公开(公告)号：US12122909B2

公开(公告)日：2024-10-22

申请号：US17261471

申请日：2019-08-09

Applicant: LG CHEM, LTD.

Inventor： Ki Jae Lee ,  Young In Yang ,  Youngwook Son ,  Mooho Hong ,  Byoungkue Jeon ,  Young Young Hwang

IPC: C08L69/00 ,  C08G64/08 ,  C08G64/24

CPC classification number: C08L69/00 ,  C08G64/081 ,  C08G64/24 ,  C08L2201/08

Abstract: The present disclosure relates to a polycarbonate and a preparation method thereof, which has a novel structure with an improvement in weather resistance and refractive index, while having excellent mechanical properties.

公开(公告)号：US12115754B2

公开(公告)日：2024-10-15

申请号：US17776157

申请日：2020-11-26

Applicant: DIC Corporation

Inventor： Takamichi Aoki ,  Tomomichi Kanda

IPC: B32B15/08 ,  B32B3/00 ,  B32B3/30 ,  B32B15/085 ,  B32B27/20 ,  C08G75/0204 ,  C08K3/26 ,  C08K7/02 ,  C08K7/14 ,  C08L23/00 ,  C08L77/10 ,  C08L81/02 ,  C08L91/06 ,  C08L101/00 ,  C23C18/16 ,  C23C18/20 ,  C23C18/24 ,  C23C30/00 ,  C25D5/56 ,  C25D3/38

CPC classification number: B32B15/08 ,  B32B3/00 ,  B32B3/30 ,  B32B15/085 ,  B32B27/20 ,  C08G75/0204 ,  C08K3/26 ,  C08K7/02 ,  C08K7/14 ,  C08L23/00 ,  C08L77/10 ,  C08L81/02 ,  C08L91/06 ,  C08L101/00 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/2066 ,  C23C18/24 ,  C23C30/00 ,  C25D5/56 ,  B32B2250/02 ,  B32B2264/104 ,  B32B2264/204 ,  B32B2264/302 ,  B32B2264/303 ,  B32B2457/00 ,  C08K2003/265 ,  C08K2003/267 ,  C08K2201/005 ,  C08L2201/08 ,  C08L2203/20 ,  C08L2203/30 ,  C08L2205/035 ,  C08L2207/04 ,  C25D3/38 ,  Y10T428/12007 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12556 ,  Y10T428/12562 ,  Y10T428/12569 ,  Y10T428/12701 ,  Y10T428/12736 ,  Y10T428/12861 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12951 ,  C08K7/14 ,  C08L81/02 ,  C08K3/26 ,  C08L81/02

Abstract: Provided is a production method for a layered product in which a metal film can be formed on the surface of a polyarylene sulfide (PAS) molded article with a high adhesive force by a simple step. Further, provided are: a polyarylene sulfide resin composition and a molded article that can be used in the layered product in which a metal film can be formed on the surface of the PAS molded article with a high adhesive force by a simpler step; and production methods therefor. More specifically, provided are: a polyarylene sulfide resin composition obtained by blending a polyarylene sulfide resin, a thermoplastic elastomer and/or a hydrolyzable thermoplastic resin, a carbonate, and a polyolefin-based wax; a molded article which is obtained by melt-molding the polyarylene sulfide resin composition and in which the surface is roughened; a layered product having a metal plating layer; and production methods therefor.

公开(公告)号：US20240287302A1

公开(公告)日：2024-08-29

申请号：US18573716

申请日：2022-06-20

Applicant: INEOS STYROLUTION GROUP GMBH

Inventor： Norbert NIESSNER ,  Christian RUTHARD ,  Shridhar MADHAV ,  Kirit GEVARIA ,  Manjula AK ,  Pankaj ROHIT ,  Saurabh MISHRA

IPC: C08L51/00 ,  C08L23/08 ,  C08L25/12

CPC classification number: C08L51/003 ,  C08L23/0853 ,  C08L25/12 ,  C08L2201/08 ,  C08L2203/30 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2207/53

Abstract: Weather resistant thermoplastic ASA compositions comprising (A): 20 to 80 wt.-% of a polymer mixture (A) consisting of: 35 to 65 wt.-% graft copolymer GR1 (D50 of 55 to 170 nm), composed of: 40 to 80 wt.-% cross-linked C1 to C8 alkyl acrylate graft base G11 and 20 to 60 wt.-% SAN-copolymer graft shell G12; and 65 to 35 wt.-% SAN copolymer S1 (MVR 50 to 70 ml/10 min); (B): 5 to 35 wt.-% polymer mixture (B) consisting of: 35 to 65 wt.-% graft copolymer GR2 (D50 of 410 to 1000 nm), composed of: 40 to 80 wt.-% cross-linked C1 to C8 alkyl acrylate graft base G21 and 20 to 60 wt.-% SAN-copolymer graft shell G22; and 65 to 35 wt.-% SAN copolymer S2 (MVR 11 to 25 ml/10 min); (C): 10 to 40 wt.-% of at least one SAN copolymer (C) (MVR 11 to 70 ml/10 min); (D): 1 to 15 wt.-% EVA copolymer (D) (VA>25 wt.-%); are particularly useful e.g. in the automotive industry.

