公开(公告)号：US5552209A

公开(公告)日：1996-09-03

申请号：US283096

申请日：1994-07-29

Applicant: Jeffrey W. McCutcheon

Inventor： Jeffrey W. McCutcheon

IPC: H05K1/02 ,  H05K1/03 ,  B32B9/00

CPC classification number: H05K1/0271 ,  H05K1/036 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/2045 ,  Y10T428/24917 ,  Y10T428/251 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/31507 ,  Y10T428/31511 ,  Y10T428/31605 ,  Y10T428/31681

Abstract: The present invention provides a method of improving the vibrational damping characteristics of a circuit article. The method involves adding damping layer(s) to the laminate material that is processed into a circuit article. The damping material effectively increases the damping of the circuit article and reduces the amplitude of resonant frequencies of the circuit article excited by environmental vibrations or shocks that the circuit board may encounter in use and thereby potentially improving the performance of the circuit article for vibration and shock related performance issues without the addition of add-on dampers to the circuit articles surface or by isolating the circuit board by means of vibration and shock isolators.

Abstract translation: 本发明提供一种改善电路制品的振动阻尼特性的方法。 该方法包括将阻尼层加到被加工成电路制品的层压材料中。 阻尼材料有效地增加了电路制品的阻尼，并减小了电路板在使用中可能遇到的环境振动或冲击而激励的电路产品的谐振频率的振幅，从而潜在地改善了用于振动和冲击的电路制品的性能 没有在电路制品表面添加附加阻尼器，或者通过振动和冲击隔离器隔离电路板。

公开(公告)号：US4872937A

公开(公告)日：1989-10-10

申请号：US220857

申请日：1988-07-14

Applicant: Thomas E. Gouldy

Inventor： Thomas E. Gouldy

IPC: C09J7/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: C09J7/0289 ,  C09J7/0242 ,  H05K3/305 ,  H05K3/306 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2201/61 ,  H05K2201/0133 ,  H05K2201/10068 ,  H05K2201/10462 ,  H05K2201/10651 ,  H05K2201/2036 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/0278 ,  H05K3/301 ,  H05K3/3447 ,  H05K3/3468 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T428/249983

Abstract: A mounting entity comprises, in layered order, a pressure sensitive adhesive, a foam spacer, a second pressure sensitive adhesive, a filler, and a heat sensitive adhesive. The first pressure sensitive adhesive is attached to an electrical component which is then mounted upon a printed circuit with the heat sensitive adhesive in contact therewith. The passing of the board over a solder wave heats the top surface of the board to a temperature high enough to activate the heat sensitive adhesive and adhere the component to the board. The intermediate foam layer dampens shock and vibration.

Abstract translation: 安装实体分层包含压敏粘合剂，泡沫隔离物，第二压敏粘合剂，填料和热敏粘合剂。 第一压敏粘合剂附接到电气部件，然后将电子部件安装在印刷电路上，其中热敏粘合剂与其接触。 板上通过焊波将板的顶表面加热到足够高的温度以激活热敏粘合剂并将该部件粘附到板上。 中间泡沫层可抑制冲击和振动。

公开(公告)号：US4566231A

公开(公告)日：1986-01-28

申请号：US536555

申请日：1983-09-27

Applicant: Francis X. Konsevich

Inventor： Francis X. Konsevich

IPC: E04B1/98 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0271 ,  E04B1/98 ,  H05K1/18 ,  H05K2201/0133 ,  H05K2201/2009 ,  H05K2201/2045

Abstract: A vibration dampening stiffener beam (10, 10') is secured to a panel member, such as an electrical circuit board (12) that is supported at opposed ends. The beam (10, 10') extends across a mid portion of the board (12) whereat displacement of the board caused by vibration is at a maximum. The beam is an "I" beam or an inverted "T" beam. It has a mounting flange (22, 22') which is bonded or otherwise secured to the member (12) which it is to stiffen. An energy absorbing material (30) is placed on the sides of the web (24, 24') of the beam (10, 10"). This material (30) consists of thin metal constraining layers (32) bonded to each other and to the side surfaces of the web by means of a viscoelastic material (34).

Abstract translation: 减振加强梁（10,10'）固定到面板构件，例如在相对端支撑的电路板（12）。 梁（10,10'）横跨板（12）的中间部分延伸，其中由振动引起的板的位移最大。 光束是“I”光束或反向“T”光束。 其具有安装法兰（22,22'），该安装法兰（22,22'）被结合或以其他方式固定到要加固的构件（12）上。 能量吸收材料（30）被放置在梁（10,10“）的腹板（24,24'）的侧面上。 这种材料（30）由薄的金属约束层（32）组成，它们通过粘弹性材料（34）彼此粘合到纤维网的侧表面。

公开(公告)号：US3631297A

公开(公告)日：1971-12-28

申请号：US3631297D

申请日：1969-02-12

Applicant: DYNALECTRON CORP

Inventor： CONNER ARTHUR P

IPC: H05K1/02 ,  H05K3/00 ,  H05K5/06 ,  H05K1/04

CPC classification number: H05K1/0271 ,  H05K3/0058 ,  H05K5/06 ,  H05K2201/0133 ,  H05K2201/10598 ,  H05K2201/2045

Abstract: A mounting for a large printed circuit board having a widespread number of short projections extending out from a surface to be supported. A slice of easily impressionable rigid foam plastic is sandwiched between the printed circuit board and a base of rigid metal. The projections are impressed into the plastic foam to provide retaining cavities, and a series of screws extend through said board at a margin closely adjacent its edge, extending through the foam and into the base.

