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1.发明申请Device and Method for Measuring a Volume of a Liquid and Method and Device for Calibrating a Liquid Dispensing System 审中-公开用于测量液体体积的装置和方法以及用于校准液体分配系统的方法和装置公开(公告)号：US20160231163A1
公开(公告)日：2016-08-11
申请号：US15029847
申请日：2014-12-24
Applicant: MICRONIT MICROFLUIDICS B.V.
CPC classification number: G01F25/0007 , G01B13/00 , G01F13/00 , G01F25/0092
Abstract: The invention relates to a device for measuring a volume of a liquid, said device comprising:—a receptacle for receiving said liquid, said receptacle comprising an inlet opening and an outlet opening, and—a capillary channel having capillary action, which capillary channel has a predetermined internal transverse cross-section, wherein an inlet opening of the capillary channel at an first end thereof is in liquid through flow connection with the outlet opening of the receptacle and wherein the other, second end of the capillary channel comprises an opening; wherein:—the inlet opening of the receptacle has a larger transverse cross-section than the inlet opening of said capillary channel, and—a length of a liquid slug in the capillary channel is a measure for said volume. The invention further relates to a method for measuring a volume of a liquid using such a device, a method for calibrating a liquid dispensing system using such a device, a calibrating system for calibrating a liquid dispensing system using such a device and a support for supporting a plurality of such devices.
Abstract translation: 本发明涉及一种用于测量液体体积的装置，所述装置包括： - 用于接收所述液体的容器，所述容器包括入口和出口，以及具有毛细管作用的毛细通道，所述毛细通道具有 预定的内部横截面，其中在其第一端处的毛细通道的入口通过与所述容器的出口开口的流动连接处于液体中，并且其中所述毛细通道的另一个第二端包括开口; 其中： - 所述容器的入口开口具有比所述毛细通道的入口更大的横截面，并且所述毛细通道中的液体塞的长度是所述体积的量度。 本发明还涉及使用这种装置测量液体体积的方法，使用这种装置校准液体分配系统的方法，使用这种装置校准液体分配系统的校准系统和用于支撑 多个这样的设备。
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公开(公告)号：US20150262874A1
公开(公告)日：2015-09-17
申请号：US14440814
申请日：2013-11-05
Applicant: MICRONIT MICROFLUIDICS B.V.
Inventor： Ronny Van'T Oever , Marko Theodoor Blom , Jeroen Haneveld , Johannes Oonk , Peter Tijssen
IPC: H01L21/768 , H01L23/498 , H01L21/48
CPC classification number: H01L21/76879 , B81C1/00095 , H01L21/486 , H01L21/6835 , H01L23/147 , H01L23/49827 , H01L2221/68345 , H01L2924/0002 , H01L2924/00
Abstract: The invention relates to a method for forming an electrically conductive via in a substrate and such a substrate comprising an electrically conductive, said method comprising the steps, to be performed in suitable sequence, of: a) providing a first substrate as said substrate; b) forming a through hole in said first substrate; c) providing a second substrate; d) bringing a first surface of said second substrate into contact with said first surface of said first substrate, such that said through hole in said first substrate is covered by said first surface of said second substrate; e) filling said through hole in said first substrate with an electrically conductive material by means of electroplating for forming said electrically conductive via, and f) removing said second substrate, wherein said first surface of said first substrate and said first surface of said second substrate each have a surface roughness R a of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and in that in step (d) said first surface of said first substrate and said first surface of said second substrate are brought in direct contact with each other, such that a direct bond is formed there between.
Abstract translation: 本发明涉及一种用于在衬底中形成导电通孔的方法，并且这种衬底包括导电的所述方法，所述方法包括以适当顺序执行的以下步骤：a）提供作为所述衬底的第一衬底; b）在所述第一衬底中形成通孔; c）提供第二衬底; d）使所述第二基板的第一表面与所述第一基板的所述第一表面接触，使得所述第一基板中的所述通孔被所述第二基板的所述第一表面覆盖; e）通过用于形成所述导电通孔的电镀用导电材料填充所述第一衬底中的所述通孔，以及f）去除所述第二衬底，其中所述第一衬底的所述第一表面和所述第二衬底的所述第一表面 每个表面粗糙度R a小于2nm，优选小于1nm，更优选小于0.5nm，并且在步骤（d）中，所述第一衬底的所述第一表面和所述第二衬底的所述第一表面是 导致彼此直接接触，从而在其间形成直接粘结。
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Patent Agency Ranking
公开(公告)号：US09636673B2
公开(公告)日：2017-05-02
申请号：US13782752
申请日：2013-03-01
Applicant: Micronit Microfluidics B.V.
