公开(公告)号：US20180139845A1

公开(公告)日：2018-05-17

申请号：US15813246

申请日：2017-11-15

Applicant: ASUSTeK COMPUTER INC.

Inventor： Bing-Min LIN ,  Teng-Liang NG ,  Ji-Kuang TAN ,  Ming-Fang TSAI ,  Chih-Kuang LIN

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/20 ,  G08B5/38

CPC classification number: H05K1/181 ,  G06F1/183 ,  G06F1/20 ,  G06F11/3058 ,  G06F11/325 ,  G08B5/38 ,  H05K1/0274 ,  H05K1/18 ,  H05K7/20172 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09172 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A motherboard is provided. The motherboard includes a main body, a notch formed at a side edge of the main body, and a fixing device formed adjacent to the notch to fix an auxiliary device. The function of the motherboard is expanded significantly while artistic of the appearance of the motherboard is improved.

公开(公告)号：US09468107B2

公开(公告)日：2016-10-11

申请号：US14695216

申请日：2015-04-24

Applicant: Texas Instruments Incorporated

Inventor： Allan Jerome Daen Rapales ,  Floro Lopez Camenforte, III ,  John Paul Quianzon Kwo

IPC: H05K3/34 ,  H01G2/06 ,  H01G4/232 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H01G4/30

CPC classification number: H05K3/3442 ,  H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/18 ,  H05K1/183 ,  H05K3/0014 ,  H05K3/301 ,  H05K3/3452 ,  H05K2201/0162 ,  H05K2201/09036 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2203/0126 ,  H05K2203/046 ,  H05K2203/167 ,  H05K2203/168 ,  Y02P70/613 ,  Y10T29/43 ,  Y10T29/49135

Abstract: A method of registering terminals on an interdigitated chip capacitor (“IDC”) with a plurality of contact pads on a substrate. At least one vertically extending nonconductive abutment surface is formed between adjacent ones of the contact pads. A plurality of grooves projecting outwardly from said a central recess is formed on the substrate top portion. At least one sidewall portion of the IDC is urged into abutting engagement with the at least one abutment surface on the substrate. Another method prevent solder from causing short circuits between adjacent terminals. A plurality of grooves extending laterally outwardly from a central recessed portion are formed. The plurality of grooves defining a plurality of inwardly projecting fingers. A plurality of contact pads on are formed on a respective plurality of fingers. A solder bead is formed on at least some of the plurality of contact pads. The at least one solder bead is isolated from adjacent solder beads and adjacent terminals.

Abstract translation: 一种在叉指片式电容器（“IDC”）上的端子与衬底上的多个接触焊盘对准的方法。 在相邻的接触垫之间形成至少一个垂直延伸的非导电邻接表面。 在所述基板顶部形成有从所述中心凹部向外突出的多个凹槽。 IDC的至少一个侧壁部分被推动成与基底上的至少一个邻接表面邻接接合。 另一种方法可以防止焊料在相邻端子之间引起短路。 形成从中心凹部横向向外延伸的多个槽。 多个槽限定多个向内突出的指状物。 在多个指状物上形成多个接触垫。 在多个接触垫中的至少一些上形成焊珠。 至少一个焊珠与相邻的焊球和相邻的端子隔离。

公开(公告)号：US08961192B2

公开(公告)日：2015-02-24

申请号：US13713987

申请日：2012-12-13

Applicant: IDEAL Industries, Inc.

Inventor： Benjamin David Swedberg

IPC: H01R13/62 ,  H01R12/52 ,  H01R12/51 ,  H01R12/73

CPC classification number: H01R12/515 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R4/4818 ,  H01R12/52 ,  H01R12/523 ,  H01R12/7005 ,  H01R12/732 ,  H01R13/64 ,  H05K1/117 ,  H05K1/142 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/09172 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2203/167

Abstract: A connector for electrically connecting a first printed circuit board (PCB) with a second PCB wherein, in one example, the connector includes a housing having a keyed feature adapted to mate with a correspondingly keyed feature provided to each of the first and second PCBs and at least one connecting terminal carried by the housing having at least partially exposed opposed ends each of which electrically engages a contact pad formed on an underside of the respective PCBs. The connecting terminal may be arranged to accept a conductor and to thereby electrically couple the conductor to the first and second PCBs.

