公开(公告)号：US4900258A

公开(公告)日：1990-02-13

申请号：US365069

申请日：1989-06-12

Applicant: Robert J. Hnatuck ,  Thomas S. Cohen ,  Dimitry G. Grabbe

Inventor： Robert J. Hnatuck ,  Thomas S. Cohen ,  Dimitry G. Grabbe

IPC: H01R12/50 ,  H01R24/50

CPC classification number: H01R23/688 ,  H01R24/50

Abstract: A connector assembly (28) for mounting a daughter board (20) on a mother board (66) and providing electrical connections therebetween. The connector assembly (28) is made up of a housing (74) mounted on the daughter board (20), a plurality of coaxial cable subassemblies (30), a faceplate member (76) and a cover member (78). The cable subassemblies (30) are held in the housing (74) with their two ends in positions corresponding to contact positions on the daughter board (20) and the mother board (66), with the cable subassemblies (30) being arranged to make a right angle turn. The faceplate member (76) includes a shroud portion (102) which surrounds contact assemblies (38) adapted for matingly engaging corresponding contact assemblies in a housing block (70) which is part of connector assembly (68) mounted on the mother board (66). The shroud portion (102) is sized to surround and frictionally engage the housing block (70). The cover member (78 ) of the connector assembly (28) is configured to position and hold the cable subassemblies (30) so as to protect them from rough handling or accidental shunting.

公开(公告)号：US4895522A

公开(公告)日：1990-01-23

申请号：US298376

申请日：1989-01-18

Applicant: Dimitry G. Grabbe ,  Iosif Korsunsky

Inventor： Dimitry G. Grabbe ,  Iosif Korsunsky

IPC: H01R24/50

CPC classification number: H01R24/50 ,  H01R2103/00

Abstract: A connector (28) for use with a printed circuit board (26) and adaptable for single or double sided use as a signal launcher or feed-through, respectively. The connector includes an outer sleeve element (58) and a center contact element (46) which has a support portion (54) extending through an aperture (40) in the printed circuit board. The distal end (68) of the contact element (46) is secured by interference fit with a locking ring (72) on the other side of the circuit board.

Abstract translation: 一种与印刷电路板（26）一起使用并适用于作为信号发射器或馈通的单面或双面使用的连接器（28）。 连接器包括外套筒元件（58）和具有延伸穿过印刷电路板中的孔（40）的支撑部分（54）的中心接触元件（46）。 接触元件（46）的远端（68）通过与电路板另一侧上的锁定环（72）的过盈配合来固定。

公开(公告)号：US4895521A

公开(公告)日：1990-01-23

申请号：US297636

申请日：1989-01-13

Applicant: Dimitry G. Grabbe

Inventor： Dimitry G. Grabbe

IPC: H01R24/50

CPC classification number: H01R24/50 ,  H01R2103/00

Abstract: A connector assembly (26) for use with a printed circuit board (30) wherein a true coaxial connection is provided. The connector assembly includes a housing block (36) with a plurality of bores (38) aligned with the plated-through apertures (42) of the circuit board. Each of the bores (38) contains a coaxial connector subassembly (50) which provides surface contact with the signal pads (46) and ground pads (48) surrounding the apertures (42).

Abstract translation: 一种与印刷电路板（30）一起使用的连接器组件（26），其中提供真正的同轴连接。 连接器组件包括具有与电路板的电镀通孔（42）对准的多个孔（38）的壳体块（36）。 每个孔（38）包含与围绕孔（42）的信号垫（46）和接地垫（48）提供表面接触的同轴连接器子组件（50）。

公开(公告)号：US4699593A

公开(公告)日：1987-10-13

申请号：US891710

申请日：1986-07-31

Applicant: Dimitry G. Grabbe ,  Iosif Korsunsky

Inventor： Dimitry G. Grabbe ,  Iosif Korsunsky

IPC: H01R33/74 ,  H01R11/01 ,  H05K7/10 ,  H01R23/72

CPC classification number: H05K7/1069

Abstract: Connector for a substrate such as an IC chip carrier comprises a housing assembly which in turn comprises a housing frame and a plurality of contact modules on the frame. Each module has a group of contact members therein. The contact members are located in predetermined positions in the frame and within predetermined dimensional tolerances. The housing frame and the substrate have substrate locating means for locating the substrate so that contact pads on the substrate will be in registry with the contact positions. Module locating means are also provided for locating the modules in the frame so that the contact members in the modules will be located in the predetermined positions. Each module has its own locating means which is directly related to the substrate locating means. The contact members in each module are thereby located within cumulative dimensional tolerances which are limited to the respective modules and are not cumulative beyond the individual modules.

