公开(公告)号：US11757223B2

公开(公告)日：2023-09-12

申请号：US17230712

申请日：2021-04-14

Applicant: Dell Products L.P.

Inventor： Isaac Q. Wang ,  Timothy M. Lambert ,  Corey D. Hartman

IPC: H01R25/16 ,  H01R12/73 ,  H01R12/57 ,  H01R27/02 ,  H05K1/18 ,  H01R43/02 ,  H01R43/20

CPC classification number: H01R12/737 ,  H01R12/57 ,  H01R27/02 ,  H01R43/0256 ,  H01R43/20 ,  H05K1/181 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10492 ,  H05K2201/10522

Abstract: An information handling system may include a printed circuit board and a plurality of connectors each electrically and mechanically coupled to the printed circuit board, each connector of the plurality of connectors configured to receive a respective modular information handling resource in order to electrically couple, via electrically-conductive pins of such connector, the respective modular information handling resource to the printed circuit board. Each connector may include a body comprising electrically non-conductive material and including a receptacle formed therein for receiving a mating edge connector of the respective modular information handling resource, a bus bar comprising electrically conductive material, other than the electrically-conductive pins of such connector, disposed within or upon the body and extending through at least a portion of the body, and an electrical termination electrically coupled to the bus bar.

公开(公告)号：US10064315B2

公开(公告)日：2018-08-28

申请号：US15297458

申请日：2016-10-19

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  LITE-ON TECHNOLOGY CORP.

Inventor： Chien-Hsiung Tsao ,  Yan-Ning Chen

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/209 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10227 ,  H05K2201/10272 ,  H05K2201/10492 ,  H05K2201/10522 ,  H05K2201/10553 ,  H05K2201/10568 ,  H05K2201/10606

Abstract: The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.

公开(公告)号：US09722231B2

公开(公告)日：2017-08-01

申请号：US14230603

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Edward J. Soleski ,  Richard M. DeKeuster

IPC: H01M10/04 ,  H01M2/22 ,  B60R16/03 ,  H02J7/00 ,  H01M10/058 ,  H01M2/12 ,  H01M2/10 ,  H01M2/24 ,  H01M2/20 ,  H01M2/34 ,  H01H47/32 ,  H01M10/48 ,  H05K1/18 ,  H05K3/32 ,  B60L11/18 ,  H01M2/30 ,  H01M10/6551 ,  B60L1/00 ,  B60L1/02 ,  B60L1/14 ,  B60L3/00 ,  B60L3/12 ,  B60L11/12 ,  B60L11/14 ,  B60L15/20 ,  B60R16/033 ,  H01M10/42 ,  G01R31/36 ,  H01R12/71 ,  H05K1/02 ,  H02H7/18 ,  G01R31/02 ,  H01M2/32 ,  H01M4/66

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A battery system having a bladed fuse connector and a method of operation of the bladed fuse connector are provided. The system may, in certain embodiments, include a printed circuit board (PCB) and a high current interconnect. The high current interconnect may be mounted to and extending upward from the PCB. The battery system may also include a fuse. The fuse may limit an amount of current flowing through the battery system. Additionally, the battery system may include a bladed fuse connector coupled between the high current interconnect and the fuse. The bladed fuse connector may carry a current between the high current interconnect and the fuse. To that end, the bladed fuse connector may include an S-shaped bend between the high current interconnect and the fuse.

公开(公告)号：US09711778B2

公开(公告)日：2017-07-18

申请号：US14230387

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Richard M. DeKeuster ,  Edward J. Soleski ,  Robert J. Mack ,  Gary P. Houchin-Miller ,  Stephen D. Cash ,  Lisa L. Winders ,  Jack L. Johnson

IPC: H01M2/22 ,  B60R16/03 ,  H02J7/00 ,  G01R31/36 ,  H01M10/04 ,  H01M10/058 ,  H01M2/12 ,  H01M2/10 ,  H01M2/24 ,  H01M2/20 ,  H01M2/34 ,  H01H47/32 ,  H01M10/48 ,  H05K1/18 ,  H05K3/32 ,  B60L11/18 ,  H01M2/30 ,  H01M10/6551 ,  B60L1/00 ,  B60L1/02 ,  B60L1/14 ,  B60L3/00 ,  B60L3/12 ,  B60L11/12 ,  B60L11/14 ,  B60L15/20 ,  B60R16/033 ,  H01M10/42 ,  H01R12/71 ,  H05K1/02 ,  H02H7/18 ,  G01R31/02 ,  H01M2/32 ,  H01M4/66

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A method of manufacturing a battery module for use in a vehicle is presented. The method may include disposing battery cells into a lower housing and disposing a lid assembly over the battery cells. The lid assembly may include a lid and bus bar interconnects disposed on the lid. The method may also include disposing a printed circuit board (PCB) assembly onto the lid assembly and electrically coupling portions of the lid assembly, portions of the PCB assembly, and the battery cells to each other.