Abstract translation: 一种用于将第一印刷电路板（PCB）与第二PCB电连接的连接器，其中在一个示例中，所述连接器包括壳体，所述壳体具有适于与提供给所述第一和第二PCB中的每一个的相应的键入特征配合的键合特征，以及 由壳体承载的至少一个连接端子具有至少部分暴露的相对端，每个端部电接合形成在各个PCB的下侧上的接触焊盘。 连接端子可以被布置成接受导体，从而将导体电耦合到第一和第二PCB。

公开(公告)号：US08897032B2

公开(公告)日：2014-11-25

申请号：US13114875

申请日：2011-05-24

Applicant: Abraham Hartenstein

Inventor： Abraham Hartenstein

IPC: H05K7/14 ,  H01R12/73 ,  H05K3/36 ,  H01R13/02 ,  H05K1/11

CPC classification number: H01Q9/045 ,  H01R12/737 ,  H01R13/02 ,  H05K1/117 ,  H05K1/14 ,  H05K3/366 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/10098 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2203/043 ,  Y02P70/611 ,  Y10T29/49018 ,  Y10T29/49126

Abstract: A method and system for connecting a vertical printed circuit board with a horizontal printed circuit board where a contact device is biased in a first position when not contacting a vertical printed circuit board and is biased in a second position when the vertical printed circuit is coupled to the horizontal printed circuit board.

Abstract translation: 一种用于将垂直印刷电路板与水平印刷电路板连接的方法和系统，其中当垂直印刷电路连接到垂直印刷电路时，接触装置在不接触垂直印刷电路板时被偏置在第一位置并被偏置在第二位置 水平印刷电路板。

公开(公告)号：US08810457B2

公开(公告)日：2014-08-19

申请号：US13489568

申请日：2012-06-06

Applicant: Javier Ruben Flores-Cuadras ,  Jose Eleazar Zuniga-Juarez

Inventor： Javier Ruben Flores-Cuadras ,  Jose Eleazar Zuniga-Juarez

IPC: H01Q1/38

CPC classification number: H01Q9/42 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q9/0421 ,  H05K1/117 ,  H05K1/14 ,  H05K1/165 ,  H05K2201/09172

Abstract: Described herein are antenna designs and configurations that provide flexible solutions for creating compact antennas with multiple-band capabilities. For example, a hybrid PIFA-monopole antenna configuration and design is described. As another example, non-planar (e.g., orthogonal) and composite radiating structures incorporating various radiating element and ground plane configurations are described. Connective structures are also described for providing physical rigidity and ground plane connectivity to composite radiation elements. In embodiments described herein of composite radiating structures, multiple antennas may be included through passive radiating elements potentially combined with active circuitry. Composite radiating structures with multiple antennas may be used in multiple-in and multiple-out (MIMO) antenna applications. For example, multiple different antennas within the composite radiating structures may be created using radiating elements on one or more of the vertical and/or horizontal portions of the composite radiating structure.

Abstract translation: 这里描述的是提供用于创建具有多频带能力的紧凑天线的灵活解决方案的天线设计和配置。 例如，描述了混合PIFA单极天线配置和设计。 作为另一示例，描述了包括各种辐射元件和接地平面配置的非平面（例如，正交）和复合辐射结构。 还描述了连接结构，用于提供与复合辐射元件的物理刚性和接地平面连接。 在这里描述的复合辐射结构的实施例中，可以通过潜在地与有源电路组合的无源辐射元件来包括多个天线。 具有多个天线的复合辐射结构可用于多输入多输出（MIMO）天线应用。 例如，可以使用复合辐射结构的一个或多个垂直和/或水平部分上的辐射元件来创建复合辐射结构内的多个不同的天线。

