公开(公告)号：US07098534B2

公开(公告)日：2006-08-29

申请号：US10815465

申请日：2004-03-31

Applicant: Shawn L. Lloyd ,  John G. Oldendorf ,  Michael Kochanowski ,  Scott Gilbert

Inventor： Shawn L. Lloyd ,  John G. Oldendorf ,  Michael Kochanowski ,  Scott Gilbert

IPC: H01L23/34 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L23/62 ,  H01L2224/16 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10181 ,  H05K2201/10204 ,  H05K2201/2036 ,  H05K2203/1572 ,  Y10T29/49105 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.

Abstract translation: 一种器件包括衬底。 衬底还包括包括多个焊盘的第一主表面和第二主表面。 至少一个部件附接到第一主表面上的多个焊盘中的至少一些。 至少一个牺牲部件附接到第一主表面。 所述至少一个部件相对于所述第一主表面具有第一高度，并且所述至少一个牺牲部件相对于所述第一主表面具有第二高度。 第二个高度大于第一个高度。 牺牲部件包括保险丝。

公开(公告)号：US20060049777A1

公开(公告)日：2006-03-09

申请号：US10532822

申请日：2003-09-26

Applicant: Jun Kumagai ,  Akihiro Kishimoto ,  Hirofumi Konishi

Inventor： Jun Kumagai ,  Akihiro Kishimoto ,  Hirofumi Konishi

IPC: H05B37/02

CPC classification number: H02M1/4208 ,  H02M7/53871 ,  H05B41/2883 ,  H05B41/2888 ,  H05K1/0254 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09645 ,  H05K2201/09972 ,  H05K2201/10196 ,  H05K2201/10204 ,  Y02B20/202 ,  Y02B20/204 ,  Y02B70/126

Abstract: A full bridge circuit including four switching elements (Q1 to Q4) is alternated with a high switching frequency and a series-connected resonance circuit (5) including an inductor (L2) and a capacitor (C2) is made to resonate at a switching frequency of the full bridge circuit multiplied by an integer (for example, frequency multiplied by three), thereby generating a high voltage pulse for start up. After a high-pressure discharge lamp (DL) is started up, the full bridge circuit is alternated with a low switching frequency so as to operate as a step-down chopper for inverting the output polarity, thereby stably supplying rectangular wave voltage of low frequency to the high-pressure discharge lamp (DL) via a filter circuit including an inductor (L1) and a capacitor (C1).

公开(公告)号：US20050218516A1

公开(公告)日：2005-10-06

申请号：US10815465

申请日：2004-03-31

Applicant: Shawn Lloyd ,  John Oldendorf ,  Michael Kochanowski ,  Scott Gilbert

Inventor： Shawn Lloyd ,  John Oldendorf ,  Michael Kochanowski ,  Scott Gilbert

IPC: H01L23/52 ,  H01L23/62 ,  H05K1/14 ,  H05K3/34

CPC classification number: H01L23/62 ,  H01L2224/16 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10181 ,  H05K2201/10204 ,  H05K2201/2036 ,  H05K2203/1572 ,  Y10T29/49105 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: A device includes a substrate. The substrate further includes a first major surface including a plurality of lands, and a second major surface. At least one component is attached to at least some of the plurality of pads on the first major surface. At least one sacrificial component is attached to the first major surface. The at least one component has a first height with respect to the first major surface, and the at least one sacrificial component has a second height with respect to the first major surface. The second height is greater than the first height. The sacrificial component includes a fuse.

Abstract translation: 一种器件包括衬底。 衬底还包括包括多个焊盘的第一主表面和第二主表面。 至少一个部件附接到第一主表面上的多个焊盘中的至少一些。 至少一个牺牲部件附接到第一主表面。 所述至少一个部件相对于所述第一主表面具有第一高度，并且所述至少一个牺牲部件相对于所述第一主表面具有第二高度。 第二个高度大于第一个高度。 牺牲部件包括保险丝。

公开(公告)号：US20050195586A1

公开(公告)日：2005-09-08

申请号：US11053478

申请日：2005-02-08

Applicant: Elio Marioni

Inventor： Elio Marioni

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K7/02

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

Abstract: The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die.