公开(公告)号：US20240279456A1

公开(公告)日：2024-08-22

申请号：US18560998

申请日：2022-06-10

Applicant: SIKA TECHNOLOGY AG

Inventor： Denise STORRER ,  Fabien CHOFFAT

IPC: C08L33/14 ,  C08L33/10 ,  C09J5/00 ,  C09J11/08 ,  C09J133/10 ,  C09J133/14

CPC classification number: C08L33/14 ,  C08L33/10 ,  C09J5/00 ,  C09J11/08 ,  C09J133/10 ,  C09J133/14 ,  C08L2201/08 ,  C08L2205/03 ,  C08L2207/53 ,  C09J2433/00 ,  C09J2475/00

Abstract: A two-component composition including a component K2, including at least one initiator for free-radical curing, and a component K1, including a) at least one monomer A according to formula (IIIa),






b) at least one monomer B according to formula (IIIb),










c) optionally between 10% by weight and 20% by weight, based on component K1, of at least one elastomer C of formula (I),










and d) optionally at least one additive selected from core-shell polymer, activator for free-radical curing, inhibitor for free-radical curing, filler and adhesion promoter. Provided that component K1 contains between 25% by weight and 75% by weight, based on component K1, of the mixture of monomer A and monomer B, and the mass ratio of monomer A to monomer B in component K1 is between 1:1 and 9:1.

公开(公告)号：US12049560B2

公开(公告)日：2024-07-30

申请号：US18546107

申请日：2021-02-25

Applicant: Covestro Deutschland AG

Inventor： Jianfeng Gu ,  Xiaoxiang Wang ,  Shoujun Li

IPC: C08K3/013 ,  C08K3/04 ,  C08L67/02

CPC classification number: C08L67/02 ,  C08K3/013 ,  C08K3/04 ,  C08K2201/001 ,  C08K2201/006 ,  C08L2201/08

Abstract: The present application relates to a heat-resistant semi-conductive thermoplastic resin composition and shaped articles made therefrom. The thermoplastic resin composition comprises the following components: an aromatic polycarbonate, a polyalkylene terephthalate, a conductive carbon black and a reinforcement material. The shaped article made from the thermoplastic resin composition according to the present invention has a good combination of heat-resistance, semi-conductivity and dimensional stability.

公开(公告)号：US12043721B2

公开(公告)日：2024-07-23

申请号：US17192491

申请日：2021-03-04

Applicant: Ascend Performance Materials Operations LLC

Inventor： Vikram Gopal ,  Wai-shing Yung ,  Albert Ortega

IPC: C08K3/08 ,  A01N25/10 ,  A01N25/34 ,  A01N59/16 ,  A01N59/20 ,  A41D13/11 ,  B29C48/00 ,  B29K77/00 ,  B29K105/00 ,  C08K3/02 ,  C08L77/06 ,  D01F6/60 ,  D02G3/04 ,  D02G3/44

CPC classification number: C08K3/08 ,  A01N25/10 ,  A01N25/34 ,  A01N59/16 ,  A01N59/20 ,  A41D13/1192 ,  B29C48/022 ,  C08L77/06 ,  D01F6/60 ,  D02G3/047 ,  D02G3/448 ,  D02G3/449 ,  B29K2077/00 ,  B29K2105/0011 ,  B29K2995/0077 ,  B29K2995/0092 ,  C08K2003/026 ,  C08K2003/0893 ,  C08K2201/00 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/12 ,  D10B2331/021 ,  D10B2401/02 ,  D10B2401/13

Abstract: A polymer composition having antimicrobial properties, the composition comprising from 50 wt % to 99.99 wt % of a polymer, from 10 wppm to 900 wppm of zinc, less than 1000 wppm of phosphorus, and less than 10 wppm coupling agent and/or surfactant, wherein zinc is dispersed within the polymer; and wherein fibers formed from the polymer composition demonstrate a Klebsiella pneumonia log reduction greater than 0.90, as determined via ISO20743:2013 and/or an Escherichia coli log reduction greater than 1.5, as determined via ASTM E3160 (2018).

公开(公告)号：US12031028B2

公开(公告)日：2024-07-09

申请号：US17256055

申请日：2019-12-26

Applicant: LG CHEM, LTD.

Inventor： Il Hwan Choi ,  Young Ji Tae ,  Soonyong Park ,  Youngseok Park ,  Bi Oh Ryu

IPC: C08L77/10 ,  B32B27/08 ,  B32B27/34 ,  C08G69/26 ,  C08G69/42 ,  C08K5/3475 ,  C08K5/3492

CPC classification number: C08L77/10 ,  B32B27/08 ,  C08G69/265 ,  C08G69/42 ,  C08K5/3475 ,  C08K5/3492 ,  B32B27/34 ,  B32B2250/02 ,  B32B2250/03 ,  B32B2307/412 ,  B32B2307/71 ,  B32B2457/20 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/20

Abstract: The present invention relates to a polyamide resin film having improved UV shielding function by using a polyamide resin having a backbone chain of alternative structure of two types of polyamide segments; and a resin laminate using the polyamide resin film.