公开(公告)号：US08674489B2

公开(公告)日：2014-03-18

申请号：US12912203

申请日：2010-10-26

Applicant: Sebastien Bolis ,  Fabrice Jacquet ,  Damien Saint-Patrice

Inventor： Sebastien Bolis ,  Fabrice Jacquet ,  Damien Saint-Patrice

IPC: H01L23/02

CPC classification number: B81B7/0006 ,  B81B2203/0353 ,  B81B2207/012 ,  B81B2207/07 ,  H01L23/481 ,  H01L23/5389 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2924/0002 ,  H05K1/0219 ,  H05K1/183 ,  H05K3/403 ,  H05K3/4697 ,  H05K2201/09172 ,  H05K2201/09181 ,  H05K2201/09645 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An interconnect device is disclosed including a support in which at least one hole is formed, the hole having walls forming a closed contour and being formed by a cavity and one or several slots communicating with the cavity. The slots extend in a direction making a non-zero angle with the main plane of the support. Several conducting elements are positioned on at least one wall of the hole and pass through the hole. The conducting elements are each intended to connect conducting areas to each other that are situated on either side of the support. At least one of the slots separates two of the conducting elements from each other.

Abstract translation: 公开了一种互连装置，其包括其中形成有至少一个孔的支撑件，所述孔具有形成封闭轮廓的壁，并且由空腔和与腔体连通的一个或多个槽形成。 狭槽在与支撑件的主平面成非零角度的方向上延伸。 几个导电元件位于孔的至少一个壁上并穿过该孔。 导电元件各自旨在将位于支撑体两侧的导电区域彼此连接。 至少一个槽将两个导电元件彼此分开。

公开(公告)号：US20130301207A1

公开(公告)日：2013-11-14

申请号：US13466682

申请日：2012-05-08

Applicant: Sungjun Chun ,  Brian J. Connolly

Inventor： Sungjun Chun ,  Brian J. Connolly

IPC: G06F1/16 ,  H05K1/11

CPC classification number: H05K1/117 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/09172 ,  H05K2201/10159

Abstract: An embodiment is a memory card including a rectangular printed circuit card having a first side and a second side, a first length of between 151.35 and 161.5 millimeters, and first and second ends having a second length smaller than the first length. The memory card also includes a first plurality of pins on the first side extending along a first edge of the rectangular printed circuit card that extends along a length of the rectangular printed circuit card, a second plurality of pins on the second side extending on the first edge of the rectangular printed circuit card, and a positioning key having its center positioned on the first edge of the rectangular printed circuit card and located between 94.0 and 95.5 millimeters from the first end of the rectangular printed circuit card.

Abstract translation: 一个实施例是一种存储卡，其包括具有第一侧和第二侧的矩形印刷电路卡，第一长度在151.35和161.5毫米之间，第一和第二端的第二长度小于第一长度。 存储卡还包​​括沿着矩形印刷电路卡的沿着矩形印刷电路卡的长度延伸的第一边沿第一侧延伸的第一多个销，第二侧上延伸的第二多个销在第一侧上延伸 矩形印刷电路卡的边缘，以及定位键，其中心位于矩形印刷电路卡的第一边缘上，并且距离矩形印刷电路卡的第一端位于94.0和95.5毫米之间。

公开(公告)号：US20130264103A1

公开(公告)日：2013-10-10

申请号：US13858955

申请日：2013-04-09

Applicant: TPK TOUCH SOLUTIONS (XIAMEN) INC.

Inventor： Huilin Ye ,  Jing Yu ,  Hua Luo ,  Zongke Chiu ,  Yau-Chen Jiang ,  Jianbin Yan ,  Defa Wu

IPC: H05K1/02 ,  H05K3/38

CPC classification number: H05K1/0213 ,  H05K1/0277 ,  H05K3/28 ,  H05K3/323 ,  H05K3/361 ,  H05K3/38 ,  H05K2201/09172 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/099

Abstract: The present disclosure discloses a bonding structure, wherein a plurality of first bonding pads is located on a first substrate. A second substrate is disposed to partially face first substrate. A plurality of second bonding pads is located on second substrate with one side, and partially overlapped with the first bonding pads with the other side to form a bonding region and a peripheral region located in the periphery of the bonding region. An anisotropic conductive film is disposed between first bonding pads and second bonding pads. The anisotropic conductive film includes a plurality of conductive particles. At least one move structure is disposed in the periphery region. When the conductive particles of the anisotropic conductive film are moving during the bonding process, the groove structure can accommodate the conductive particles moved hereto. Accordingly, short circuit caused by accumulation of the conductive particles in the bonding process can be avoided.

