公开(公告)号：US20130322812A1

公开(公告)日：2013-12-05

申请号：US13653612

申请日：2012-10-17

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: G02B6/12 ,  B32B38/04 ,  B32B38/10

CPC classification number: G02B6/122 ,  G02B6/3608 ,  H05K1/0274 ,  H05K1/116 ,  H05K3/427 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/09063 ,  H05K2201/09545

Abstract: An optical printed circuit board includes a flexible substrate and a flexible optical wave guide. The flexible substrate includes a flexible sheet and a copper layer set on the flexible sheet. A part of the copper layer is removed for receiving the flexible optical wave guide. The flexible optical wave guide sets on the flexible sheet at the position where the part of the copper layer is removed.

Abstract translation: 光学印刷电路板包括柔性基板和柔性光波导。 柔性基板包括柔性片和设置在柔性片上的铜层。 去除铜层的一部分以接收柔性光波导。 柔性光波导在铜层的一部分被去除的位置处设置在柔性片上。

公开(公告)号：US20130230650A1

公开(公告)日：2013-09-05

申请号：US13584759

申请日：2012-08-13

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: B05D5/06

CPC classification number: G02B6/138 ,  G02B6/43

Abstract: A method for manufacturing an optical printed circuit board (OPCB) includes: providing a substrate having a loading surface; forming a first cladding solvent layer on the loading surface by a spin coating method; solidifying the first cladding solvent layer to form a first cladding layer; forming a core solvent layer on the first cladding layer through the spin coating method; solidifying the core solvent layer to form a core layer; forming optical waveguide patterns on the core layer by a roller pressing method; forming a second cladding solvent layer on the core layer through the spin coating method; and solidifying the second cladding solvent layer to form the second cladding layer.

Abstract translation: 一种用于制造光学印刷电路板（OPCB）的方法包括：提供具有加载表面的基板; 通过旋涂法在装载表面上形成第一包层溶剂层; 固化第一包层溶剂层以形成第一包层; 通过旋涂法在第一包层上形成核心溶剂层; 固化核心溶剂层以形成核心层; 通过辊压法在芯层上形成光波导图案; 通过旋涂法在芯层上形成第二包层溶剂层; 并固化第二包层溶剂层以形成第二包覆层。

公开(公告)号：US08729696B2

公开(公告)日：2014-05-20

申请号：US13534192

申请日：2012-06-27

Applicant: Bing-Heng Lee ,  Kuo-Fong Tseng

Inventor： Bing-Heng Lee ,  Kuo-Fong Tseng

IPC: H01L23/12 ,  G01R31/02 ,  G01R31/00 ,  G06F19/00

CPC classification number: G01R31/2635 ,  H01S5/0014

Abstract: In a testing method for an LD, an LD die is held. Then, electric current increasing with a fixed increment and having a sequence of current values is supplied to the LD die to drive the LD die to emit light and a sequence of voltage values across the LD die and corresponding to the sequence of current values, respectively, is metered. A sequence of power values corresponding to the sequence of current values, respectively, is also metered. Next, an electro-optical property of the LD die is determined according to the sequence of current values, the sequence of voltage values, and the sequence of power values. Finally, if the LD die is determined to be qualified based upon the electro-optical property of the LD die, the LD die is packaged into the LD.

Abstract translation: 在LD的测试方法中，保持LD模具。 然后，将具有固定增量并且具有电流值序列的电流提供给LD管芯，以驱动LD管芯分别在LD管芯上发射光和一系列电压值，并分别对应于电流值序列 ，计量。 还计算与当前值序列对应的功率值序列。 接下来，根据电流值的顺序，电压值的顺序和功率值的顺序来确定LD管芯的电光特性。 最后，如果LD芯片根据LD裸片的电光特性被确定为合格，LD芯片封装在LD中。

公开(公告)号：US20130236992A1

公开(公告)日：2013-09-12

申请号：US13534192

申请日：2012-06-27

Applicant: BING-HENG LEE ,  KUO-FONG TSENG

Inventor： BING-HENG LEE ,  KUO-FONG TSENG

IPC: G01R31/26 ,  H01L21/66

CPC classification number: G01R31/2635 ,  H01S5/0014

Abstract: In a testing method for an LD, an LD die is held. Then, electric current increasing with a fixed increment and having a sequence of current values is supplied to the LD die to drive the LD die to emit light and a sequence of voltage values across the LD die and corresponding to the sequence of current values, respectively, is metered. A sequence of power values corresponding to the sequence of current values, respectively, is also metered. Next, an electro-optical property of the LD die is determined according to the sequence of current values, the sequence of voltage values, and the sequence of power values. Finally, if the LD die is determined to be qualified based upon the electro-optical property of the LD die, the LD die is packaged into the LD.

