公开(公告)号：US11973486B2

公开(公告)日：2024-04-30

申请号：US17442702

申请日：2020-03-09

Applicant: KYOCERA Corporation

Inventor： Sinichiro Kitanishi ,  Akira Oikawa

IPC: H05K1/18 ,  H01L23/08 ,  H03H3/08 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25 ,  H05K3/28 ,  H05K3/34

CPC classification number: H03H9/059 ,  H01L23/08 ,  H03H3/08 ,  H03H9/1064 ,  H03H9/25 ,  H05K1/185 ,  H05K3/284 ,  H05K3/341 ,  H05K2201/10068

Abstract: An electronic component includes an insulating surrounding member surrounding the electronic element while allowing a first surface of the electronic element to be exposed from a second surface of the surrounding member. A wiring board faces a third surface comprising the first and second surfaces. An insulating joining member is interposed between the third surface and the wiring board and joins the third surface and the wiring board together. A conductive bump, located between the third surface and the wiring board, electrically connects the electronic element and the wiring board. The joining member has a first through hole that overlaps a vibration region in the first surface in perspective plan view. The joining member has a second through hole that accommodates the bump. At least a portion of at least one of the first through hole or the second through hole overlaps the second surface in perspective plan view.

公开(公告)号：US20190246500A1

公开(公告)日：2019-08-08

申请号：US16389598

申请日：2019-04-19

Applicant: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.

Inventor： Atsushi Takano ,  Mitsuhiro Furukawa ,  Ichiro Kameyama ,  Tetsuya Uebayashi

IPC: H05K1/18 ,  H01L23/31 ,  H03H9/05 ,  H03H9/25 ,  H05K1/11 ,  H03H9/10 ,  H03H9/17 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/3135 ,  H01L2224/16225 ,  H01L2924/181 ,  H03H9/0523 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1085 ,  H03H9/17 ,  H03H9/25 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/10068 ,  H01L2924/00012

Abstract: A method of manufacturing an electronic device includes preparing an electronic component including a first substrate on a main surface of which a functional unit and a first resin layer are formed. The first resin layer has a first surface facing the main surface of the first substrate, a second surface opposed to the first surface, a cavity on the first surface enclosing the functional unit, and a portion defining a wall of the cavity. The first resin layer defines a recess provided with a solder layer on the second surface. The method further includes preparing a second substrate having an electrode pad formed on a main surface, aligning the electronic component with the second substrate to layer the solder layer and the electrode pad in contact with the solder layer, and forming the electronic component and the second substrate into the electronic device.

公开(公告)号：US20180062611A1

公开(公告)日：2018-03-01

申请号：US15681153

申请日：2017-08-18

Applicant: WISOL CO., LTD.

Inventor： Jong Soo HA ,  Eun Tae PARK ,  Bong Soo KIM ,  Jung Hoon HAN ,  Chang Dug KIM

IPC: H03H9/02 ,  H05K1/18 ,  H03H3/02 ,  H05K3/32

CPC classification number: H03H9/02992 ,  H03H3/02 ,  H03H9/059 ,  H03H9/1085 ,  H05K1/181 ,  H05K3/28 ,  H05K3/32 ,  H05K2201/032 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10568 ,  H05K2201/10674 ,  H05K2201/2036

Abstract: Disclosed is a radiofrequency (RF) module including a surface acoustic wave (SAW) device that includes a piezoelectric substrate, an interdigital transducer (IDT) electrode and an input/output electrode formed on one surface of the piezoelectric substrate, and a bump joined to the input/output electrode, a printed circuit board (PCB) that includes a terminal corresponding to the input/output electrode and on which the SAW device is mounted to join the bump to the terminal, a molding portion that covers the SAW device, and a dam portion that surrounds the IDT electrode, the input/output electrode, and the bump not to allow a molding material that forms the molding portion to penetrate a space in which the IDT electrode, the input/output electrode, and the bump are arranged.

公开(公告)号：US09838766B2

公开(公告)日：2017-12-05

申请号：US15004669

申请日：2016-01-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Il Nam Kim ,  Won Sang Park ,  Yi Joon Ahn ,  Byeong-Hee Won

IPC: H04R1/00 ,  H04R1/02 ,  G02B5/30 ,  H05K1/14

CPC classification number: H04R1/028 ,  G02B5/3033 ,  H04R1/025 ,  H04R2201/029 ,  H04R2499/15 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: Provided is a speaker and microphone integrated display panel including: a display panel having a display area and a non-display area surrounding the display area; and a simultaneously convertible film type speaker or film type microphone which is mounted to correspond to an air hole in the non-display area, in which the display panel and the film type speaker or the film type microphone are at least partially integrated so as to be drive-connected.

公开(公告)号：US20170290160A1

公开(公告)日：2017-10-05

申请号：US15472453

申请日：2017-03-29

Applicant: SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.