公开(公告)号：US09698403B2

公开(公告)日：2017-07-04

申请号：US14230737

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Edward J. Soleski ,  Richard M. DeKeuster ,  Bryan L. Thieme ,  Ronald J. Dulle ,  Mikhail S. Balk

IPC: H01R9/00 ,  H01M2/22 ,  B60R16/03 ,  H02J7/00 ,  G01R31/36 ,  H01M10/04 ,  H01M10/42 ,  H01M10/058 ,  H01M2/12 ,  H01M2/10 ,  H01M2/24 ,  H01M2/20 ,  H01M2/34 ,  H01H47/32 ,  H01M10/48 ,  H05K1/18 ,  H05K3/32 ,  B60L11/18 ,  H01M2/30 ,  H01M10/6551 ,  B60L1/00 ,  B60L1/02 ,  B60L1/14 ,  B60L3/00 ,  B60L3/12 ,  B60L11/12 ,  B60L11/14 ,  B60L15/20 ,  B60R16/033 ,  H01R12/71 ,  H05K1/02 ,  H02H7/18 ,  G01R31/02 ,  H01M2/32 ,  H01M4/66

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A printed circuit board (PCB) assembly includes a PCB and a high current interconnect mounted on the PCB. The high current interconnect is configured to electrically couple a first high current bladed component, a second high current bladed component, and a trace disposed on the PCB. The high current interconnect includes feet made of a conductive material that are coupled to the PCB. The trace is coupled to the feet via a weld.

公开(公告)号：US20160157353A1

公开(公告)日：2016-06-02

申请号：US15014059

申请日：2016-02-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Ryul CHOI ,  Suk Chang HONG ,  Sang Kab PARK ,  Kwang Seop YOUM

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/183 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/4697 ,  H05K2201/10492 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed herein are a printed circuit board, a manufacturing method thereof, and a semiconductor package including the printed circuit board. The printed circuit board includes a base substrate including a plurality of circuit patterns, a cavity formed above the base substrate, a pad embedded in the base substrate and being exposed through the substrate bottom surface of the cavity, and an electronic component mounted in the cavity and electrically connected to the pad.According to the present invention, a cavity having a predetermined depth is formed in a base substrate of a printed circuit board so as to mount an electronic component therein, such that a gap between an upper semiconductor package and a lower semiconductor package may be obtained even if pitches between the balls are decreased for high density and high performance of the upper semiconductor package in the manufacturing of a semiconductor package having a PoP structure.

Abstract translation: 这里公开了印刷电路板，其制造方法和包括印刷电路板的半导体封装。 印刷电路板包括：基底基板，其包括多个电路图案，形成在基底基板上的空腔，嵌入基底基板中并通过空腔的基板底表面露出的垫，以及安装在腔体中的电子部件 并且电连接到所述垫。 根据本发明，在印刷电路板的基底基板上形成具有预定深度的空腔，以便在其中安装电子部件，使得即使在上部半导体封装和下部半导体封装之间也可获得间隙 如果在具有PoP结构的半导体封装的制造中，球之间的间距在上半导体封装的高密度和高性能方面降低。

公开(公告)号：US20150072209A1

公开(公告)日：2015-03-12

申请号：US14230827

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Matthew R. Tyler ,  Edward J. Soleski ,  Mikhail S. Balk ,  Richard M. DeKeuster

IPC: H01M2/20

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L15/20 ,  B60L50/16 ,  B60L50/51 ,  B60L50/61 ,  B60L50/64 ,  B60L50/66 ,  B60L58/12 ,  B60L58/21 ,  B60L58/26 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/3835 ,  G01R31/385 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7011 ,  Y02T10/7016 ,  Y02T10/7022 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A bus bar including a first end comprising a first material and a second end comprising a second material and a method of manufacture are provided. The first end is designed to be coupled to a terminal of a first battery cell of a battery module and includes a first collar disposed on the first end designed to receive and surround the terminal of the first battery cell of the battery module. The second end is designed to be coupled to a terminal of a second battery cell of the battery module and includes a second collar disposed on the second end designed to receive and surround the terminal of the second battery of the battery module. The first and second batteries of the battery module are adjacent to one another. Moreover, the bus bar includes a joint electrically and mechanically coupling the first end and the second end.