公开(公告)号：US12031024B2

公开(公告)日：2024-07-09

申请号：US17764633

申请日：2020-12-18

Applicant: LG CHEM, LTD.

Inventor： Chun Ho Park ,  Tae Hoon Kim ,  Daeun Sung ,  Yong Hee An ,  Wangrae Joe ,  Ho Hoon Kim ,  Jeongmin Jang

IPC: C08L51/04 ,  B29B9/06 ,  B29C48/09 ,  B29C48/151 ,  B32B1/08 ,  B32B15/18 ,  B32B27/08 ,  F16L9/147 ,  B29K96/02 ,  B29K705/00 ,  B29L23/00

CPC classification number: C08L51/04 ,  B29B9/06 ,  B29C48/09 ,  B29C48/151 ,  B32B1/08 ,  B32B15/18 ,  B32B27/08 ,  F16L9/147 ,  B29K2096/02 ,  B29K2705/00 ,  B29L2023/22 ,  C08L2201/08 ,  C08L2203/18 ,  C08L2205/025 ,  C08L2205/035 ,  C08L2207/04 ,  Y10T428/1352 ,  Y10T428/1355 ,  Y10T428/1386 ,  Y10T428/1393

Abstract: A thermoplastic resin composition and a molded article including the same can include 100 parts by weight of a base resin including 10 to 50% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-1) containing acrylate rubber having an average particle diameter of 0.3 to 0.5 μm, 5 to 40% by weight of an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (A-2) containing acrylate rubber having an average particle diameter of 0.05 μm or more and less than 0.3 μm, and 20 to 65% by weight of an aromatic vinyl polymer (B), and 0.5 to 12 parts by weight of a polyamide (C). The thermoplastic resin composition can have a solvent resistance of 15 days or more.

公开(公告)号：US20240209148A1

公开(公告)日：2024-06-27

申请号：US18551810

申请日：2022-03-23

Applicant: NATIONAL UNIVERSITY CORPORATION, IWATE UNIVERSITY

Inventor： Yoshiyuki OISHI ,  Yuji SHIBASAKI ,  Tadashi TSUKAMOTO

IPC: C08G65/40 ,  C08G61/12 ,  C08L71/10

CPC classification number: C08G65/40 ,  C08G61/122 ,  C08L71/10 ,  C08L2201/08 ,  C08L2201/10 ,  C08L2203/16 ,  C08L2203/206

Abstract: Provided are a resin composition which has a low dielectric constant, a low dielectric loss tangent, high transparency, high solubility, and high heat resistance and can be used suitably as a low-dielectric material, a film for a multilayer substrate, in which the resin composition is used, a multilayer substrate, and methods for producing the same. A resin composition for a low-dielectric material, which contains a triazine-containing polyether compound having a specific repeating unit, a film for a multilayer substrate, a multilayer substrate, a method for producing a resin composition for a low-dielectric material, a method for producing a film for a multilayer substrate, and a method for producing a multilayer substrate.

公开(公告)号：US12018140B2

公开(公告)日：2024-06-25

申请号：US14909756

申请日：2014-07-09

Applicant: SG GLOBAL CHEMICAL CO., LTD.

Inventor： Sébastien Quinebeche ,  Vincent Palluault ,  Benoît Savignat

IPC: C08L23/06 ,  C08K3/22 ,  C08L23/04 ,  C08L23/08 ,  C08L51/06 ,  C09K21/02 ,  F16L9/12 ,  H01B3/44 ,  H01B7/295

CPC classification number: C08L23/06 ,  C08K3/22 ,  C08L23/04 ,  C08L23/0853 ,  C08L51/06 ,  C09K21/02 ,  F16L9/12 ,  H01B3/441 ,  H01B7/295 ,  C08K2003/2227 ,  C08L2201/02 ,  C08L2201/08 ,  C08L2203/18 ,  C08L2203/202 ,  C08L2205/03 ,  C08L2207/066 ,  C08L23/0853 ,  C08L23/04 ,  C08L51/06 ,  C08K3/22

Abstract: A halogen-free fire-retardant thermoplastic composition composed of: 50% to 70% by weight of fire-retardant fillers, 0.1% to 45% by weight of a copolymer of ethylene and of an ethylenic monomer bearing a polar function, 10% to 25% by weight of a non-functionalized very low density polyethylene (VLDPE), optionally, up to 10% of additives, and 0.1% to 10% by weight of a linear low density polyethylene (LLDPE), characterized in that the density of the very low density polyethylene (VLDPE) is between 0.85 and 0.91, in that the density of the linear low density polyethylene is greater than 0.91 and in that the linear low density polyethylene (LLDPE) is grafted with maleic anhydride grafts present on the main chain. Also, a cable, tube, pipe or the like, a layer of which is formed with said composition.