Inventor： Atsushi Takano ,  Mitsuhiro Furukawa ,  Ichiro Kameyama ,  Tetsuya Uebayashi

IPC: H05K1/18 ,  H03H9/25 ,  H03H9/17 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L23/3135 ,  H01L2224/16225 ,  H01L2924/181 ,  H03H9/0523 ,  H03H9/059 ,  H03H9/1042 ,  H03H9/1085 ,  H03H9/17 ,  H03H9/25 ,  H05K1/111 ,  H05K3/303 ,  H05K2201/10068 ,  H01L2924/00012

Abstract: An electronic component may include a substrate having a functional unit formed on a main surface of the substrate and a first resin layer formed on the main surface, the first resin layer having a first surface facing the main surface and a second surface opposed to the first surface, the first resin layer defining a cavity on the first surface enclosing the functional unit, the first resin layer defining a recess on the second surface, and a solder layer being formed in the recess so as not to exceed the second surface in a thickness direction. The functional unit may include a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion. The substrate may be formed of dielectric material.

公开(公告)号：US09769934B2

公开(公告)日：2017-09-19

申请号：US14798859

申请日：2015-07-14

Applicant: Seiko Epson Corporation

Inventor： Tetsuro Miyao ,  Hideki Ishigami ,  Yukihiko Shiohara ,  Tetsuya Otsuki ,  Hidefumi Nakamura

IPC: B32B3/10 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K3/3463 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/0435 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.

公开(公告)号：US09468105B2

公开(公告)日：2016-10-11

申请号：US14659178

申请日：2015-03-16

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu Kondo

IPC: H03L1/02 ,  H05K1/18 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/18 ,  H05K1/0212 ,  H05K3/4697 ,  H05K2201/09845 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10515 ,  H05K2201/10553 ,  H05K2201/1056

Abstract: An electronic component includes a pedestal plate that has a first surface made of a metal and a second surface being an opposite surface to the first surface, a heating element arranged on the first surface of the pedestal plate, and a resonator element arranged on the heating element. The pedestal plate overlaps the resonator element in a plan view.

Abstract translation: 一种电子部件，包括具有由金属构成的第一表面和与第一表面相反的表面的第二表面的基座板，布置在基座板的第一表面上的加热元件和布置在加热器上的谐振元件 元件。 基座板在平面图中与谐振器元件重叠。

公开(公告)号：US09360378B2

公开(公告)日：2016-06-07

申请号：US14395467

申请日：2013-04-03

Applicant: CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (C.N.R.S.) ,  UNIVERSITE DE FRANCHE-COMTE

Inventor： Sylvain Ballandras ,  Bruno Francois

IPC: H05K7/00 ,  G01K11/26 ,  H05K1/02 ,  B23K1/00 ,  H05K1/18 ,  H05K3/28 ,  H05K1/03 ,  H05K1/05 ,  H05K3/10 ,  H05K3/34

CPC classification number: G01K11/265 ,  B23K1/0016 ,  B23K2101/38 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0293 ,  H05K1/0306 ,  H05K1/053 ,  H05K1/181 ,  H05K3/103 ,  H05K3/285 ,  H05K3/3426 ,  H05K2201/1006 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electrical device includes a first electrical component and a second electrical component connected to each other via an electrical connection having an electrically insulating support plate and a weld joint deposited on the support plate. The weld joint has a melting temperature (Ta) significantly lower than an ambient operating temperature (Ta) to which at least one of the two electrical components and the electrical connection are subjected. The electrical device includes cement that completely covers the exposed weld joint. The material of the cement is chosen to maintain its adhesion and its tightness with respect to the weld joint when the Ta is applied.

Abstract translation: 电气设备包括通过电连接彼此连接的第一电气部件和第二电气部件，该电气连接具有电绝缘支撑板和沉积在支撑板上的焊接接头。 焊接接头具有明显低于两个电气部件和电连接中的至少一个所承受的环境工作温度（Ta）的熔化温度（Ta）。 电气设备包括完全覆盖暴露的焊接接头的水泥。 当施加Ta时，选择水泥的材料以保持其粘合性和相对于焊接接头的密封性。

公开(公告)号：US20160021752A1

公开(公告)日：2016-01-21

申请号：US14798859

申请日：2015-07-14

Applicant: Seiko Epson Corporation

Inventor： Tetsuro MIYAO ,  Hideki ISHIGAMI ,  Yukihiko SHIOHARA ,  Tetsuya OTSUKI ,  Hidefumi NAKAMURA

IPC: H05K1/18 ,  H05K5/00 ,  C04B41/88

CPC classification number: H05K3/3463 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/0435 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.

Abstract translation: 封装基座包括封装体基体和在封装基体上以平面图形式设置成框状或环形的接合金属层，其中，接合金属层含有含有Ti-Ag-Cu的合金和属于金属的金属 到周期表中的第6组。

公开(公告)号：US20150036304A1

公开(公告)日：2015-02-05

申请号：US14326071

申请日：2014-07-08

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Motoi YAMAUCHI ,  Osamu KAWACHI

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H01L21/561 ,  H01L23/04 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/181 ,  H03H9/02913 ,  H03H9/1007 ,  H03H9/1085 ,  H03H2009/0019 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0305 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2201/10537 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

Abstract translation: 电子设备包括：布线基板; 通过凸块倒装安装在布线基板的上表面上的多个器件芯片具有露出器件芯片与布线基板的上表面之间的凸块的间隙，并且包括至少一个器件芯片， 具有大于所述布线基板的热膨胀系数的热膨胀系数的基板; 连接到所述多个器件芯片的接合衬底，并且具有等于或小于所述至少一个器件芯片中包括的衬底的热膨胀系数的热膨胀系数; 以及覆盖接合基板的密封件，并且密封多个器件芯片。