公开(公告)号：US07546677B2

公开(公告)日：2009-06-16

申请号：US11898002

申请日：2007-09-07

Applicant: Jae Woo Lee ,  Chang Han Je ,  Sung Weon Kang

Inventor： Jae Woo Lee ,  Chang Han Je ,  Sung Weon Kang

IPC: H01H11/00 ,  H01H65/00

CPC classification number: H01H59/0009 ,  H01G5/16 ,  H01G5/18 ,  H01H2059/0072 ,  H01P1/127 ,  Y10T29/417 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208

Abstract: A method includes forming a signal line on the substrate so as to have a predetermined opening portion; at least one supporting frame each formed on the substrate at both sides of the signal line; a ground line formed on the substrate between the supporting frame and the signal line; a moving plate fixed to the supporting frame at both sides thereof, the moving plate being movable upward and downward; a switching unit positioned on the moving plate, the switching unit comprising contact means for connecting the opened signal line; and a supporting layer for supporting the moving plate and the switching unit, wherein the supporting layer comprises a support protrusion portion for maintaining a distance from the substrate.

Abstract translation: 一种方法包括在基板上形成信号线以具有预定的开口部分; 至少一个支撑框架，每个形成在信号线两侧的基板上; 形成在支撑框架和信号线之间的基板上的接地线; 移动板在其两侧固定到支撑框架，移动板可向上和向下移动; 位于移动板上的切换单元，切换单元包括用于连接打开的信号线的接触装置; 以及用于支撑所述移动板和所述切换单元的支撑层，其中所述支撑层包括用于保持与所述基板的距离的支撑突出部分。

公开(公告)号：US07283025B2

公开(公告)日：2007-10-16

申请号：US11086320

申请日：2005-03-23

Applicant: Jae Woo Lee ,  Chang Han Je ,  Sung Weon Kang

Inventor： Jae Woo Lee ,  Chang Han Je ,  Sung Weon Kang

IPC: H01H51/22

CPC classification number: H01H59/0009 ,  H01G5/16 ,  H01G5/18 ,  H01H2059/0072 ,  H01P1/127 ,  Y10T29/417 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208

Abstract: Provided is a micro-electromechanical systems switch for controlling signal delivery in a high frequency band wireless communication and a radio frequency (RF) system and, comprising: a substrate; a signal line formed on the substrate and having a predetermined opening portion; at least one supporting frame each formed on the substrate at both sides of the signal line; a ground line formed on the substrate between the supporting frame and the signal line; a moving plate fixed to the supporting frame at both sides thereof, the moving plate being movable upward and downward; a switching unit positioned on the moving plate, the switching unit comprising contact means for connecting the opened signal line; and a supporting layer for supporting the moving plate and the switching unit, wherein the supporting layer comprises a support protrusion portion for maintaining a distance from the substrate.

Abstract translation: 提供了一种用于控制高频无线通信和射频（RF）系统中的信号传送的微机电系统开关，并且包括：基板; 形成在所述基板上并具有预定开口部分的信号线; 至少一个支撑框架，每个形成在信号线两侧的基板上; 形成在支撑框架和信号线之间的基板上的接地线; 移动板在其两侧固定到支撑框架，移动板可上下移动; 位于移动板上的切换单元，切换单元包括用于连接打开的信号线的接触装置; 以及用于支撑所述移动板和所述切换单元的支撑层，其中所述支撑层包括用于保持与所述基板的距离的支撑突出部分。

公开(公告)号：US09066184B2

公开(公告)日：2015-06-23

申请号：US13557108

申请日：2012-07-24

Applicant: Jae Woo Lee ,  Chang Han Je ,  Woo Seok Yang ,  Jong Dae Kim

Inventor： Jae Woo Lee ,  Chang Han Je ,  Woo Seok Yang ,  Jong Dae Kim

IPC: H04R31/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R19/005 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R19/04 ,  H04R31/00 ,  Y10T29/49005 ,  H01L2924/00014

Abstract: A method for fabricating an acoustic sensor according to an exemplary embodiment of the present disclosure includes: forming an acoustic sensor unit by forming a lower electrode on an upper portion of a substrate, forming etching holes on the lower electrode, forming a sacrifice layer on an upper portion of the lower electrode, and coupling a diaphragm to an upper portion of the sacrifice layer; coupling a lower portion of the substrate of the acoustic sensor unit to a printed circuit board on which a sound pressure input hole is formed so as to expose the lower portion of the substrate of the acoustic sensor unit to the outside through the sound pressure input hole; attaching a cover covering the acoustic sensor unit on the printed circuit board; etching the substrate of the acoustic sensor unit to form an acoustic chamber; and removing the sacrifice layer.

