公开(公告)号：US5365268A

公开(公告)日：1994-11-15

申请号：US82913

申请日：1993-06-29

Applicant: Itsuji Minami

Inventor： Itsuji Minami

IPC: A61B1/04 ,  A61B1/05 ,  H01L31/0203 ,  H01L31/0232 ,  H01R4/04 ,  H01R12/70 ,  H01R12/82 ,  H01R13/66 ,  H04N5/225 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  A61B1/06

CPC classification number: A61B1/051 ,  A61B1/05 ,  H01L31/0203 ,  H01L31/0232 ,  H01R12/7076 ,  H01R12/82 ,  H01R13/6683 ,  H04N5/2253 ,  H05K1/142 ,  H01L2224/48091 ,  H01R4/04 ,  H04N2005/2255 ,  H05K1/182 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K3/36

Abstract: A circuit board of a solid-state image sensor (CCD) in an electronic endoscope apparatus for inspecting internal cavities of the body by inserting an electronic endoscope having the CCD at one end thereof into an object of inspection and displaying the image of the object on a monitor. The circuit board has a package to which the CCD is attached. A groove portion is provided at one end of the package and connecting terminals are disposed on the upper surface and the under surface of the groove portion. A substrate with a wiring pattern formed both sides thereon is fitted into the groove portion and the circuits are connected. In an endoscope in which the image picked up by the CCD is reversed side by side, the substrate is connected upside down to the package. Thus, this circuit board facilitates correspondence to various structures of endoscopes. Reduction of the diameter of the endoscope is also possible.

Abstract translation: 一种电子内窥镜装置中的固态图像传感器（CCD）的电路板，用于通过将其一端的具有CCD的电子内窥镜插入到检查对象中并且将对象的图像显示在上面来检查身体的内部空腔 一个监视器 电路板具有附接有CCD的封装。 在封装的一端设置有沟槽部分，并且连接端子设置在沟槽部分的上表面和下表面上。 将其两侧形成有布线图案的基板嵌合在槽部，并将电路连接。 在由CCD拾取的图像并排反转的内窥镜中，基板被倒置连接到封装。 因此，该电路板便于对应于内窥镜的各种结构。 也可以减小内窥镜的直径。

公开(公告)号：US5345364A

公开(公告)日：1994-09-06

申请号：US109213

申请日：1993-08-18

Applicant: Rolf W. Biernath

Inventor： Rolf W. Biernath

IPC: G01R31/26 ,  H01R12/72 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  H05K1/00

CPC classification number: H01R12/721 ,  H05K1/117 ,  H05K2201/0133 ,  H05K2201/09163 ,  H05K2201/09172 ,  H05K3/326

Abstract: A printed circuit board capable of resilient deformation having two major surfaces and a contact edge. Electrically conductive traces are provided on each major surface of the board which lead to electrically conductive contact pads at the contact edge of the board. A gap is provided between the two major surfaces of the board along the contact edge. The gap permits resilient deformation of the board so that a force is created upon deformation which will bias the major surfaces toward their undeformed position. An elastomeric biasing member may be provided in the gap.

Abstract translation: 能够弹性变形的印刷电路板具有两个主表面和接触边缘。 在板的每个主表面上提供导电迹线，其导电板的接触边缘处的导电接触焊盘。 沿着接触边缘在板的两个主表面之间提供间隙。 间隙允许板的弹性变形，使得在变形时产生力，这将使主表面朝向未变形的位置偏置。 可以在间隙中设置弹性体偏置构件。

公开(公告)号：US4127934A

公开(公告)日：1978-12-05

申请号：US813069

申请日：1977-07-05

Applicant: John E. Bartley ,  Orville R. Penrod ,  Lawrence D. Radosevich

Inventor： John E. Bartley ,  Orville R. Penrod ,  Lawrence D. Radosevich

IPC: H01L23/50 ,  H01G4/236 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K1/14 ,  H05K1/16 ,  H05K3/34 ,  H05K3/40 ,  H05K3/32

CPC classification number: H05K3/3405 ,  H01L23/49811 ,  H05K1/167 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/141 ,  H05K1/162 ,  H05K2201/09163 ,  H05K2201/10045 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K3/403 ,  Y10T29/49101 ,  Y10T29/49151 ,  Y10T29/53174

Abstract: An electrical circuit device having a substrate including circuit components on at least one side thereof and a plurality of through openings in the substrate. Terminal leads are positioned in the openings each with a deformation intermediate the ends of the leads and spaced internally of the opening from a soldered area at the juncture of the exposed portion of the leads and the termination edge of the substrate. Two methods of assembly of leads to the substrate are also disclosed.

