公开(公告)号：US20180302965A1

公开(公告)日：2018-10-18

申请号：US16012592

申请日：2018-06-19

Applicant: Elemental LED, Inc.

Inventor： Russell Petersen ,  Steven W. Gensler ,  Rick Stellmacher

IPC: H05B33/08 ,  F21V23/00 ,  F21V23/06 ,  F21S4/22 ,  H05K1/18 ,  H05K1/03 ,  F21Y115/10 ,  F21Y105/10 ,  F21V23/02 ,  F21Y103/10

CPC classification number: H05B33/0827 ,  F21S4/22 ,  F21V23/005 ,  F21V23/02 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05B33/0809 ,  H05K1/0393 ,  H05K1/189 ,  H05K2201/0145 ,  H05K2201/1006 ,  H05K2201/10106 ,  H05K2201/10522 ,  Y02B20/348

Abstract: A strip of linear lighting with distributed power conversion is disclosed. The linear lighting includes a flexible PCB. The flexible PCB is divided into repeating blocks, which are arranged electrically in parallel with one another between power and ground. Each repeating block includes power conversion and conditioning circuits. A plurality of LED light engines are connected to the outputs of the power conversion and conditioning circuits, electrically in series with one another. The power conversion and conditioning circuits typically include at least a full-bridge rectifier, and a filter may be connected to each of the LED light engines. A pair of conductors run the length of the PCB adjacent to it and are connected to each of the repeating blocks. A flexible, transparent covering surrounds the PCB and pair of conductors.

公开(公告)号：US20180185922A1

公开(公告)日：2018-07-05

申请号：US15740589

申请日：2016-06-30

Applicant: National Research Council of Canada

Inventor： Zhiyi Zhang ,  Ye Tao ,  Ta-Ya Chu ,  Gaozhi Xiao

IPC: B22F7/04 ,  B22F3/105 ,  B22F3/24 ,  B22F5/00

CPC classification number: B22F7/04 ,  B22F3/105 ,  B22F3/24 ,  B22F5/00 ,  B22F2003/247 ,  B22F2003/248 ,  B22F2301/052 ,  B22F2301/10 ,  B22F2301/255 ,  B82Y20/00 ,  G03F7/0043 ,  G03F7/2014 ,  G03F7/2022 ,  G03F7/40 ,  H01L51/0022 ,  H01L51/0023 ,  H01L51/0096 ,  H01L51/0541 ,  H01L51/0545 ,  H01L2251/301 ,  H05K1/097 ,  H05K3/06 ,  H05K3/064 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2203/013 ,  H05K2203/0548 ,  H05K2203/0766 ,  H05K2203/107 ,  H05K2203/1131

Abstract: A method is disclosed for aligning layers in fabricating a multilayer printable electronic device. The method entails providing a transparent substrate upon which a first metal layer is deposited, providing a transparent functional layer over the first metal layer, depositing metal nano particles over the functional layer to form a second metal layer, exposing the metal nano particles to intense pulsed light via an underside of the substrate to partially sinter exposed particles to the functional layer whereby the first metal layer acts as a photo mask, and washing away unexposed particles using a solvent to leave partially sintered metal nano particles on the substrate.

公开(公告)号：US20180177056A1

公开(公告)日：2018-06-21

申请号：US15128105

申请日：2016-06-23

Applicant: Wuhan China Star Optoelectronics Technology Co., Ltd.

Inventor： Juan Chen

IPC: H05K3/10 ,  H05K3/00 ,  H05K1/02 ,  H05K1/09 ,  H05K9/00

CPC classification number: H05K3/10 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/28 ,  H05K9/0084 ,  H05K2201/0145 ,  H05K2201/0191 ,  H05K2203/0139 ,  H05K2203/0759 ,  H05K2203/128

Abstract: The invention provides a manufacturing method for flexible printed circuit board, by liquefying the flexible insulating material and the metal material, coating the liquefied materials and solidifying the coated layers to form respectively the flexible insulating layer and the anti-EMI layer of the anti-EMI structure. As such, an adhesive layer is eliminated to achieve reducing the thickness of the flexible insulating layer and the anti-EMI layer and the material consumption, resulting in reduced production cost, reduced thickness of the flexible printed circuit board with anti-EMI structure, and improved quality.

公开(公告)号：US20180168032A1

公开(公告)日：2018-06-14

申请号：US15580824

申请日：2016-06-17

Applicant: DST Innovations Limited

Inventor： Anthony Miles ,  Benjamin John Masheder

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/06 ,  C23F1/30 ,  D06M10/02 ,  D06M11/74 ,  D06M11/83 ,  D06M23/16

CPC classification number: H05K1/0283 ,  C23F1/02 ,  C23F1/30 ,  D06M10/025 ,  D06M11/74 ,  D06M11/83 ,  D06M23/16 ,  D10B2501/00 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/061 ,  H05K3/067 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/0323 ,  H05K2203/1461 ,  H05K2203/1545 ,  H05K2203/1572

Abstract: A method of forming a conductive/nonconductive pattern on a conductive particle-coated fabric uses chemical etching techniques to remove specific areas of conductive material from the fabric, producing non-conductive areas where the fabric was exposed to an etching agent, and leaving conductive areas where the conductive coating was protected by an etch-resistant coating.

公开(公告)号：US09983744B2

公开(公告)日：2018-05-29

申请号：US14846965

申请日：2015-09-07

Applicant: Pressure Profile Systems Inc.

