公开(公告)号：US20240207726A1

公开(公告)日：2024-06-27

申请号：US18522317

申请日：2023-11-29

Applicant: FORWARD ELECTRONICS CO., LTD.

Inventor： Ching-Hao CHUNG ,  Chun-Lin HUANG ,  Hsiu-Chen LI

IPC: A63F13/24 ,  H05K1/18 ,  H05K5/00 ,  H05K5/03

CPC classification number: A63F13/24 ,  H05K1/181 ,  H05K5/0017 ,  H05K5/0065 ,  H05K5/03 ,  H05K2201/10151 ,  H05K2201/10265

Abstract: A multi-directional output device includes a printed circuit board on which first and second magnetic sensors are arranged, and a direction control unit arranged above the printed circuit board. The direction control unit includes first and second rotary driving bodies, first and second magnets, a shaft stick, a balance washer, and an annular spring, wherein the first and second rotary driving bodies are each a rotatable elongated arc-shaped structure. The first and second magnets are respectively fixed on one end of the first rotary driving body and one end of the second rotary driving body. The balance washer is disposed below the shaft stick and in contact with the first and second rotary driving bodies. The annular spring is arranged under the balance washer and in contact with the balance washer. The first and second magnetic sensors are arranged to correspond to the first and second magnets, respectively.

公开(公告)号：US20240130037A1

公开(公告)日：2024-04-18

申请号：US18265786

申请日：2021-12-14

Applicant: LG INNOTEK CO. LTD.

Inventor： Sung June PARK ,  Soo San KIM

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K1/0233 ,  H05K1/184 ,  H05K3/366 ,  H05K2201/10265 ,  H05K2201/10272

Abstract: An electronic component module comprises: a first printed circuit board; an inductor disposed on the first printed circuit board and comprising a core, and a first coil disposed in the core; a metal plate disposed on the inductor, and a busbar disposed on the lower portion of the inductor and coupled to the first printed circuit board, wherein the first coil comprises a first terminal protruding upward from the core, and a second terminal protruding downward from the core, and the first terminal is coupled to the metal plate, and the second terminal is coupled to the busbar.

公开(公告)号：US20240121932A1

公开(公告)日：2024-04-11

申请号：US17963486

申请日：2022-10-11

Applicant: Cisco Technology, Inc.

Inventor： Robert Gregory Twiss

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/046 ,  H05K3/303 ,  H05K2201/066 ,  H05K2201/10265 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2203/0278

Abstract: Apparatuses, systems, and methods for a controlled-force thermal management device installation that helps thermal management of emerging, next-generation devices are provided. An apparatus includes at least two compression interfaces, each for compressing a mounting assembly of a thermal management device to a predetermined loading point. The apparatus further includes a frame configured to apply a preload force to the at least two compression interfaces. The frame has a pivoting joint at an assembly point for each of the at least two compression interfaces to balance the preload force between the at least two compression interfaces.

公开(公告)号：US11778775B2

公开(公告)日：2023-10-03

申请号：US17231794

申请日：2021-04-15

Applicant: Aptiv Technologies Limited

Inventor： Frank H. Adam ,  Klaus Kaufmann ,  Tobias Merten

IPC: H05K7/20 ,  H05K1/18

CPC classification number: H05K7/20254 ,  H05K7/2049 ,  H05K1/18 ,  H05K2201/066 ,  H05K2201/10265 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid therethrough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.

公开(公告)号：US11710996B2

公开(公告)日：2023-07-25

申请号：US17445750

申请日：2021-08-24

Applicant: IBIDEN CO., LTD.

Inventor： Haruhiko Morita ,  Hitoshi Miwa ,  Shinobu Kato ,  Toshihiko Yokomaku ,  Hisashi Kato ,  Takahisa Hirasawa ,  Tetsuya Muraki ,  Takayuki Furuno

IPC: H02K3/28 ,  H05K1/11 ,  H02K3/26 ,  H02K1/06 ,  H02K3/04 ,  H02K15/04 ,  H01F5/00

CPC classification number: H02K3/28 ,  H02K1/06 ,  H02K3/04 ,  H02K3/26 ,  H02K15/0407 ,  H05K1/118 ,  H01F5/003 ,  H02K2203/03 ,  H02K2211/03 ,  H05K2201/10265

Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.

