公开(公告)号：US11818957B2

公开(公告)日：2023-11-14

申请号：US16746676

申请日：2020-01-17

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Domenico Giusti ,  Irene Martini

IPC: H01L41/09 ,  H10N30/20

CPC classification number: H10N30/2047 ,  B81B2201/032 ,  B81B2203/0127

Abstract: A MEMS optical device having an optically active portion and an actuation portion adjacent to each other. The MEMS optical device includes a body, a piezoelectric actuator, and a cap. The body is formed by a substrate, housing a cavity containing a fluid and by a deformable region fixed to the substrate, suspended over the cavity and forming a membrane. The piezoelectric actuator extends on the deformable region at the actuation portion and is protected by the cap, which is coupled to the body at the actuation portion and defines a chamber that houses the piezoelectric actuator.

公开(公告)号：US11807517B2

公开(公告)日：2023-11-07

申请号：US17208918

申请日：2021-03-22

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Dario Paci ,  Domenico Giusti ,  Irene Martini

IPC: B81B3/00 ,  B81B7/02 ,  H04N23/57 ,  H04N23/67

CPC classification number: B81B3/0024 ,  B81B3/0021 ,  B81B7/02 ,  H04N23/57 ,  H04N23/67 ,  B81B2201/032 ,  B81B2201/047 ,  B81B2203/0127 ,  B81B2203/0172 ,  B81B2203/0315 ,  B81B2203/04 ,  B81B2203/053

Abstract: A MEMS device includes a semiconductor support body having a first cavity, a membrane including a peripheral portion, fixed to the support body, and a suspended portion. A first deformable structure is at a distance from a central part of the suspended portion of the membrane and a second deformable structure is laterally offset relative to the first deformable structure towards the peripheral portion of the membrane. A projecting region is fixed under the membrane. The second deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a first direction, and the first deformable structure is deformable so as to translate the central part of the suspended portion of the membrane along a second direction.

公开(公告)号：US20230286798A1

公开(公告)日：2023-09-14

申请号：US18117230

申请日：2023-03-03

Applicant: SiTime Corporation

Inventor： Michael Julian Daneman ,  Charles I. Grosjean ,  Paul M. Hagelin

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00293 ,  B81B7/0041 ,  B81B2201/0271 ,  B81B2201/032 ,  B81C2203/0145

Abstract: A semiconductor device includes a first silicon layer disposed between second and third silicon layers and separated therefrom by respective first and second oxide layers. A cavity within the first silicon layer is bounded by interior surfaces of the second and third silicon layers, and a passageway extends through the second silicon layer to enable material removal from within the semiconductor device to form the cavity. A metal feature is disposed within the passageway to hermetically seal the cavity.

公开(公告)号：US20230270011A1

公开(公告)日：2023-08-24

申请号：US18174536

申请日：2023-02-24

Applicant: QUALCOMM Technologies, Inc.

Inventor： Robert John LITTRELL

IPC: H10N30/20 ,  B81B3/00 ,  H10N30/50 ,  H10N30/853

CPC classification number: H10N30/2042 ,  B81B3/0021 ,  H10N30/503 ,  H10N30/853 ,  B81B2201/032 ,  B81B2203/0118 ,  B81B2203/04

Abstract: Aspects include piezoelectric acoustic transducers and systems for acoustic transduction. In some aspects, an acoustic transducer is structured with a silicon substrate having a top surface and a bottom surface, where the top surface has a first portion and an edge along the first portion associated with an acoustic aperture. The transducer has a first silicon oxide layer disposed over the first portion of the top surface of the silicon substrate, a polysilicon layer disposed over the first silicon oxide layer, and a second silicon oxide layer disposed over the polysilicon layer. A cantilevered beam comprising a fixed end, a deflection end, a top surface, and a bottom surface, has a first portion of the bottom surface at the fixed end disposed over the second silicon oxide layer, where a second portion of the bottom surface at the deflection end is formed over the acoustic aperture. In some aspects. transducer elements are reconfigurable between parallel and serial configurations depending on a system operating mode.

公开(公告)号：US20230204974A1

公开(公告)日：2023-06-29

申请号：US18111073

申请日：2023-02-17

Applicant: STMicroelectronics S.r.l.

Inventor： Domenico GIUSTI ,  Dario PACI

IPC: G02B27/64 ,  G03B5/06 ,  H02N2/02 ,  H02N2/00 ,  B81B3/00 ,  H10N30/01 ,  H10N30/20

CPC classification number: G02B27/646 ,  B81B3/0021 ,  G03B5/06 ,  H02N2/22 ,  H02N2/028 ,  H10N30/01 ,  H10N30/2044 ,  B81B2201/032 ,  B81B2201/047 ,  B81B2203/053 ,  B81B2203/058 ,  G03B2205/0023

Abstract: A method of making a MEMS actuator with a monolithic body of semiconductor material includes forming a supporting portion of semiconductor material, orientable with respect to first and second rotation axes, the first rotation axis being transverse with respect to the second rotation axis, and forming a first frame of semiconductor material. The method further includes forming first deformable elements, of semiconductor material, coupled to the first frame, and configured to control a rotation of the supporting portion about the first rotation axis. The method also includes forming a second frame of semiconductor material, and forming second deformable elements, of semiconductor material, coupled to the first frame and to the second frame, and configured to control a rotation of the supporting portion about the second rotation axis. The first and second deformable elements are formed to carry respective first and second piezoelectric actuation elements.

公开(公告)号：US20180180871A1

公开(公告)日：2018-06-28

申请号：US15603614

申请日：2017-05-24

Applicant: STMicroelectronics S.r.l.