Abstract translation: 用于诸如IC芯片载体的基板的连接器包括壳体组件，壳体组件又包括壳体框架和框架上的多个接触模块。 每个模块在其中具有一组接触构件。 接触构件位于框架中的预定位置并且在预定尺寸公差内。 壳体框架和衬底具有用于定位衬底的衬底定位装置，使得衬底上的接触垫将与接触位置对准。 还提供了用于将模块定位在框架中的模块定位装置，使得模块中的接触构件将位于预定位置。 每个模块具有与衬底定位装置直接相关的其自己的定位装置。 因此，每个模块中的接触构件位于限定于相应模块的累积尺寸公差内，并且不累积超过各个模块。

公开(公告)号：US4653840A

公开(公告)日：1987-03-31

申请号：US876529

申请日：1986-06-20

Applicant: Dimitry G. Grabbe ,  Lahman D. Lambert, II

Inventor： Dimitry G. Grabbe ,  Lahman D. Lambert, II

IPC: H01R9/05 ,  H01R17/18

CPC classification number: H01R9/05

Abstract: The ends of shielded coaxial conductors are connected to each other by a housing assembly comprising two or more housing blocks. The housing blocks have mating faces which are opposed to, and against, each other. The conductors are prepared by stripping the insulation and the shielding from the end and stripping the insulation only from an adjacent portion of each conductor. The stripped ends are in overlapping relationship and are pressed against each other by compressed blocks of plastic material. The plastic compresing blocks are held against the conductors by compressing bars which in turn are urged against the compressing blocks by a compressed elastomeric material. The dielectric constant of the plastic compressing blocks and the spacing between the overlapping stripped ends of the conductors and the surfaces of the compressing bars are selected such that the impedance in the zone of the electrical connection is compatible with the impedance of the cables.

Abstract translation: 屏蔽同轴导体的端部通过包括两个或更多个壳体块的壳体组件彼此连接。 外壳块具有彼此相对且彼此相对的配合面。 导体是通过从绝缘层和端部剥离绝缘材料制成的，并且仅从每个导体的相​​邻部分剥离绝缘体。 剥离端部处于重叠关系，并被压缩的塑料块压靠在一起。 塑料压实块通过压缩杆而抵靠导体固定，杆又通过压缩的弹性体材料推压到压缩块上。 选择塑料压缩块的介电常数和导体的重叠剥离端与压缩棒的表面之间的间隔，使得电连接区域中的阻抗与电缆的阻抗相兼容。

公开(公告)号：US4642889A

公开(公告)日：1987-02-17

申请号：US728065

申请日：1985-04-29

Applicant: Dimitry G. Grabbe

Inventor： Dimitry G. Grabbe

IPC: H05K3/34 ,  H05K7/10 ,  H05K7/00

CPC classification number: H01R12/57 ,  H05K3/3436 ,  H05K3/3478 ,  H05K7/1061 ,  H05K2201/0215 ,  H05K2201/0281 ,  H05K2201/0373 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0415 ,  H05K2203/0769 ,  Y02P70/613 ,  Y10T29/49144

Abstract: A method and device for compliantly interconnecting a surface mount device or the like to a circuit board is taught. Briefly stated, an interposer having interconnect areas is placed between the circuit board and the device to be surface mounted with interconnect areas disposed between conductive strips on the circuit board and pads contained on the surface mount device. The interconnect area has disposed therein a plurality of fine wires having flux and solder disposed thereon.

Abstract translation: 教导了一种将表面安装器件等与电路板顺从地互连的方法和装置。 简而言之，具有互连区域的插入器被放置在电路板和要被表面安装的设备之间，其中布置在电路板上的导电条和包含在表面安装器件上的焊盘之间的互连区域。 互连区域在其中设置有多个细线，其上设置有焊剂和焊料。

公开(公告)号：US4602833A

公开(公告)日：1986-07-29

申请号：US684233

申请日：1984-12-20

Applicant: Dimitry G. Grabbe ,  Charles W. Herb ,  Iosif Korsunsky

Inventor： Dimitry G. Grabbe ,  Charles W. Herb ,  Iosif Korsunsky

IPC: H01R13/703 ,  H01R9/03 ,  H01R24/84 ,  H01R31/08

CPC classification number: H01R9/032 ,  H01R23/27

Abstract: Hermaphroditic electrical connector comprises a dielectric housing having terminals therein with resilient contact tongues and shunt means fixed to a dielectric carrier which moves relative to housing in response to mating with a like connector as tongues engage respective like tongues. The shunt means engage portions of the terminals remote from the contact tongues to electrically connect alternate terminals when the connector is in an unmated condition, the shunt means being in unmated relation with the terminals when the connector is mated.