Abstract translation: 根据本公开的示例性实施例的用于制造声学传感器的方法包括：通过在基板的上部形成下电极来形成声传感器单元，在下电极上形成蚀刻孔，在其上形成牺牲层 下部电极的上部，并且将隔膜连接到牺牲层的上部; 将声学传感器单元的基板的下部耦合到其上形成有声压输入孔的印刷电路板，以便通过声压输入孔将声学传感器单元的基板的下部暴露于外部 ; 将覆盖所述声学传感器单元的盖附着在所述印刷电路板上; 蚀刻声学传感器单元的基板以形成声学室; 并去除牺牲层。

公开(公告)号：US08544326B2

公开(公告)日：2013-10-01

申请号：US12783789

申请日：2010-05-20

Applicant: Chang Han Je

Inventor： Chang Han Je

IPC: G01P15/125

CPC classification number: G01P15/125

Abstract: Provided is a vertical accelerometer for measuring acceleration applied perpendicular to a substrate to increase sensitivity thereof. The vertical accelerometer includes a substrate, and a plurality of unit vertical accelerometers, each having a detection mass disposed on the substrate to be rotated by acceleration applied perpendicular to the substrate, and a detection electrode formed at the detection mass. Here, the unit vertical accelerometers are provided to be in contact with the detection electrodes to detect the acceleration through variation in capacitance due to variation in area in which the contacted detection electrodes overlaps each other.

Abstract translation: 提供了一种用于测量垂直于衬底施加的加速度以增加其灵敏度的垂直加速度计。 垂直加速度计包括基板和多个单元垂直加速度计，每个单元垂直加速度计具有设置在基板上的检测质量，以通过垂直于基板施加的加速度旋转，以及形成在检测质量处的检测电极。 这里，单位垂直加速度计被设置为与检测电极接触，以通过由于接触的检测电极彼此重叠的面积的变化而发生的电容变化来检测加速度。

公开(公告)号：US08415717B2

公开(公告)日：2013-04-09

申请号：US13012489

申请日：2011-01-24

Applicant: Jaewoo Lee ,  Chang Han Je ,  Woo Seok Yang ,  Jongdae Kim

Inventor： Jaewoo Lee ,  Chang Han Je ,  Woo Seok Yang ,  Jongdae Kim

IPC: H01L29/84

CPC classification number: H04R31/00 ,  H04R19/005 ,  H04R19/02

Abstract: Provided is an acoustic sensor. The acoustic sensor includes: a substrate including sidewall portions and a bottom portion extending from a bottom of the sidewall portions; a lower electrode fixed at the substrate and including a concave portion and a convex portion, the concave portion including a first hole on a middle region of the bottom, the convex portion including a second hole on an edge region of the bottom; diaphragms facing the concave portion of the lower electrode, with a vibration space therebetween; diaphragm supporters provided on the lower electrode at a side of the diaphragm and having a top surface having the same height as the diaphragm; and an acoustic chamber provided in a space between the bottom portion and the sidewall portions below the lower electrode.

Abstract translation: 提供了一种声学传感器。 声学传感器包括：基底，其包括侧壁部分和从侧壁部分的底部延伸的底部部分; 固定在所述基板上的下部电极，具有凹部和凸部，所述凹部包括在所述底部的中间区域的第一孔，所述凸部包括在所述底部的边缘区域上的第二孔; 隔膜面向下电极的凹部，其间具有振动空间; 隔膜支撑体设置在隔膜侧面的下电极上，具有与隔膜相同高度的顶表面; 以及设置在下部电极下方的底部和侧壁部之间的空间中的声学室。

公开(公告)号：US20110140578A1

公开(公告)日：2011-06-16

申请号：US12862577

申请日：2010-08-24

Applicant: Sang Choon Ko ,  Chang Han Je ,  Ho Jun Ryu ,  Sung Sik Lee ,  Chi Hoon Jun

Inventor： Sang Choon Ko ,  Chang Han Je ,  Ho Jun Ryu ,  Sung Sik Lee ,  Chi Hoon Jun