Abstract translation: 本发明涉及一种基本上包装状的分立电子部件，其类型包括主电源电路，主体或壳体，基本上平行六面体的电连接销和连接在主体内的所述电路的电连接销，并从所述主体突出以进行电连接 在电子印刷电路板上。 主体具有散热头部，其具有至少一个从主体出来并放置在平面上的表面，而销从主体突出出来，第一部分最初平行于平面延伸。 有利的是，在第一部分平行于平面之后，一对销具有基本上U形的弯曲，以便在焊接到散热中间管芯的步骤期间允许部件的更稳定的轴承。

公开(公告)号：US06890795B1

公开(公告)日：2005-05-10

申请号：US10748736

申请日：2003-12-30

Applicant: Ee Hua Wong ,  Ranjan Rajoo ,  Poi Siong Teo

Inventor： Ee Hua Wong ,  Ranjan Rajoo ,  Poi Siong Teo

IPC: B23K1/00 ,  H01L21/44 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/11 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/0379 ,  H05K2201/10204 ,  H05K2203/0338 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00

Abstract: We disclose a technique to generate stretched solder columns (bumps) at the wafer level, suitable for wafer level packaging. This is accomplished through use of using two wafers—the standard (functional) wafer that contains the integrated circuits and a master (dummy) wafer on whose surface is provided an array of solder bumps that is the mirror image of that on the functional wafer. After suitable alignment, both sets of solder bumps are melted and then slowly brought together till they merge. Then, as they cool, they are slowly pulled apart thereby stretching the merged solder columns. Once the latter have fully solidified, they are separated from the master wafer only.

Abstract translation: 我们公开了一种在晶圆级产生拉伸焊料柱（凸块）的技术，适用于晶圆级封装。 这通过使用两个晶片 - 包含集成电路的标准（功能）晶片和主表面（虚拟）晶片来实现，其中表面设置有作为功能晶片上的镜像的焊料凸块阵列。 在适当的对准之后，将两组焊料凸起熔化，然后缓慢地接合在一起直到它们合并。 然后，当它们冷却时，它们被缓慢地分开，从而拉伸合并的焊料柱。 一旦后者完全凝固，它们就只与主晶片分离。

公开(公告)号：US20040245674A1

公开(公告)日：2004-12-09

申请号：US10820011

申请日：2004-04-08

Inventor： Chee Kiang Yew ,  Piau Fong ,  Keng Siew Matthew Chua

IPC: B29C031/00

CPC classification number: H05K3/284 ,  H05K1/117 ,  H05K3/0052 ,  H05K2201/10204 ,  H05K2203/1316

Abstract: The present invention provides methods for packaging small size memory cards wherein the methods comprise molding over a populated printed circuit board, thereby an encapsulated memory card is obtained with desirable external dimensions and features. In one aspect of the invention, methods are provided for preventing mold bleed underneath of the contact pads of memory cards. In one embodiment, the mold bleeding is prevented by using slidable holding pins that exert pressure directly upon the contact pins during the molding process. In another embodiments, the mold bleeding is prevented by covering the contact pads with temporary substrate coverage during the molding process. In yet another embodiment, the mold bleeding is prevented by using pressing edges that exert pressure directly upon the area of contact pads during the molding process. In still another embodiment, the mold bleeding is prevented by using vacuum pressure to secure the populated PCB onto the bottom of a molding apparatus. In yet still another embodiment, the mold bleeding is prevented by mounting dummy components onto the area opposite to the contact pads in a populated PCB, thereby the dummy components exert direct pressure to the contact pads during the molding process.

Abstract translation: 本发明提供了用于封装小尺寸存储卡的方法，其中所述方法包括在填充的印刷电路板上成型，由此获得具有期望的外部尺寸和特征的封装的存储卡。 在本发明的一个方面，提供了用于防止存储卡接触垫下面的模具泄漏的方法。 在一个实施例中，通过使用在模制过程中直接施加在接触销上的压力的可滑动的保持销来防止模具渗出。 在另一个实施例中，通过在模制过程中用临时衬底覆盖覆盖接触垫来防止模具渗出。 在另一个实施例中，通过使用在模制过程中直接施加压力的接触垫区域的压边来防止模具渗出。 在另一个实施例中，通过使用真空压力来防止模具渗出，以将填充的PCB固定在模制设备的底部上。 在另一个实施例中，通过将虚拟部件安装到与填充PCB中的接触焊盘相对的区域上来防止模具渗出，由此在模制过程中，虚拟部件对接触焊盘施加直接的压力。

公开(公告)号：US20020186552A1

公开(公告)日：2002-12-12

申请号：US10212698

申请日：2002-08-07

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Suzushi Kimura ,  Tsuyoshi Himori ,  Koji Hashimoto

IPC: H05K003/30 ,  H05K001/18 ,  H05K001/14

CPC classification number: H05K1/184 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/161 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172

Abstract: The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same. According to the invention, since a desired circuit is composed by disposing a specific number of chip components according to a specified rule, it is not necessary to heat the buried chip components at high temperature when forming a module, chip components are obtained in specified values, and the circuit characteristics, functions, and dimensional precision are stably obtained exactly as designed, and moreover since the chip components are disposed according to a specified rule, it is easy to automate insertion of chip components and increase its operation speed, even if the size of the chip components is reduced, and the circuit composition may be flexibly and easily changed only by changing the inserting position and type of chip components.

