SEMICONDUCTOR MOUNTING MATERIAL FILLER AND METHOD FOR PRODUCING SEMICONDUCTOR MOUNTING MATERIAL FILLER, AND SEMICONDUCTOR MOUNTING MATERIAL

    公开(公告)号:US20230352435A1

    公开(公告)日:2023-11-02

    申请号:US18206789

    申请日:2023-06-07

    CPC classification number: H01L24/27 H01L24/29 H01L2224/2711 H01L2224/2919

    Abstract: Provided is a method for producing an electronic material filler having excellent performance. The method includes a burning step of putting a particle raw material in flame obtained by burning combustible carbon-free gas containing no carbon to form a particle material to be contained in the electronic material filler. By adopting, as combustible gas, combustible gas containing no carbon, conductive particles formed of carbon are not generated in principle. Therefore, a step of removing the conductive particles formed of carbon by sieving or the like is not required. Particularly, carbon derived from hydrocarbon gas is adhered to and formed on, for example, the surface of the particle material or is formed in the particle material. Therefore, the carbon may not be completely removed by sieving or the like. However, the production method of the present invention prevents the carbon from being mixed in principle.

    MULTI-CORE FERRULE POLISHING MATERIAL

    公开(公告)号:US20210261823A1

    公开(公告)日:2021-08-26

    申请号:US17318025

    申请日:2021-05-12

    Inventor: Yusuke TOMIOKA

    Abstract: To provide a multi-core ferrule polishing material suitable for polishing a multi-core ferrule. A multi-core ferrule polishing material of the present invention addressing the above problem includes a binder formed from a resin material, and abrasive grains dispersed in the binder. The abrasive grains are contained in an amount of not less than 88.5% with respect to a sum of masses of the abrasive grains and the binder, include particles having a particle diameter of not greater than 100 nm, the particles being present in an amount of not less than 70% and less than 100% with respect to the mass of the abrasive grains, and are formed from silica.

    Electronic material filler, high-frequency substrate, and electronic material slurry

    公开(公告)号:US10851246B2

    公开(公告)日:2020-12-01

    申请号:US16715204

    申请日:2019-12-16

    Abstract: A production method for an electronic material filler includes: a preparation step of preparing a silica particle material produced by a dry method; and a first surface treatment step of performing surface treatment on the silica particle material with a silane compound having a vinyl group, a phenyl group, a phenylamino group, an alkyl group having four or more carbon atoms, a methacryl group, or an epoxy group, to obtain a first surface treatment-processed particle material. After the silica particle material is produced by the dry method, the silica particle material is not brought into contact with liquid water, and has a particle diameter of 100 nm to 600 nm or a specific surface area of 5 m2/g to 35 m2/g.

    Surface-modified particle material and slurry composition

    公开(公告)号:US12187903B2

    公开(公告)日:2025-01-07

    申请号:US17953430

    申请日:2022-09-27

    Abstract: A particle material that has high dispersibility in a dispersion medium such as toluene having high hydrophobicity, and a slurry composition in which the particle material is used, are provided for solving the problem. A surface-modified particle material of the present invention includes: a particle material formed of an inorganic material; and a surface treatment agent formed of a silane compound having a first functional group that has any of C, N, and O atoms away over five or more atoms from Si to which an alkoxide is bound, the surface treatment agent allowing surface treatment of the particle material in such an amount that a degree of hydrophobicity becomes not less than 30%. Dispersibility is enhanced also in a dispersion medium having high hydrophobicity in a case where a functional group having a predetermined structure is introduced so as to impart predetermined or higher hydrophobicity.

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