IPC: H02N2/18

CPC classification number: H01L41/1138 ,  B60C23/0411 ,  H01L41/1136 ,  H02N2/186

Abstract: Provided is a small piezoelectric power generator applied to a wireless sensor network system of a tire pressure monitoring system (TPMS) for monitoring an internal environment of a tire such as variation in air pressure in the tire. In particular, when the system, in which air pressure, temperature and acceleration sensors are mounted, installed in the tire is operated in the TPMS for an automobile, a small piezoelectric power generator for the TPMS can be used as a power source in place of a conventional battery. The piezoelectric power generator includes a substrate having an electrode for transmitting power to the exterior, a metal plate formed on the substrate, and a piezoelectric body disposed on the metal plate and transmitting the power generated by a piezoelectric material to the electrode.

Abstract translation: 提供了一种应用于轮胎压力监测系统（TPMS）的无线传感器网络系统的小型压电发电机，用于监测轮胎的内部环境，例如轮胎中的空气压力的变化。 特别地，当安装在轮胎中的气压，温度和加速度传感器的系统在用于汽车的TPMS中运行时，用于TPMS的小压电发电机可以用作电源来代替 常规电池。 压电发电机包括具有用于向外部传输电力的电极的基板，形成在基板上的金属板，以及设置在金属板上的压电体，并将由压电材料产生的电力传递到电极。

公开(公告)号：US20110049651A1

公开(公告)日：2011-03-03

申请号：US12853522

申请日：2010-08-10

Applicant: Chang Han JE

Inventor： Chang Han JE

IPC: H01L29/84 ,  H01L21/306

CPC classification number: B81C1/0015

Abstract: Provided are a three-dimensional (3D) MEMS structure and a method of manufacturing the same. The method of manufacturing the 3D MEMS structure having a floating structure includes depositing a first etch mask on a substrate, etching at least two regions of the first etch mask to expose the substrate, and forming at least one step in the etched region, partially etching the exposed region of the substrate using the first etch mask, and forming at least two grooves, depositing a second etch mask on a sidewall of the groove, and performing an etching process to connect lower regions of the at least two grooves to each other, and forming at least one floating structure.

Abstract translation: 提供一种三维（3D）MEMS结构及其制造方法。 制造具有浮动结构的3D MEMS结构的方法包括在衬底上沉积第一蚀刻掩模，蚀刻第一蚀刻掩模的至少两个区域以暴露衬底，并且在蚀刻区域中形成至少一个步骤，部分蚀刻 使用第一蚀刻掩模的衬底的暴露区域，并且形成至少两个沟槽，在沟槽的侧壁上沉积第二蚀刻掩模，并且执行蚀刻工艺以将至少两个沟槽的下部区域彼此连接， 并形成至少一个浮动结构。

公开(公告)号：US20100251826A1

公开(公告)日：2010-10-07

申请号：US12745745

申请日：2008-04-21

Applicant: Chang Auck Choi ,  Chang Han Je ,  Gunn Hwang ,  Youn Tae Kim ,  Sung Hae Jung ,  Myung Lae Lee ,  Sung Sik Lee ,  Seok Hwan Moon

Inventor： Chang Auck Choi ,  Chang Han Je ,  Gunn Hwang ,  Youn Tae Kim ,  Sung Hae Jung ,  Myung Lae Lee ,  Sung Sik Lee ,  Seok Hwan Moon

IPC: G01L9/06 ,  H01L41/22

CPC classification number: G01L9/0042 ,  Y10T29/42 ,  Y10T29/49

Abstract: A micro semiconductor-type pressure sensor and a manufacturing method thereof are provided. The micro semi-conductor-type pressure sensor is implemented by etching a cavity-formation region of a substrate to form a plurality of trenches, oxidizing the plurality of trenches through a thermal oxidation process to form a cavity-formation oxide layer, forming a membrane-formation material layer on upper portions of the cavity-formation oxide layer and the substrate, forming a plurality of etching holes in the membrane-formation material layer, removing the cavity-formation oxide layer through the plurality of etching holes to form a cavity buried in the substrate, forming a membrane reinforcing layer on an upper portion of the membrane-formation material layer to form a membrane for closing the cavity, and forming sensitive films made of a piezoresisive material on an upper portion of the membrane.