Inventor： Sonia Costantini ,  Marta Carminati ,  Daniela Angela Luisa Gatti ,  Laura Maria Castoldi ,  Roberto Carminati

IPC: G02B26/08 ,  B81B3/00 ,  B81C1/00 ,  G02B26/10

CPC classification number: G02B26/0833 ,  B81B3/0083 ,  B81B2201/032 ,  B81B2201/042 ,  B81B2203/0307 ,  B81B2203/058 ,  B81C1/00714 ,  B81C2203/032 ,  G02B26/105

Abstract: A micro-electro-mechanical (MEMS) device is formed in a first wafer overlying and bonded to a second wafer. The first wafer includes a fixed part, a movable part, and elastic elements that elastically couple the movable part and the fixed part. The movable part further carries actuation elements configured to control a relative movement, such as a rotation, of the movable part with respect to the fixed part. The second wafer is bonded to the first wafer through projections extending from the first wafer. The projections may, for example, be formed by selectively removing part of a semiconductor layer. A composite wafer formed by the first and second wafers is cut to form many MEMS devices.

公开(公告)号：US20180066636A1

公开(公告)日：2018-03-08

申请号：US15256197

申请日：2016-09-02

Applicant: IMMERSION CORPORATION

Inventor： Vahid Khoshkava ,  Juan Manuel Cruz Hernandez ,  Vincent Levesque

IPC: F03G7/06

CPC classification number: F03G7/065 ,  B06B1/0688 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/032 ,  C22F1/006 ,  G06F3/016

Abstract: A haptic actuator device includes a surface with a mechanical property responsive to localized temperature changes. The surface can include a layer or sheet comprising a shape-memory material. The haptic actuator device can further include an actuator configured to selectively deform a plurality of regions in the sheet; and a temperature controller adapted to control the temperatures of the plurality of regions. A method of localized actuation includes selectively controlling the temperatures of the plurality of regions to be above a shape-memory transition temperature of the shape-memory material; selectively deforming at least one of the regions; while maintaining the deformation of the at least one region, lowering the temperature of the at least one region to below the shape-memory transition temperature; subsequently withdrawing the applied stress; and thereafter heating the at least one region to above the shape-memory transition temperature, causing the region to return to its pre-deformation shape.

公开(公告)号：US09873609B2

公开(公告)日：2018-01-23

申请号：US14752496

申请日：2015-06-26

Applicant: ALPS ELECTRIC CO., LTD. ,  National Institute of Advanced Industrial Science and Technology

Inventor： Tomomasa Takatsuka ,  Isao Takahashi ,  Teppei Sugawara ,  Kenichi Mitsumori ,  Kinji Asaka ,  Takushi Sugino

IPC: H02N11/00 ,  B81B3/00 ,  F03G7/00

CPC classification number: B81B3/0021 ,  B81B2201/032 ,  F03G7/005

Abstract: A polymer actuator element includes an electrolyte layer and electrode layers, in which the electrode layer includes an activated carbon nanofiber and a carbon nanohorn.

公开(公告)号：US09676609B2

公开(公告)日：2017-06-13

申请号：US15144896

申请日：2016-05-03

Applicant: Asia Pacific Microsystems, Inc.

Inventor： Jerwei Hsieh

IPC: H01L21/4763 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B7/0058 ,  B81B2201/032 ,  B81C1/00238 ,  B81C1/00817 ,  B81C1/00825 ,  B81C2201/053 ,  B81C2201/056 ,  B81C2203/0785

Abstract: An integrated MEMS device is provided. The integrated MEMS device comprises a circuit chip and a device chip. The circuit chip has a patterned first bonding layer disposed thereon, the bonding layer being composed of a conductive material/materials. The device chip has a first structural layer and a second structural layer, the first structural layer being connected to the second structural layer and the first bonding layer of the circuit chip, and being sandwiched between the second structural layer and the circuit chip. A plurality of hermetic spaces are enclosed by the first structural layer, the second structural layer, the first bonding layer and the circuit chip.

公开(公告)号：US20170003500A1

公开(公告)日：2017-01-05

申请号：US15265323

申请日：2016-09-14

Applicant: SUMITOMO PRECISION PRODUCTS CO., LTD.

Inventor： Ryohei UCHINO

IPC: G02B26/08 ,  H01L41/053

CPC classification number: G02B26/0858 ,  B81B3/0048 ,  B81B2201/032 ,  B81B2201/033 ,  B81B2201/042 ,  B81B2203/058 ,  G02B26/0841 ,  H01L41/053 ,  H01L41/094

Abstract: A mirror device 300 disclosed herein includes: a base 302; a mirror 305; an actuator 306; an extension 304 provided on the other side of the mirror 305 with respect to an X-axis opposite from the actuator 306; a fixed comb electrode 308; and a movable comb electrode 307 provided on the other side of the mirror 305 with respect to the X-axis opposite from the actuator 306. The movable comb electrode 307 includes: a beam portion 371 coupled to the mirror 305 via a hinge 373; and electrode fingers 372 provided for the beam portion 371. The extension 304 is coupled to the base 302 via a hinge 341, and the mirror 305 tilts around a principal axis passing through the hinge 341.

Abstract translation: 本文公开的镜装置300包括：基座302; 镜子305; 致动器306; 相对于与致动器306相对的X轴设置在反射镜305的另一侧上的延伸部304; 固定梳电极308; 以及相对于与致动器306相对的X轴设置在反射镜305的另一侧上的可动梳状电极307.可动梳状电极307包括：经由铰链373联接到反射镜305的梁部分371; 以及为梁部分371提供的电极指372.延伸部分304经由铰链341连接到基座302，并且反射镜305围绕穿过铰链341的主轴线倾斜。