Abstract translation: 阴阳电气连接器包括绝缘壳体，其中端子具有弹性接触舌片和分流装置，固定到电介质载体上，电介质载体响应于与类似的连接器配合而相对于壳体移动，因为舌片与相应的相似的舌片接合。 当连接器处于未配合状态时，分路装置接合远离接触舌的端子部分以电连接另外的端子，当连接器配合时，分流装置与端子处于非关联状态。

公开(公告)号：US4587548A

公开(公告)日：1986-05-06

申请号：US459436

申请日：1983-01-20

Applicant: Dimitry G. Grabbe ,  Richard C. Downs

Inventor： Dimitry G. Grabbe ,  Richard C. Downs

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/538 ,  H01L23/12 ,  H01L23/48

CPC classification number: H01L23/49811 ,  H01L23/495 ,  H01L23/5382 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01322 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/3025

Abstract: Copper lead frame for manufacturing a semiconductor chip carrier has signal leads extending from outer leads about the periphery of the frame and temporarily attached to a ground bus toward the center of the frame by fusible links. Ground leads extend from bus alternately with signal leads and have fusible links at outer leads which are melted to isolate them from signal leads and eliminate noise between signal leads in finished carrier. A power bus located within the ground bus and a chip mounting pad located with the power bus are similarly positioned by fusible links.

Abstract translation: 用于制造半导体芯片载体的铜引线框架具有从外部引线围绕框架的周边延伸的信号引线，并且通过可熔链路临时地附接到接地总线朝向框架的中心。 接地引线与信号引线交替地从总线延伸，并在外引线处具有熔断的可熔连接，以将它们与信号引线隔离，并消除成品载体中的信号引线之间的噪声。 位于接地总线内的电源总线和与电源总线相连的芯片安装焊盘也可以通过熔断链路进行定位。

公开(公告)号：US4461522A

公开(公告)日：1984-07-24

申请号：US410236

申请日：1982-08-23

Applicant: Johannes C. W. Bakermans ,  Dimitry G. Grabbe ,  Iosif Korsunsky

Inventor： Johannes C. W. Bakermans ,  Dimitry G. Grabbe ,  Iosif Korsunsky

IPC: H01R12/89 ,  H01R9/09

CPC classification number: H01R12/89

Abstract: A miniature circuit board edge connector having a very short electrical contact path is taught. Briefly stated, an insulative housing has contained therein a resiliently flexible and electrically conductive contact. A camming device is disposed in the housing and impinges upon the contact and through lateral motion of the cam, urges the contact vertically downward so as to cause downward and outward movement of a portion of the contact with respect to the housing which thereby comes in contact with an electrically conductive path on a daughter board which is adjacent thereto. A portion of the contact is in slidable electrical communication with a conductive post which is mounted in the base of the connector assembly and attached to a mother circuit board. The electrical path between the daughter board circuit board and the mother board conductive post through the contact is very short and in a slightly arcuate manner and minimizes inductive, capacitive and propagation delay effects.

Abstract translation: 教导了具有非常短的电接触路径的微型电路板边缘连接器。 简而言之，绝缘壳体中包含弹性柔性和导电的接触。 凸轮装置设置在壳体中并且撞击接触并且通过凸轮的横向运动，垂直向下推动触点，从而使触头的一部分相对于壳体向下和向外移动，由此接触 在与其相邻的子板上具有导电路径。 触点的一部分与导电柱可滑动地电连通，该导电柱安装在连接器组件的基座中并连接到母电路板。 子板电路板和通过触点的母板导电柱之间的电气路径非常短且呈弧形，并且使电感，电容和传播延迟效应最小化。

公开(公告)号：US4116519A

公开(公告)日：1978-09-26

申请号：US821112

申请日：1977-08-02

Applicant: Dimitry G. Grabbe ,  Joseph Patrick Sweeney

Inventor： Dimitry G. Grabbe ,  Joseph Patrick Sweeney

IPC: H01R12/16 ,  H05K7/10 ,  H01R13/12

CPC classification number: H05K7/1046 ,  H01L2224/48247 ,  H01L2924/01004 ,  H01L2924/01039

Abstract: Packaging and interconnecting means for a plurality of microcircuit chips contained in chip carriers comprises a chip carrier socket which is dimensioned to receive a plurality of chip carriers in stacked relationship, one on top of the other. Vertically extending conductors in the socket are contacted by the leads from the chip carriers. In accordance with one embodiment, the several chip carriers are electrically and physically identical and the conductors are shared by all of the chips, excepting one dedicated conductor for each chip carrier. Alternatively, the chips in the chip carriers can be electrically dissimilar in which case only limited numbers of the socket conductors are shared and connections among the several chip carriers in the stack are achieved by interrupting the conductors in the chip carrier socket.

Abstract translation: {PG，1，包含在芯片载体中的多个微电路芯片的封装和互连装置包括一个芯片载体插座，其尺寸被设计为以堆叠的关系接收多个芯片载体，一个在另一个之上。 插座中的垂直延伸的导体与芯片载体的引线接触。 根据一个实施例，几个芯片载体在电和物理上是相同的，并且导体被所有芯片共享，除了用于每个芯片载体的一个专用导体。 或者，芯片载体中的芯片可以是电气不相似的，在这种情况下，仅共享有限数量的插座导体，并且通过中断芯片载体插座中的导体来实现堆叠中的多个芯片载体之间的连接。