Inventor： Jae S. Son

IPC: G01L1/00 ,  G06F3/044 ,  G06F3/041 ,  H05K1/02

CPC classification number: G06F3/044 ,  G06F3/0414 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10151

Abstract: A capacitive tactile sensor for measuring location and force of touch from an external object includes a drive electrode layer separated from a sense electrode layer by a dielectric substrate, which may be a two-sided FPCB. A first deformable conductive shield layer is further provided and is separated from either the drive electrode layer or the sense electrode layer by a first compressible dielectric layer. A control electronics are operatively connected to all of the drive electrode layer, sense electrode layer, and the first conductive shield layer. The control electronics may be configured to measure a change in capacitance upon the external object imparting local mechanical compression onto the first conductive shield layer and the first compressible dielectric layer. The tactile sensor improves reliability of interconnections between drive and sense electrodes and the control electronics.

公开(公告)号：US09955585B2

公开(公告)日：2018-04-24

申请号：US14801137

申请日：2015-07-16

Applicant: Konica Minolta, Inc.

Inventor： Keita Saito ,  Midori Shimomura ,  Dai Suwama ,  Sayaka Morita

IPC: H01B13/00 ,  H05K3/12 ,  B05C5/02 ,  H05K1/09

CPC classification number: H05K3/1283 ,  B05C5/0204 ,  H01B13/0026 ,  H05K1/097 ,  H05K2201/0145 ,  H05K2201/083 ,  H05K2203/102 ,  H05K2203/1131 ,  H05K2203/1545

Abstract: A conductive pattern production device includes: a patterning unit that forms a pattern of a composite ink on a base member; and a burning unit that burns the pattern by high-frequency heating. The composite ink is obtained by mixing a particle material that is a material having a relative permeability of 200 or above or a carbon micro-coil and a conductive ink that has, after the burning, a resistivity of 1 to 2000 μΩ·cm.

公开(公告)号：US09955574B2

公开(公告)日：2018-04-24

申请号：US14369909

申请日：2012-01-13

Applicant: Koichiro Tanaka ,  Kazuki Kammuri

Inventor： Koichiro Tanaka ,  Kazuki Kammuri

IPC: B32B15/00 ,  H05K1/03 ,  B32B15/08 ,  H05K1/09 ,  H05K3/02 ,  B32B7/02 ,  B32B15/20 ,  H05K1/05

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1

公开(公告)号：US09942989B2

公开(公告)日：2018-04-10

申请号：US14312222

申请日：2014-06-23

Applicant: ILLINOIS TOOL WORKS, INC.

Inventor： Hongchuan Liao ,  Chris Benson ,  Yong Liang ,  Tom Carlson

IPC: H05K7/00 ,  H05K1/18 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36

CPC classification number: H05K1/185 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B2250/24 ,  B32B2250/40 ,  B32B2262/106 ,  B32B2264/02 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/212 ,  B32B2307/302 ,  B32B2457/04 ,  H05K2201/0137 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0183 ,  Y10T428/31507 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721 ,  Y10T428/31725 ,  Y10T428/31728 ,  Y10T428/31736 ,  Y10T428/31757 ,  Y10T428/31786 ,  Y10T428/31797 ,  Y10T428/31913

Abstract: The present invention provides an insulation film and a method for making the insulation film, comprising a film upper layer and a film lower layer, wherein both of the film upper layer and film lower layer are made of a heat conduction plastics material, the heat conduction plastics material contains a heat conduction additive; and a film intermediate layer located between the film upper layer and the film lower layer. The film intermediate layer is made of a heat conduction plastics material, and the heat conduction plastics material contains a conductive additive An upper surface of the film intermediate layer is bound together with a lower surface of the film upper layer, and a lower surface of the film intermediate layer is bound together with an upper surface of the film lower layer.

公开(公告)号：US09900979B2

公开(公告)日：2018-02-20

申请号：US15240132

申请日：2016-08-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hiesang Sohn ,  Chan Kwak ,  Mi Jeong Kim ,  Hyeon Cheol Park ,  Weonho Shin ,  Youngjin Cho

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/03 ,  H05K3/14 ,  H05K3/22 ,  C01B31/04

CPC classification number: H05K1/09 ,  C01B31/0484 ,  C01B32/184 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/146 ,  H05K3/22 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/0783 ,  Y02E10/50

Abstract: A conductor includes a substrate, a first conductive layer disposed on the substrate and including two or more islands including graphene, and a second conductive layer disposed on the first conductive layer and including a conductive metal nanowire, wherein at least one of an upper surface and a lower surface of the islands including graphene includes a P-type dopant.

公开(公告)号：US20170370560A1

公开(公告)日：2017-12-28

申请号：US15629797

申请日：2017-06-22

Applicant: Osram GmbH

Inventor： Lorenzo Baldo ,  Federico Poggi ,  Luigi Pezzato ,  Aleksandar Nastov

IPC: F21V19/00 ,  H05K3/40 ,  H01L33/62 ,  H05K1/11 ,  H05K1/18 ,  H05K3/12 ,  H05K1/09 ,  F21S4/24 ,  F21Y2115/10 ,  F21Y2103/10

CPC classification number: F21V19/0015 ,  F21S4/24 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/62 ,  H05K1/092 ,  H05K1/115 ,  H05K1/181 ,  H05K1/189 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/4038 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/107

Abstract: According to the present disclosure, a support structure for lighting devices, e.g. LED lighting devices, is provided with an electrically insulating core layer having a first and a second mutually opposed surfaces, with mounting locations for electrically-powered light radiation sources on the first surface, a network of electrically conductive lines printed on said first surface, at least some of said electrically conductive lines extending between the mounting locations and fixed locations on the first surface, and electrical distribution lines of electrically conductive material on the second surface of the core layer, and electrically conductive vias extending through core layer and electrically coupling the electrical distribution lines on the second surface with the electrically conductive lines at said fixed locations on the first surface.