Abstract translation: 在LD的测试方法中，保持LD模具。 然后，将具有固定增量并且具有电流值序列的电流提供给LD管芯，以驱动LD管芯分别在LD管芯上发射光和一系列电压值，并分别对应于电流值序列 ，计量。 还计算与当前值序列对应的功率值序列。 接下来，根据电流值的顺序，电压值的顺序和功率值的顺序来确定LD管芯的电光特性。 最后，如果LD芯片根据LD裸片的电光特性被确定为合格，LD芯片封装在LD中。

公开(公告)号：US20130230276A1

公开(公告)日：2013-09-05

申请号：US13584760

申请日：2012-08-13

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: G02B6/132 ,  B05D5/06 ,  B05C11/02

CPC classification number: G02B6/138 ,  G02B2006/12097

Abstract: An optical printed circuit board (OPCB) includes a flexible first substrate, a first cladding layer, a core layer, a second cladding layer, and a flexible second substrate. The first cladding layer is formed on the substrate. The core layer is formed on the first cladding layer. The second layer is formed on the core layer. The second substrate is positioned on the second cladding layer. The core layer defines optical waveguide patterns. The refractive rate of the core layer is greater than the refractive rate of the first cladding layer and the refractive rate of the second cladding layer.

Abstract translation: 光学印刷电路板（OPCB）包括柔性第一基板，第一包层，芯层，第二包覆层和柔性第二基板。 第一覆层形成在基板上。 芯层形成在第一覆层上。 第二层形成在芯层上。 第二基板位于第二包覆层上。 核心层定义了光波导图案。 芯层的折射率大于第一包层的折射率和第二包层的折射率。

公开(公告)号：US20130306847A1

公开(公告)日：2013-11-21

申请号：US13653603

申请日：2012-10-17

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: G01J1/04 ,  G01J1/42

CPC classification number: G02B6/43

Abstract: An exemplary optical transmission module includes a flexible printed circuit board (FPCB). The FPCB includes a first end and a second end, and defines a receiving groove between the first end and the second end. The optical transmission module further includes an electrical-optical converter (E/O converter) set on the FPCB adjacent to the first end, an optical-electrical converter (O/E converter) set on the FPCB adjacent to the second end, an optical waveguide received in the receiving groove, first metal pins set at the first end and electrically connected to the E/O converter, and second metal pins set at the second end and electrically connected to the O/E converter. A circuit board including the optical transmission module is also provided.

Abstract translation: 示例性的光传输模块包括柔性印刷电路板（FPCB）。 FPCB包括第一端和第二端，并且在第一端和第二端之间限定接收槽。 光传输模块还包括设置在与第一端相邻的FPCB上的电 - 光转换器（E / O转换器），设置在与第二端相邻的FPCB上的光电转换器（O / E转换器） 波导接收在接收槽中，第一金属引脚设置在第一端并电连接到E / O转换器，第二金属引脚设置在第二端并电连接到O / E转换器。 还提供了包括光传输模块的电路板。

公开(公告)号：US20130230277A1

公开(公告)日：2013-09-05

申请号：US13584762

申请日：2012-08-13

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: G02B6/12 ,  B05D5/06 ,  B05C11/02

CPC classification number: G02B6/12002 ,  G02B6/4214 ,  G02B6/43

Abstract: An optical printed circuit board includes a substrate, a first cladding layer, a core layer, and a second cladding layer. The first cladding layer is formed on the substrate and defines a receiving groove. The core layer is received in the receiving groove. The second cladding layer is formed on the core layer. The refractive index of the core layer is greater than that of the first cladding layer and that of the second cladding layer. The core layer includes a bottom surface, a first refractive surface, and a second refractive surface. An included angle between the bottom surface and the first refractive surface is about 135 degrees. An included angle between the bottom surface and the second refractive surface is about 135 degrees.

Abstract translation: 光学印刷电路板包括基板，第一包层，芯层和第二包覆层。 第一覆层形成在基板上并限定接收槽。 芯层容纳在接收槽中。 第二覆层形成在芯层上。 芯层的折射率大于第一包层和第二包层的折射率。 芯层包括底表面，第一折射表面和第二折射表面。 底表面和第一折射表面之间的夹角为约135度。 底表面和第二折射表面之间的夹角为约135度。

公开(公告)号：US20130156372A1

公开(公告)日：2013-06-20

申请号：US13458407

申请日：2012-04-27

Applicant: BING-HENG LEE

Inventor： BING-HENG LEE

IPC: G02B6/26

CPC classification number: G02B6/4206 ,  B29D11/00663 ,  G02B6/1221 ,  G02B6/4214 ,  G02B6/43

Abstract: An optical coupling module includes a substrate, a circuit board defining two through holes, an optical waveguide positioned between the substrate and the circuit board, and an optical assembly. The optical waveguide includes a core and a clad, each core comprises two coupling surfaces corresponding to the two through holes. At least one coupling surfaces is in an arcuate shape. The clad covers the core, except for the two coupling surfaces exposing out of the clad. The optical assembly formed on the circuit board comprises an optical emitting element and an optical receiving element. The optical emitting element and the optical receiving element are positioned above the two through holes, respectively. Light emitted from the optical emitting element enters the optical waveguide via one of the coupling surface, and leaves from another coupling surface to reach the optical receiving element. The coupling surface is capability of focusing light.

Abstract translation: 光耦合模块包括基板，限定两个通孔的电路板，位于基板和电路板之间的光波导和光学组件。 光波导包括芯和包层，每个芯包括对应于两个通孔的两个耦合表面。 至少一个联接表面是弧形的。 除了从包层外露出的两个耦合表面外，包层覆盖芯。 形成在电路板上的光学组件包括光发射元件和光接收元件。 光发射元件和光接收元件分别位于两个通孔的上方。 从光发射元件射出的光通过耦合面中的一个进入光波导，从另一耦合面离开到达光接收元件。 耦合面是聚光的能力。