Abstract translation: 一种电路装置，其具有在至少一个侧面上包括电路元件的基板和该基板中的多个通孔。 端子引线定位在开口中，每个开口具有在引线的端部之间的中心的变形，并且在引线的暴露部分和基板的终端边缘的接合处的焊接区域处与开口的内部隔开。 还公开了将引线组装到衬底的两种方法。

公开(公告)号：US4012835A

公开(公告)日：1977-03-22

申请号：US506760

申请日：1974-09-17

Applicant: Charles W. Wallick

Inventor： Charles W. Wallick

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H05K3/34 ,  H01L21/28

CPC classification number: H01L23/49541 ,  H01L21/4825 ,  H01L23/3107 ,  H01L23/495 ,  H05K3/3405 ,  H01L2924/0002 ,  H05K2201/09163 ,  H05K2201/1034 ,  H05K2201/10924 ,  Y10T428/12188

Abstract: A lead frame assembly of indefinite length having a pair of spaced parallel carrier strips, collapsible rungs extending between the strips at regular intervals along the length of the assembly and a number of leads extending inwardly from the opposed edges of the strip between the rungs are collapsed inwardly to seat the ends of the leads against the sides of circuit modules previously positioned between the ends of the leads. The lead ends are seated in recesses in the circuit modules and are subsequently soldered to metalized surfaces on the modules. Following the bending of the leads, the carrier strips and rungs are cut away.

Abstract translation: 具有不定长度的引线框架组件具有一对间隔开的平行载体条，沿着组件的长度以规则间隔在条之间延伸的可折叠梯级，并且从梯级的条带的相对边缘向内延伸的多个引线被折叠 向内以将引线的端部抵靠预先定位在引线端部之间的电路模块的侧面。 引线端位于电路模块的凹槽中，随后焊接到模块上的金属化表面。 在引线弯曲之后，载体带和梯级被切除。

公开(公告)号：USB506760I5

公开(公告)日：1976-04-13

申请号：US50676074

申请日：1974-09-17

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H05K3/34

CPC classification number: H01L23/49541 ,  H01L21/4825 ,  H01L23/3107 ,  H01L23/495 ,  H01L2924/0002 ,  H05K3/3405 ,  H05K2201/09163 ,  H05K2201/1034 ,  H05K2201/10924 ,  Y10T428/12188 ,  H01L2924/00

公开(公告)号：US3873890A

公开(公告)日：1975-03-25

申请号：US38976573

申请日：1973-08-20

Applicant: ALLEN BRADLEY CO

Inventor： BECKMAN RICHARD J ,  BLANCHARD JOHN C ,  MARSHALL ROBERT ,  PENROD ORVILLE R ,  VON ALTEN THEODOR ,  DENES OSCAR

IPC: H01L23/50 ,  H01L25/16 ,  H05K3/34 ,  H05K3/40 ,  H05K5/00

CPC classification number: H05K3/3405 ,  H01L25/165 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/403 ,  H05K2201/09163 ,  H05K2201/1034 ,  H01L2924/00

Abstract: An electrical circuit device having a ceramic substrate including a thick or thin film circuit on at least one surface thereof and an elongated groove formed in a surface substantially normal to the first mentioned surface. In one embodiment the elongated groove is divided into juxtaposed alternately distended and constricted portions, the constricted portions being adapted to receive an end portion of relatively flat lead wires. Prior to insertion of the lead wires, the respective constricted groove portions and the surface portion extending laterally therefrom are first metallized to define conducting areas leading to the respective lead wires. The lead wires are inserted and soldered in place.

Abstract translation: 一种电路装置，其具有在至少一个表面上包括厚薄膜电路的陶瓷基板和形成在基本上垂直于第一表面的表面中的细长槽。 在一个实施例中，细长槽分成并置的交替扩张和收缩部分，缩颈部分适于接收相对平坦的引线的端部。 在插入引线之前，相应的收缩槽部分和从其横向延伸的表面部分首先被金属化以限定通向相应引线的导电区域。 引线插入并焊接到位。