Abstract translation: 本发明涉及一种具有埋入电路板中的芯片组件的模块组件及其制造方法，更具体地说，涉及一种能够获得希望的电路特性并能够稳定地工作的模块组件，如果该组件的尺寸减小 ，非常有效地生产并且适合于机器安装及其制造方法。 根据本发明，由于根据规定通过设置特定数量的芯片部件来构成所需的电路，因此在形成模块时不需要在高温下加热埋层芯片部件，以特定值获得芯片部件 ，并且电路特性，功能和尺寸精度都按照设计得到稳定的获得，而且由于芯片部件按照规定进行配置，因此即使是 芯片部件的尺寸减小，并且仅通过改变芯片部件的插入位置和类型可以灵活且容易地改变电路组成。

公开(公告)号：US06443355B1

公开(公告)日：2002-09-03

申请号：US09710389

申请日：2000-11-09

Applicant: Arata Tsurusaki

Inventor： Arata Tsurusaki

IPC: B23K3102

CPC classification number: B23K1/008 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/3494 ,  H05K2201/10204 ,  H05K2203/081 ,  H05K2203/1121 ,  H05K2203/1581 ,  H05K2203/304

Abstract: A soldering method and apparatus in which there is provided a tight contact cover tightly contacting a portion (unused portion) of a re-flow panel other than its portion facing a substrate to be soldered in such a manner as to suppress a hot wind tending to turn around to a part setting surface to diminish the thermal energy loss as well as to prevent the circuit quality from being lowered by the solder.

Abstract translation: 一种焊接方法和装置，其中设置有紧密接触盖，其紧密接触除了要被焊接的衬底之外的再流动面板的部分（未使用部分）以外的部分（未使用部分），以抑制热风倾向于 转向零件设置表面以减少热能损失，并且防止电路质量被焊料降低。

公开(公告)号：US20020089086A1

公开(公告)日：2002-07-11

申请号：US10040118

申请日：2002-01-03

Inventor： Bruce W. Lee ,  Jesse L. Pedigo

IPC: B29C039/10

CPC classification number: H05K3/1233 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0126 ,  H05K2203/0139 ,  H05K2203/0156 ,  H05K2203/0182 ,  H05K2203/0554 ,  H05K2203/1105

Abstract: An assembly is disclosed that includes an etched hole-fill standoff; a tooling plate contacting the etched hole-fill stand-off, the stand-off and tooling plate being aligned to each other; a device having holes to be filled removably contacting the stand-off, the stand-off and device being aligned to each other; the device and the stand-off each having at least one hole, the hole of the device being aligned with the hole of the stand-off. An assembly is also disclosed comprising an etched hole-fill standoff, the stand-off comprising an etched layer bonded to a non-etched layer. A method of filling holes in a substrate having a plurality of holes to be filled includes the steps of providing an etched hole-fill stand-off, aligning the stand-off to a tooling plate, aligning the substrate to the stand off and placing the substrate in contact with the stand-off, and filling the plurality of holes of the substrate.

Abstract translation: 公开了一种组件，其包括蚀刻孔填充间隙; 与蚀刻的孔填充支座接触的工具板，支架和工具板彼此对准; 具有可拆卸地接触所述支架的孔的装置，所述支架和所述装置彼此对准; 所述装置和所述支架各自具有至少一个孔，所述装置的孔与所述支架的孔对齐。 还公开了一种组件，其包括蚀刻的孔填充支座，所述支座包括结合到非蚀刻层的蚀刻层。 在具有多个要填充的孔的基板中填充孔的方法包括以下步骤：提供蚀刻的孔填充支座，将支座对准工具板，将基板对准支架并将其 基板与支座接触，并填充基板的多个孔。

公开(公告)号：US20020029486A1

公开(公告)日：2002-03-14

申请号：US09931413

申请日：2001-08-17

Inventor： Hiroshi Uchiyama ,  Tetsutarou Hachimura ,  Osamu Okuda ,  Noriaki Yoshida

IPC: G01D021/00

CPC classification number: H05K3/0008 ,  H05K1/0269 ,  H05K3/303 ,  H05K13/08 ,  H05K2201/09918 ,  H05K2201/10204

Abstract: An offset measuring board is formed of a rectangular metal plate which can be positioned to a component mounting position by a positioning device and which has at least in proximity to one corner portion thereof a recognition through hole, as a recognition mark, having a black bottom face within a recessed portion.

Abstract translation: 偏移测量板由矩形金属板形成，该矩形金属板可以通过定位装置定位到部件安装位置，并且至少在其一个角部附近具有识别通孔，作为识别标记，具有黑色底部 面对凹陷部分。