lump placed in the through hole. The patch may also be attached to the reverse side of the support sheet. In this case, the base end of the resilient probe member is partly received in the through hole. The contact probe assembly of the present invention is suited for a high density design comprising a large number of extremely small resilient probe members one next to the other while simplifying the fabrication process.

Abstract translation: 在电接触探针组件中，导电贴片附着到支撑片的一部分上，以从其前侧覆盖形成在支撑片中的通孔，并且导电弹性探针元件的基端附接到 补丁。 贴片通过放置在通孔中的焊料块电连接和物理连接到电路板的端子。 贴片也可以附着在支撑片的背面。 在这种情况下，弹性探针构件的基端部分地容纳在通孔中。 本发明的接触探针组件适用于高密度设计，其包括大量极小的弹性探针构件，而另一个则相邻，同时简化制造过程。

公开(公告)号：US20030234451A1

公开(公告)日：2003-12-25

申请号：US10179560

申请日：2002-06-25

Inventor： Eli Razon

IPC: H05K013/00 ,  H01R043/00 ,  H01R043/02 ,  B23P021/00

CPC classification number: H01L24/85 ,  H01L21/4825 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/43 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45611 ,  H01L2224/45616 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48455 ,  H01L2224/48472 ,  H01L2224/73204 ,  H01L2224/78302 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19042 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01R13/2407 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10719 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A new and improved electrical connector is provided for Ball Grid Array (BGA) devices and Direct Chip Attach (DCA) devices that solves the prior art problems of mismatch in the coefficient of thermal between a semiconductor die and its substrate, PC board or carrier. The electrical connector consists of a resilient loop of wire that is permanently wire bonded at a first and a second bond position to an electrode or contact pad of a die or an interposer. The closed loop of wire is stable in the X and Y direction and resilient in the Z direction which enables the wire bonded die or interposer to be temporarily attached to a carrier or test board for all forms of tests as well as being removable and reworkable even after being permanently soldered in place on a substrate or PC board. Since the loop shaped connectors are resilient in X, Y and Z directions, the die or interposer may be clamped onto a PC board or substrate to provide a lead free electrical connection that does not require any underfill. The loop size may be made with highly conductive and/or plated (coated) wire in sizes from about 2.5 mils diameter up to about 30 mils using wire having a diameter of about 1.0 mils up to 5.0 mils to replace prior art balls used on pads of about 3 mils size or greater.

Abstract translation: 为球栅阵列（BGA）器件和直接芯片连接（DCA）器件提供了一种新的改进的电连接器，其解决了半导体管芯及其衬底，PC板或载体之间的热系数不匹配的现有技术问题。 电连接器由电线的弹性回路组成，其在第一和第二接合位置处永久地引线接合到模具或插入件的电极或接触焊盘。 线的闭环在X和Y方向上是稳定的，并且在Z方向上具有弹性，这使得线接合模具或插入件能够临时连接到载体或测试板以进行所有形式的测试，并且甚至可移除和再加工 在基板或PC板上永久焊接到位之后。 由于环形连接器在X，Y和Z方向上具有弹性，所以芯片或插入件可夹紧在PC板或基板上，以提供不需要任何底部填充的无铅电连接。 可以使用具有约1.0密耳至高达5.0密耳直径的线的直径大约2.5密耳直径至约30密耳的高导电性和/或电镀（涂覆）线制成环尺寸，以代替用于垫上的现有技术球 约3密耳尺寸或更大。

公开(公告)号：US20030170972A1

公开(公告)日：2003-09-11

申请号：US10092239

申请日：2002-03-06

Inventor： Scott L. Kirkman

IPC: H01L021/44

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10265 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613

Abstract: Disclosed are novel methods and apparatus for efficiently providing dynamic solder attach, in part, to decrease the affects of thermal variations. In an embodiment, a spacer provides a gap between a semiconductor package and a device, an attachment material is disposed between the device and the semiconductor package, and an environmental control device provides an appropriate environment to activate the attachment material. In another embodiment, while the attachment material is substantially activated, the spacer increases the gap between the semiconductor package and the device to elongate the attachment material in a plane substantially perpendicular to the device and the semiconductor package. In yet a different embodiment, the elongated attachment material assumes a substantially hourglass shape.