公开(公告)号：US20190212842A1

公开(公告)日：2019-07-11

申请号：US15986653

申请日：2018-05-22

Applicant: Atmel Corporation

Inventor： Nigel Hinson ,  Paul Clements

IPC: G06F3/044

CPC classification number: G06F3/044 ,  G01L1/142 ,  G06F3/0414 ,  G06F2203/04105 ,  H05K1/181 ,  H05K5/0008 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10409

Abstract: Assemblies include a chassis having a first side configured to receive a force-sensitive surface, a support structure including first electrode portions, and resilient mounting elements attached to the chassis and to the support structure. The mounting elements include second electrode portions positioned adjacent to the first electrode portions. Force-sensitive systems include force sensors including portions of a support structure and portions of a mounting element that are adapted to relatively move responsive to one or more applied forces, and a controller configured to identify the one or more applied forces by determining movement between the support structure and the mounting element. Methods include detecting changes in capacitances of respective capacitors formed by first electrode portions on a support structure and second electrode portions defined by mounting elements coupling a chassis to the support structure. Force values and force locations are determined from the detected changes in capacitances.

公开(公告)号：US20180077792A1

公开(公告)日：2018-03-15

申请号：US15553384

申请日：2016-01-12

Applicant: OMRON Corporation

Inventor： Takashi HORIE ,  Haruhisa YAMANA

IPC: H05K1/02 ,  H01F27/29 ,  H01F27/06 ,  H05K1/14 ,  H01F27/24 ,  H01F27/40

CPC classification number: H05K1/0233 ,  H01F27/06 ,  H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2876 ,  H01F27/29 ,  H01F27/40 ,  H01F37/00 ,  H01F2027/065 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/142 ,  H05K3/368 ,  H05K3/40 ,  H05K2201/066 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/1006 ,  H05K2201/10265 ,  H05K2201/10272

Abstract: A reactor includes a winding, a magnetic core in the winding, and a connection member extending from the winding and electrically connecting with an electronic component, and being at least partially spiral between the winding and the electronic component. The winding and the connection member are formed from a single conductive member. The connection member includes a first spiral portion that is at least partially spiral and extends from a first end of the winding, and a second spiral portion that is at least partially spiral and extends from a second end of the winding. A spiral of the first spiral portion and a spiral of the second spiral portion may face each other.

公开(公告)号：US20180027657A1

公开(公告)日：2018-01-25

申请号：US15491921

申请日：2017-04-19

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： Jessica Aldrich ,  Paul Hogan

IPC: H05K1/18 ,  H05K3/32 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/11 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/1003 ,  H05K2201/10227 ,  H05K2201/10265 ,  H05K2201/10484

Abstract: A system and method for placing an inductor on a circuit board. This method includes providing a circuit board, a pedestal, and an inductor, the pedestal has a top surface and a bottom surface and the circuit board has one or more electrical conductors, the inductor having a first inductor terminal and a second inductor terminal. Adhesive is placed on the circuit board and the bottom surface of the pedestal is placed on the adhesive located on the circuit board to secure the pedestal to the circuit board. Next, adhesive is placed on the top surface of the pedestal and the inductor is placed on the adhesive located on the top surface of the pedestal to secure the inductor to the pedestal. The inductor is electrically connected to the circuit board.

公开(公告)号：US09864343B2

公开(公告)日：2018-01-09

申请号：US14648758

申请日：2013-12-12

Applicant: ETA SA MANUFACTURE HORLOGERE SUISSE

Inventor： Raphael Balmer ,  Francois Klopfenstein

IPC: H05K1/11 ,  G04G17/02 ,  G04G17/04 ,  G04G17/06

CPC classification number: G04G17/06 ,  G04G17/02 ,  G04G17/04 ,  G04G17/045 ,  H05K1/115 ,  H05K2201/10265

Abstract: A three dimensional support element for a timepiece sensor, made in 3D-MID and including integrated electrical connection paths, a flexible connection interface formed of bent wire springs or flexible finger-pieces, and a rigid connection interface.

公开(公告)号：US20170346243A1

公开(公告)日：2017-11-30

申请号：US15262475

申请日：2016-09-12

Applicant: ACBEL POLYTECH INC.

Inventor： Wei HONG ,  Jia-Jiann HUANG ,  Hsiao-Kai CHEN ,  Chih-Chieh TSENG

IPC: H01R13/74 ,  H01R13/6594 ,  H01R13/66 ,  H05K1/11 ,  H01R13/621 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01R13/748 ,  H01R13/6215 ,  H01R13/6594 ,  H01R13/665 ,  H01R13/719 ,  H05K1/0224 ,  H05K1/0231 ,  H05K1/111 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/10265

Abstract: A filtered connector is mounted on a casing and includes a connection port and a filter board. An electrode plate mounted on one end of the connection port and electrically isolated from the casing is securely mounted through a through hole of the casing. The filter board has a circuit board assembly, multiple grounding spring plates and multiple filtering capacitors. The circuit board assembly has a slot to be mounted through by the electrode plate. The grounding spring plates are mounted on a surface of the circuit board assembly and electrically contact the casing. The filtering capacitors are electrically connected between the electrode plate and the grounding spring plates. As the filter board is not mounted inside the connection port, only the filter board is to be mounted without replacing the connection port, thereby lowering users' expense in installation of the filter board.