Abstract translation: 本公开公开了一种接合结构，其中多个第一接合焊盘位于第一基板上。 第二基板设置成部分地面对第一基板。 多个第二接合焊盘位于具有一侧的第二基板上，并且与第一接合焊盘与另一侧部分地重叠以形成接合区域和位于接合区域周边的周边区域。 各向异性导电膜设置在第一接合焊盘和第二接合焊盘之间。 各向异性导电膜包括多个导电颗粒。 至少一个移动结构设置在周边区域中。 当各向异性导电膜的导电颗粒在接合过程中移动时，沟槽结构可以容纳移动到其上的导电颗粒。 因此，可以避免在接合过程中由导电性粒子的积聚引起的短路。

公开(公告)号：US20130186678A1

公开(公告)日：2013-07-25

申请号：US13578965

申请日：2011-01-06

Applicant: Eiji Koike ,  Yukihiro Sumida ,  Toshiteru Nakawaki

Inventor： Eiji Koike ,  Yukihiro Sumida ,  Toshiteru Nakawaki

IPC: H05K1/14 ,  H05K3/00

CPC classification number: H05K1/144 ,  G02F1/13452 ,  G02F2001/133612 ,  H05K1/11 ,  H05K1/118 ,  H05K3/00 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/09172 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49126

Abstract: Provided is a highly accurately alignable substrate set, the cost of which is kept low. In the substrate set, a light source FPC substrate (11) has a notch (16), and an anode pad (13) and a cathode pad (14) that are disposed so as to sandwich the notch (16) therebetween, and a panel FPC substrate (21) has a plus terminal (23) and a minus terminal (24) that are disposed so as to be in contact with the anode pad (13) and the cathode pad (14), and an opening (26) that is sandwiched between the plus terminal (23) and the minus terminal (24).

Abstract translation: 提供了一种高精度对准的基板组，其成本保持较低。 在基板组中，光源FPC基板（11）具有凹口（16）和布置成夹在其间的凹口（16）的阳极垫（13）和阴极垫（14），并且 面板FPC基板（21）具有设置成与阳极焊盘（13）和阴极焊盘（14）接触的正端子（23）和负端子（24），以及开口（26） 夹在正极端子（23）和负极端子（24）之间。

公开(公告)号：US20110121849A1

公开(公告)日：2011-05-26

申请号：US12948713

申请日：2010-11-17

Applicant: Leonard A. ROLAND ,  Kathleen F. ULLOM ,  Ira G. POLLOCK ,  James E. SPINAR

Inventor： Leonard A. ROLAND ,  Kathleen F. ULLOM ,  Ira G. POLLOCK ,  James E. SPINAR

IPC: G01R1/067 ,  H01R43/16

CPC classification number: H05K3/403 ,  G01R1/06772 ,  G01R1/06788 ,  G01R3/00 ,  H05K1/092 ,  H05K1/167 ,  H05K3/245 ,  H05K2201/0367 ,  H05K2201/09172 ,  H05K2203/1476 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49204

Abstract: The probe with printed tip consists of a substrate having a plurality of probe tips connected to its end edge, a plurality of test paths, each connected to one of the probe tips and extending along the substrate, and at least one of the test paths including an electrical component adjacent to the test path's probe tip. The electrical component may be a resistor. The probe tips may have a width equal to the thickness of the substrate. The probe tips may consist of a plurality of probe tip layers. The invention also includes a method of probing signals transmitted over target transmission lines on a target board. The disclosure also includes a method of manufacturing the claimed invention.

Abstract translation: 具有印刷尖端的探针由具有连接到其端部边缘的多个探针尖端的基底组成，多个测试路径，每个连接到探针尖端中的一个并且沿着基底延伸，并且至少一个测试路径包括 与测试路径的探针尖端相邻的电气部件。 电气部件可以是电阻器。 探针尖端的宽度可以等于衬底的厚度。 探针尖端可以由多个探针尖端层组成。 本发明还包括一种探测通过目标板上的目标传输线传输的信号的方法。 本公开还包括制造所要求保护的发明的方法。