公开(公告)号：US20240357737A1

公开(公告)日：2024-10-24

申请号：US18761920

申请日：2024-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaeyong PARK ,  Kwangha SHIN

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/2045

Abstract: An electronic device includes a first circuit board and a second circuit board spaced apart from each other, a flexible circuit board connecting the first circuit board to the second circuit board, the flexible circuit board including an extension portion which extends between the first circuit board and the second circuit board in an extending direction of the flexible circuit board, and a shock absorber facing the extension portion of the flexible circuit board in a facing direction, the shock absorber moveable along the facing direction by movement of the extension portion of the flexible circuit board along the extending direction.

公开(公告)号：US11832410B2

公开(公告)日：2023-11-28

申请号：US17474491

申请日：2021-09-14

Applicant: PURE STORAGE, INC.

Inventor： Dominique Brych

IPC: H05K7/14 ,  H05K1/02 ,  H04L67/1097

CPC classification number: H05K7/14 ,  H05K1/0271 ,  H04L67/1097 ,  H05K2201/2045

Abstract: An apparatus includes a body having one or more protrusions from a surface of the body, wherein each of the protrusions has a corresponding coupling positioned at a corresponding end of each of the protrusions. The apparatus further includes one or more mechanical energy storage components, wherein each of the one or more mechanical energy storage components provide a force that is greater than an external force exerted on the apparatus.

公开(公告)号：US10028386B2

公开(公告)日：2018-07-17

申请号：US15297865

申请日：2016-10-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Heung Kil Park ,  Jong Hwan Park ,  Young Ghyu Ahn

IPC: H01G4/38 ,  H05K1/18 ,  H01G4/005 ,  H01G4/018 ,  H01G4/228 ,  H01G4/30 ,  H01G9/042 ,  H01G9/08 ,  H01G15/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01G4/005 ,  H01G4/018 ,  H01G4/224 ,  H01G4/228 ,  H01G4/30 ,  H01G4/38 ,  H01G9/008 ,  H01G9/042 ,  H01G9/08 ,  H01G15/00 ,  H05K1/0243 ,  H05K1/111 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A composite electronic component includes a multilayer capacitor; a tantalum capacitor; a lead frame disposed between the multilayer capacitor and the tantalum capacitor and electrically connecting the multilayer capacitor and the tantalum capacitor to each other; and an encapsulation member encapsulating the multilayer capacitor and the tantalum capacitor so that a portion of the lead frame is exposed.

公开(公告)号：US10021779B1

公开(公告)日：2018-07-10

申请号：US15824915

申请日：2017-11-28

Applicant: TopLine Corporation

Inventor： Martin B. Hart

IPC: H05K1/00 ,  H05K7/14 ,  H01B1/00 ,  H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K2201/2045

Abstract: An apparatus and system for attaining quick response to vibration damping of a printed circuit board (PCB) or other planar surface utilizing a defined travel displacement of a single spherical tungsten (or other material) ball in a single or plurality of sealed spherical chambers in a particle impact damper (PID). The single spherical tungsten (or other material) ball is not weighed down, constrained, encumbered or influenced by other spherical balls within the chamber; accordingly, providing unrestricted freedom for the ball to quickly respond at the first occurrence of excessive vibrational acceleration over 1G. The structure of a single spherical particle within a sealed spherical chamber also provides a path of minimum distance for the ball to travel before colliding with the ceiling or side walls of the PID chamber. A plurality of spherical chambers can be arranged in a variety of patterns within the PID housing such as desired. The PID housing can be any shape such as a cube, a rectangular cuboid, a cylinder, sphere, triangular tetrahedron, triangular prism, polygon, toroid or any combination of shapes.

公开(公告)号：US20180132346A1

公开(公告)日：2018-05-10

申请号：US15798578

申请日：2017-10-31

Applicant: Japan Display Inc.

Inventor： Atsuhiro Yamano ,  Shinichi Nukumizu

IPC: H05K1/02 ,  H05K1/18 ,  H01G4/12 ,  H05B33/08 ,  H01G4/30

CPC classification number: H05K1/0271 ,  H01G4/12 ,  H01G4/30 ,  H05B33/0821 ,  H05K1/18 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/2045

Abstract: According to one embodiment, an electronic device includes a circuit board and a circuit component on an upper surface or a lower surface of the circuit board. The circuit component includes a first ceramic capacitor and a second ceramic capacitor. Vibration characteristics of the first ceramic capacitor and a second ceramic capacitor are opposed to each other. The first ceramic capacitor is near the second ceramic capacitor to cause vibrations of the first and second ceramic capacitors to cancel each other.

公开(公告)号：US09875838B2

公开(公告)日：2018-01-23

申请号：US14852094

申请日：2015-09-11

Applicant: ROLLS-ROYCE PLC

Inventor： David Brookes

IPC: H01F27/28 ,  H01F27/10 ,  H01F27/02 ,  H01F27/22 ,  H01F27/06 ,  H01F30/16 ,  H05K1/02 ,  H01F27/24 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01F27/22 ,  H01F27/06 ,  H01F27/24 ,  H01F27/2895 ,  H01F30/16 ,  H01F2027/065 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10568 ,  H05K2201/2045

Abstract: A surface mountable, toroid magnetic device is provided, the device having a potting filling the central hole of the toroid. The potting extends axially beyond the base of the toroid to form a contact surface which, in use, contacts a mounting body for the device. Heat generated by the device flows by conduction through walls of the toroid defining the central hole into the potting and then through the contact surface into the mounting body.