公开(公告)号：US09573804B2

公开(公告)日：2017-02-21

申请号：US14361683

申请日：2012-12-21

Applicant: Micronit Microfluidics B.V.

Inventor： Ronny Van 'T Oever ,  Marko Theodoor Blom ,  Jeroen Haneveld ,  Johannes Oonk ,  Marinus Bernardus Olde Riekerink ,  Peter Tijssen ,  Hendrik Jan Hildebrand Tigelaar ,  Jean-Noël Fehr ,  Jean-Christophe Roulet ,  Amitava Gupta

IPC: B81C1/00 ,  H01L23/10 ,  H01L21/50 ,  B81C3/00 ,  C23F1/02

CPC classification number: B81C1/00269 ,  B81B2201/058 ,  B81C3/001 ,  B81C2201/0132 ,  B81C2203/0118 ,  B81C2203/019 ,  C23F1/02 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T428/239 ,  H01L2924/00

Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Abstract translation: 本发明涉及通过使用用于提供接合的中间薄膜金属层将至少两个基板（例如由玻璃，硅，陶瓷，铝或硼制成）接合的方法，所述方法包括以下步骤：a） 提供所述两个基板; b）将所述薄膜金属层沉积在所述两个基板的第一基板的表面的至少一部分上; c）使所述第二基板的表面与所述第一基板的所述表面上的所述薄膜金属层接触，从而提供所述第二基板和所述第一基板上的所述薄膜金属层之间的接合; 以及d）至少局部加强第一基板上的第二基板和薄膜金属层之间的接合。 本发明还涉及包括例如由玻璃，硅，陶瓷，铝或硼制成的两个基底和中间薄膜金属层的器件。

公开(公告)号：US20150238961A1

公开(公告)日：2015-08-27

申请号：US14431161

申请日：2013-09-25

Applicant: MICRONIT MICROFLUIDICS B.V.

Inventor： Elwin Xander Vrouwe ,  Manjeet Dhindsa ,  Marinus Bernardus Olde Riekerink ,  Ronny Van 'T Oever ,  Marko Theodoor Blom

IPC: B01L3/00 ,  F16K99/00

CPC classification number: B01L3/502738 ,  B01L2200/143 ,  B01L2300/0645 ,  B01L2300/069 ,  B01L2300/0829 ,  B01L2300/0874 ,  B01L2300/0887 ,  B01L2300/089 ,  B01L2300/12 ,  B01L2300/161 ,  B01L2400/0415 ,  B01L2400/0688 ,  F16K99/0017 ,  F16K99/0042 ,  F16K2099/0084

Abstract: The invention relates to a device (20), comprising: a liquid container (21) for containing a liquid; a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary-stop valve (22); a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; a second electrode (2) that is spaced apart from said capillary-stop valve by an electrically insulating medium gap (24), and a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary-stop valve for discharging liquid from said liquid container via said capillary-stop valve. The invention also relates to a method for activating a capillary-stop valve of a device.

Abstract translation: 本发明涉及一种装置（20），包括：用于容纳液体的液体容器（21）; 与所述液体容器（21）处于介质中流动连接的用于阻止所述容器中的液体经由所述毛细管截止阀（22）从所述容器流出的毛细管截止阀（22）; 第一电极（7）被布置成使得在使用中所述第一电极与所述液体容器中的所述液体接触; 通过电绝缘介质间隙（24）与所述毛细管截止阀间隔开的第二电极（2）和连接到所述第一和第二电极的电压源（V），所述电压源可激活以施加电位差 所述第一和第二电极使得所述液体容器中的液体沿所述第二电极的方向被吸引，从而允许所述液体克服所述毛细管截止阀的停止作用，所述停止效应通过所述毛细管 - 截止阀。 本发明还涉及用于激活装置的毛细管截止阀的方法。

公开(公告)号：US20140335301A1

公开(公告)日：2014-11-13

申请号：US14361683

申请日：2012-12-21

Applicant: Micronit Microfluidics B.V.

Inventor： Ronny Van 'T Oever ,  Marko Theodoor Blom ,  Jeroen Haneveld ,  Johannes Oonk ,  Marinus Bernardus Olde Riekerink ,  Peter Tijssen ,  Hendrik Jan Hildebrand Tigelaar ,  Jean-Noël Fehr ,  Jean-Christophe Roulet ,  Amitava Gupta

IPC: B81C1/00 ,  C23F1/02

CPC classification number: B81C1/00269 ,  B81B2201/058 ,  B81C3/001 ,  B81C2201/0132 ,  B81C2203/0118 ,  B81C2203/019 ,  C23F1/02 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  Y10T428/239 ,  H01L2924/00

Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.

Abstract translation: 本发明涉及通过使用用于提供接合的中间薄膜金属层将至少两个基板（例如由玻璃，硅，陶瓷，铝或硼制成）接合的方法，所述方法包括以下步骤：a） 提供所述两个基板; b）将所述薄膜金属层沉积在所述两个基板的第一基板的表面的至少一部分上; c）使所述第二基板的表面与所述第一基板的所述表面上的所述薄膜金属层接触，从而提供所述第二基板和所述第一基板上的所述薄膜金属层之间的接合; 以及d）至少局部加强第一基板上的第二基板和薄膜金属层之间的接合。 本发明还涉及包括例如由玻璃，硅，陶瓷，铝或硼制成的两个基底和中间薄膜金属层的器件。