公开(公告)号：US20250163305A1

公开(公告)日：2025-05-22

申请号：US18840116

申请日：2023-04-05

Applicant: SIKA TECHNOLOGY AG

Inventor： Denise STORRER ,  Fabien CHOFFAT

IPC: C09J133/10

Abstract: A two-component composition for use as a free-radically curing adhesive for bonding of corner angles, frames or profiles in window, door, container or vehicle construction. The composition is composed of a component K1 and a component K2. The composition contains at least 50% by weight, preferably between 60% by weight and 75% by weight, of filler based on the mixture of the components K1 and K2. The compositions have good mechanical properties and adhesion to substrates employed in these applications, they additionally have a low viscosity and they can be formulated without volatile, strongly malodorous monomers such as MMA.

公开(公告)号：US20220372238A1

公开(公告)日：2022-11-24

申请号：US17623471

申请日：2020-08-17

Applicant: SIKA TECHNOLOGY AG

Inventor： Dusko PARIPOVIC ,  Denise STORRER

IPC: C08J9/00 ,  C08L23/08 ,  C08J9/10 ,  C08J9/08 ,  B29C44/42 ,  B29C44/50

Abstract: A thermally expandable composition which includes at least one thermoplastic polymer, at least one chemical blowing agent, at least one free radical initiator, and at least one co-agent having at least two maleimide groups. The invention is also related to a baffle and/or a reinforcement element for hollow structures including the thermally expandable composition, to a process for manufacturing the baffle and/or the reinforcement element, to use of the baffle and/or the reinforcement element for sealing, baffling, or reinforcing of a cavity or a hollow structure, and to a method for sealing, baffling and/or reinforcing a cavity or hollow structure.

公开(公告)号：US20250011517A1

公开(公告)日：2025-01-09

申请号：US18708678

申请日：2022-11-21

Applicant: SIKA TECHNOLOGY AG

Inventor： Denise STORRER ,  Fabien CHOFFAT

IPC: C08F290/06 ,  C08G18/67 ,  C08K3/26 ,  C08K3/36 ,  C08K5/13 ,  C08K5/14 ,  C08K5/18 ,  C08K5/521 ,  C09J4/06 ,  C09J5/04

Abstract: A two-component composition, component K1, including at least one (meth)acrylate monomer, at least one elastomer having (meth)acrylate end groups, at least one additive selected from the group consisting of activator for free-radical curing, inhibitor for free-radical curing, filler and adhesion promoter; and a component K2 including at least one initiator for free-radical curing wherein the elastomer is a polyurethane (meth)acrylate produced from the reaction of at least one diol including at least one dimer fatty acid-based polyester diol with at least one diisocyanate and a (meth)acrylic acid, a (meth)acrylamide or a (meth)acrylate ester having a hydroxyl group, wherein the at least one diol initially reacts with the diisocyanate which is present in stoichiometric excess and the resulting isocyanate-terminated polyurethane is subsequently reacted with the (meth)acrylic acid, the (meth)acrylamide or the (meth)acrylate ester having a hydroxyl group to afford the elastomer.

公开(公告)号：US20240279456A1

公开(公告)日：2024-08-22

申请号：US18560998

申请日：2022-06-10

Applicant: SIKA TECHNOLOGY AG

Inventor： Denise STORRER ,  Fabien CHOFFAT

IPC: C08L33/14 ,  C08L33/10 ,  C09J5/00 ,  C09J11/08 ,  C09J133/10 ,  C09J133/14

CPC classification number: C08L33/14 ,  C08L33/10 ,  C09J5/00 ,  C09J11/08 ,  C09J133/10 ,  C09J133/14 ,  C08L2201/08 ,  C08L2205/03 ,  C08L2207/53 ,  C09J2433/00 ,  C09J2475/00

Abstract: A two-component composition including a component K2, including at least one initiator for free-radical curing, and a component K1, including a) at least one monomer A according to formula (IIIa),






b) at least one monomer B according to formula (IIIb),










c) optionally between 10% by weight and 20% by weight, based on component K1, of at least one elastomer C of formula (I),










and d) optionally at least one additive selected from core-shell polymer, activator for free-radical curing, inhibitor for free-radical curing, filler and adhesion promoter. Provided that component K1 contains between 25% by weight and 75% by weight, based on component K1, of the mixture of monomer A and monomer B, and the mass ratio of monomer A to monomer B in component K1 is between 1:1 and 9:1.

公开(公告)号：US20240052204A1

公开(公告)日：2024-02-15

申请号：US18271067

申请日：2022-03-11

Applicant: SIKA TECHNOLOGY AG

Inventor： Denise STORRER ,  Manuel BUCK ,  Reto DOHNER ,  Matthias DICK

IPC: C09J5/02 ,  C09J4/06 ,  C09J133/06 ,  B32B37/12

CPC classification number: C09J5/02 ,  C09J4/06 ,  C09J133/066 ,  B32B37/1284 ,  C09J2433/00 ,  C09J2475/00 ,  B32B2037/1215 ,  B32B2037/1261 ,  B32B2310/0887 ,  B32B2310/0831

Abstract: A method for adhesively bonding two substrates, including the steps: (a) applying a liquid, radiation-curable primer composition onto the surface of a first substrate; (b) curing the liquid, radiation-curable primer composition by applying radiation with a suitable wavelength, intensity and temporal exposure such that the radiation-curable primer composition is cured into a solidified, coherent or interrupted layer adhering to the surface of the substrate; (c) optionally storing the primed substrate for a time of up to 6 months; (d) applying a curable adhesive composition onto the cured primer composition on the substrate; (e) joining a second substrate to the adhesive composition on the first substrate such that an adhesive bond is formed between the substrates, wherein the surface of the second substrate to be adhesively bonded is optionally pre-treated to improve adhesion before step (e) is performed; (f) curing the curable adhesive composition.