Abstract translation: 公开了用于有效地提供动态焊料附着的一些新颖的方法和装置，其一部分是为了减少热变化的影响。 在一个实施例中，间隔件在半导体封装和器件之间提供间隙，附接材料设置在器件和半导体封装之间，环境控制器件提供适当的环境以激活附着材料。 在另一个实施例中，当附接材料基本上被激活时，间隔物增加了半导体封装和器件之间的间隙，以在基本上垂直于器件和半导体封装的平面中延长附件材料。 在另一个不同的实施例中，细长的附着材料呈现基本上沙漏的形状。

公开(公告)号：US06472599B2

公开(公告)日：2002-10-29

申请号：US09779598

申请日：2001-02-09

Applicant: Barry Lee Shepherd

Inventor： Barry Lee Shepherd

IPC: H02G300

CPC classification number: H01R12/7088 ,  H01R13/514 ,  H05K1/0263 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10272

Abstract: An electrical interface arrangement includes a buss bar having a longitudinal edge that is substantially smooth and free of conductive tabs. A conductive member is arranged adjacent to the longitudinal edge of the buss bar, and contacts the buss bar with at least 40 A-spots per inch, along substantially an entire length of the buss bar. A circuit board having a plurality of internal planes is provided, with at least one of the internal planes being an internal power plane, and with at least another one of the internal planes being an internal wiring plane having a plurality of conductive wirings. The circuit board further has an arrangement for electrically connecting the conductive member to the internal power plane without interfering with a placement of the conductive wirings, so that the circuit board and the buss bar are in electrical communication.

Abstract translation: 电接口装置包括具有基本上平滑且没有导电片的纵向边缘的总线。 导电构件布置成与母线的纵向边缘相邻，并且沿着母线的大致整个长度与每英寸具有至少40个A点的汇流条接触。 提供具有多个内部平面的电路板，其中至少一个内部平面是内部功率平面，并且至少另一个内部平面是具有多个导电布线的内部布线平面。 电路板还具有用于将导电构件电连接到内部电力平面而不干扰导电布线的布置的布置，使得电路板和母线处于电气连通状态。

公开(公告)号：US20020071252A1

公开(公告)日：2002-06-13

申请号：US10006676

申请日：2001-12-10

Inventor： Choichirou Kodaka ,  Masashiro Shindo ,  Tadashi Ito

IPC: H05K007/20

CPC classification number: H05K7/20 ,  H05K1/0203 ,  H05K1/0237 ,  H05K2201/1003 ,  H05K2201/10265 ,  H05K2201/10492

Abstract: A heat sink element in the form of a coil with a high thermal conductivity is formed. One end of the heat sink element is directly connected to a circuit element connection conductor under a high potential in a high-frequency circuit mounted on an electronic circuit substrate, and the other end thereof is directly secured to a metal case having the electronic circuit substrate contained therein. As a result, the heat sink element serves as a heat channel transferring the heat generated due to the temperature increase in the circuit element connection conductor to the metal case by means of thermal conductivity.

Abstract translation: 形成具有高导热性的线圈形式的散热元件。 散热元件的一端直接连接到安装在电子电路基板上的高频电路中的高电位的电路元件连接导体，另一端直接固定在具有电子电路基板的金属外壳上 其中包含。 结果，散热元件用作通过热传导将由于电路元件连接导体中的温度升高而产生的热传递到金属外壳的热通道。

公开(公告)号：US20020046856A1

公开(公告)日：2002-04-25

申请号：US09300783

申请日：1999-04-27

Inventor： DAVID J. ALCOE

IPC: H02G003/08

CPC classification number: H05K13/0465 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/10126 ,  H01L2924/01322 ,  H01L2924/09701 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10977 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49204 ,  Y10T29/49211 ,  Y10T29/49213 ,  H01L2924/00014

Abstract: An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.

Abstract translation: 电子封装包括其上具有接触焊盘的衬底，位于接触焊盘上的诸如焊球的可重新构件，以及位于可重整构件周围的弹性构件。 弹性构件在可重整构件上施加环形力，使得当可重整构件软化时，弹性构件使可重整构件伸长。 该伸长率适应上述基底与在可重整构件的自由端连接的另一基底之间的热应力和其它应力。 还提供了一种用于将弹性构件定位在可重整构件上和周围的装置。

公开(公告)号：US20010023144A1

公开(公告)日：2001-09-20

申请号：US09779598

申请日：2001-02-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Barry Lee Shepherd

IPC: H01R025/00

CPC classification number: H01R12/7088 ,  H01R13/514 ,  H05K1/0263 ,  H05K3/325 ,  H05K2201/10265 ,  H05K2201/10272

Abstract: An electrical interface arrangement includes a buss bar having a longitudinal edge that is substantially smooth and free of conductive tabs. A conductive member, such as an elongated coil spring, is arranged adjacent to the longitudinal edge of the buss bar, and contacts the buss bar with at least 40 A-spots (electrical connection locations) per inch, along an entire length of the buss bar. A circuit board having a plurality of internal planes is provided, with at least one of the internal planes being an internal power plane, and with at least another one of the internal planes being an internal wiring plane having a plurality of conductive wirings. The circuit board further has an arrangement for electrically connecting the conductive member to the internal power plane without interfering with a placement of the conductive wirings, so that the circuit board and the buss bar are in electrical communication.