Abstract translation: 提供一种微型半导体型压力传感器及其制造方法。 微型半导体型压力传感器通过蚀刻衬底的空腔形成区域以形成多个沟槽来实现，通过热氧化工艺氧化多个沟槽以形成空腔形成氧化物层，形成膜 在形成空腔的氧化物层和衬底的上部上形成一层形成材料层，在膜形成材料层中形成多个蚀刻孔，通过多个蚀刻孔去除腔形成氧化物层，以形成埋入腔 在所述基板中，在所述膜形成材料层的上部形成膜增强层，以形成用于封闭所述空腔的膜，并且在所述膜的上部形成由压阻材料制成的敏感膜。

公开(公告)号：US07745308B2

公开(公告)日：2010-06-29

申请号：US12417114

申请日：2009-04-02

Applicant: Myung Lae Lee ,  Jong Hyun Lee ,  Sung Sik Yun ,  Dae Hun Jeong ,  Gunn Hwang ,  Chang Auck Choi ,  Chang Han Je ,  Jae Yong An

Inventor： Myung Lae Lee ,  Jong Hyun Lee ,  Sung Sik Yun ,  Dae Hun Jeong ,  Gunn Hwang ,  Chang Auck Choi ,  Chang Han Je ,  Jae Yong An

IPC: H01L21/00

CPC classification number: B81C1/00619 ,  B81C1/00626 ,  B81C2201/0132 ,  B81C2201/0133

Abstract: A method of fabricating a micro-vertical structure is provided. The method includes bonding a second crystalline silicon (Si) substrate onto a first crystalline Si substrate by interposing an insulating layer pattern and a cavity, etching the second crystalline Si substrate using a deep reactive ion etch (DRIE) process along a [111] crystal plane vertical to the second crystalline Si substrate, and etching an etched vertical surface of the second crystalline Si substrate using a crystalline wet etching process to improve the surface roughness and flatness of the etched vertical surface. As a result, no morphological defects occur on the etched vertical surface. Also, footings do not occur at an etch end-point due to the insulating layer pattern. In addition, the micro-vertical structure does not float in the air but is fixed to the first crystalline Si substrate, thereby facilitating subsequent processes.

Abstract translation: 提供一种制造微垂直结构的方法。 该方法包括通过插入绝缘层图案和空腔将第二晶体硅（Si）衬底接合到第一晶体Si衬底上，使用沿[111]晶体的深反应离子蚀刻（DRIE）工艺蚀刻第二晶体Si衬底 垂直于第二晶体Si衬底，并且使用结晶湿蚀刻工艺蚀刻第二晶体Si衬底的蚀刻垂直表面，以改善蚀刻垂直表面的表面粗糙度和平坦度。 结果，蚀刻的垂直表面上没有形成形态缺陷。 此外，由于绝缘层图案，在蚀刻终点处不发生基脚。 此外，微垂直结构不会浮在空气中，而是固定在第一晶体Si衬底上，从而有助于后续工艺。

公开(公告)号：US08603848B2

公开(公告)日：2013-12-10

申请号：US12853522

申请日：2010-08-10

Applicant: Chang Han Je

Inventor： Chang Han Je

IPC: H01L33/12

CPC classification number: B81C1/0015

Abstract: Provided are a three-dimensional (3D) MEMS structure and a method of manufacturing the same. The method of manufacturing the 3D MEMS structure having a floating structure includes depositing a first etch mask on a substrate, etching at least two regions of the first etch mask to expose the substrate, and forming at least one step in the etched region, partially etching the exposed region of the substrate using the first etch mask, and forming at least two grooves, depositing a second etch mask on a sidewall of the groove, and performing an etching process to connect lower regions of the at least two grooves to each other, and forming at least one floating structure.

Abstract translation: 提供一种三维（3D）MEMS结构及其制造方法。 制造具有浮动结构的3D MEMS结构的方法包括在衬底上沉积第一蚀刻掩模，蚀刻第一蚀刻掩模的至少两个区域以暴露衬底，并且在蚀刻区域中形成至少一个步骤，部分蚀刻 使用第一蚀刻掩模的衬底的暴露区域，并且形成至少两个沟槽，在沟槽的侧壁上沉积第二蚀刻掩模，并且执行蚀刻工艺以将至少两个沟槽的下部区域彼此连接， 并形成至少一个浮动结构。