Abstract translation: 提供一种母线，其包括包括第一材料的第一端和包括第二材料的第二端和制造方法。 第一端被设计成耦合到电池模块的第一电池单元的端子，并且包括设置在第一端上的第一环，设计成接收和围绕电池模块的第一电池单元的端子。 第二端被设计成耦合到电池模块的第二电池单元的端子，并且包括设置在第二端上的第二套环，设计成接收和围绕电池模块的第二电池的端子。 电池模块的第一和第二电池彼此相邻。 此外，母线包括电连接和机械耦合第一端和第二端的接头。

公开(公告)号：US20150072206A1

公开(公告)日：2015-03-12

申请号：US14231329

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Gary P. Houchin-Miller ,  Mikhail S. Balk ,  Richard M. DeKeuster ,  Stephen D. Cash

IPC: H01M2/10

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A battery module includes a housing configured to hold prismatic battery cells within a space defined by four interior walls of the housing. The housing includes a first interior wall that includes partitions extending upwards from a bottom of the housing and a second interior wall that includes partitions extending upwards from the bottom of the housing. The first interior wall faces opposite the second interior wall. The partitions disposed on the first interior wall and the partitions disposed on the second interior wall define slots between adjacent partitions, where each of the slots increases in width between the adjacent partitions from the bottom of the housing upwards. Each of the slots is configured to retain one of the prismatic battery cells.

Abstract translation: 电池模块包括被配置为将棱柱形电池单元保持在由壳体的四个内壁限定的空间内的壳体。 壳体包括第一内壁，其包括从壳体的底部向上延伸的隔板和包括从壳体的底部向上延伸的隔板的第二内壁。 第一内壁面向第二内壁的对面。 设置在第一内壁上的分隔壁和设置在第二内壁上的隔板在相邻隔板之间限定狭槽，其中每个狭槽从壳体底部的相邻隔板之间的宽度增加。 每个槽配置成保持棱柱形电池单元中的一个。

公开(公告)号：US08044746B2

公开(公告)日：2011-10-25

申请号：US12762168

申请日：2010-04-16

Applicant: James Leroy Blair ,  Oswin M. Schreiber ,  Jeffrey Thomas Smith

Inventor： James Leroy Blair ,  Oswin M. Schreiber ,  Jeffrey Thomas Smith

IPC: H01P3/08

CPC classification number: H05K1/0219 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01P3/006 ,  H01P3/08 ,  H05K1/0237 ,  H05K1/0393 ,  H05K1/147 ,  H05K3/222 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/09618 ,  H05K2201/09727 ,  H05K2201/10492 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract translation: 用于电子组件的高速柔性互连电缆包括多个导电层和多个电介质层。 位于导电层上的导电信号迹线与电介质层结合形成一个或多个高速电传输线结构。 电缆可以使用各种连接技术耦合到电子元件。 电缆也可以用任何数量的已知或标准的连接器封装端接。

公开(公告)号：US20100126764A1

公开(公告)日：2010-05-27

申请号：US12277165

申请日：2008-11-24

Applicant: William Leon Rugg

Inventor： William Leon Rugg

IPC: H01R12/02 ,  H05K3/32

CPC classification number: H05K1/0215 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K2201/09309 ,  H05K2201/10409 ,  H05K2201/10492 ,  H05K2201/10689 ,  H05K2201/10969 ,  Y10T29/49147 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: In order to improve signal to noise ratio and reduce electromagnetic interference, it is presently contemplated to connect ground potential on an electronic package mounted to a printed circuit board directly to a commonly grounded surface of a device via an improved die ground lead with a first end connected to an electrical circuit within the electronic package, and a second end extending away from the electronic package and compressively contacting, rather than forming a bonded or soldered connection to, the commonly grounded surface. By way of example and not limitation, the improved die ground lead may be any one of a tie bar, a metal lead, a pogo pin, and a spring. The use of this configuration for the ground connection between the electrical circuit and the commonly grounded surface results in significantly less physical distance than conventional ground paths for electrical circuits within electronic packages.

Abstract translation: 为了提高信噪比并降低电磁干扰，目前预期将安装到印刷电路板的电子封装上的接地电位通过改进的裸片接地引线直接连接到器件的共同接地表面，第一端 连接到电子封装内的电路，以及远离电子封装延伸的第二端，并且压缩地接触而不是形成与通常接地的表面的接合或焊接的连接。 作为示例而非限制，改进的裸片接地引线可以是连接杆，金属引线，弹簧销和弹簧中的任何一个。 使用这种配置用于电路和公共接地表面之间的接地连接导致比电子封装内的电路的传统接地路径显着更少的物理距离。