Inventor： Marinus Bernardus Olde Riekerink , Wilfred Buesink , Arenda Hendrika Jacoba Koelewijn-Hubers , Marko Theodoor Blom , Ronny van 't Oever
CPC classification number: B01L3/502707 , B01J2219/00286 , B01J2219/00585 , B01J2219/00637 , B01L9/527 , B01L2300/0816 , B01L2300/0883 , B01L2300/16 , B29C69/005 , B29C70/545 , B29C2793/0009 , B29C2793/0027 , B29C2793/0063 , B81B2201/058 , B81C1/00206 , Y10T137/8593 , Y10T156/1052
Abstract: The invention relates to a method for manufacturing microfluidic chips having at least one capillary for through-flow of a fluid, comprising the steps of: (a) providing a starting material; (b) forming at least one shared capillary in the starting material, said shared capillary comprising an fluidic inlet and an fluidic outlet; (c) functionalizing the chips by supplying a functionalization fluid to the shared capillary; and (d) dividing the starting material into separate chips. The invention further relates to a device for functionalizing microfluidic chips having at least one capillary for through-flow of a fluid, said device comprising a material holder for holding a starting material in a fixed position during functionalization, said material holder comprising at least one inlet connector for connecting at least one shared capillary formed in the starting material to a functionalization fluid supply.The invention further relates to a microfluidic chip and a device for holding a microfluidic chip.
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公开(公告)号：US09748136B2
公开(公告)日：2017-08-29
申请号：US14440814
申请日：2013-11-05
Applicant: MICRONIT MICROFLUIDICS B.V.
Inventor： Ronny Van 'T Oever , Marko Theodoor Blom , Jeroen Haneveld , Johannes Oonk , Peter Tijssen
IPC: H01L21/768 , H01L23/14 , H01L23/498 , H01L21/48 , H01L21/683 , B81C1/00
CPC classification number: H01L21/76879 , B81C1/00095 , H01L21/486 , H01L21/6835 , H01L23/147 , H01L23/49827 , H01L2221/68345 , H01L2924/0002 , H01L2924/00
Abstract: A method for forming an electrically conductive via in a substrate that includes the steps of: forming a through hole in a first substrate; bringing a first surface of a second substrate into contact with the first surface of the first substrate, such that the through hole in the first substrate is covered by the first surface of the second substrate; filling the through hole in the first substrate with an electrically conductive material by electroplating to form the electrically conductive via, and removing the second substrate, wherein the first surface of the first and the second substrate each have a surface roughness Ra of less than 2 nm, preferably less than 1 nm, more preferably less than 0.5 nm, and the first surface of the first and the second substrate are brought in direct contact with each other, such that a direct bond is formed there between.
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公开(公告)号：US09573804B2
公开(公告)日：2017-02-21
申请号：US14361683
申请日：2012-12-21
Applicant: Micronit Microfluidics B.V.
Inventor： Ronny Van 'T Oever , Marko Theodoor Blom , Jeroen Haneveld , Johannes Oonk , Marinus Bernardus Olde Riekerink , Peter Tijssen , Hendrik Jan Hildebrand Tigelaar , Jean-Noël Fehr , Jean-Christophe Roulet , Amitava Gupta
CPC classification number: B81C1/00269 , B81B2201/058 , B81C3/001 , B81C2201/0132 , B81C2203/0118 , B81C2203/019 , C23F1/02 , H01L21/50 , H01L23/10 , H01L2924/0002 , Y10T428/239 , H01L2924/00
Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
Abstract translation: 本发明涉及通过使用用于提供接合的中间薄膜金属层将至少两个基板（例如由玻璃，硅，陶瓷，铝或硼制成）接合的方法，所述方法包括以下步骤：a） 提供所述两个基板; b）将所述薄膜金属层沉积在所述两个基板的第一基板的表面的至少一部分上; c）使所述第二基板的表面与所述第一基板的所述表面上的所述薄膜金属层接触，从而提供所述第二基板和所述第一基板上的所述薄膜金属层之间的接合; 以及d）至少局部加强第一基板上的第二基板和薄膜金属层之间的接合。 本发明还涉及包括例如由玻璃，硅，陶瓷，铝或硼制成的两个基底和中间薄膜金属层的器件。
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公开(公告)号：US20150238961A1
公开(公告)日：2015-08-27
申请号：US14431161
申请日：2013-09-25
Applicant: MICRONIT MICROFLUIDICS B.V.
Inventor： Elwin Xander Vrouwe , Manjeet Dhindsa , Marinus Bernardus Olde Riekerink , Ronny Van 'T Oever , Marko Theodoor Blom
CPC classification number: B01L3/502738 , B01L2200/143 , B01L2300/0645 , B01L2300/069 , B01L2300/0829 , B01L2300/0874 , B01L2300/0887 , B01L2300/089 , B01L2300/12 , B01L2300/161 , B01L2400/0415 , B01L2400/0688 , F16K99/0017 , F16K99/0042 , F16K2099/0084
Abstract: The invention relates to a device (20), comprising: a liquid container (21) for containing a liquid; a capillary-stop valve (22) that is in medium through flow connection with said liquid container (21) for stopping said liquid in said container from flowing out of said container via said capillary-stop valve (22); a first electrode (7) being arranged such that in use said first electrode is in contact with said liquid in said liquid container; a second electrode (2) that is spaced apart from said capillary-stop valve by an electrically insulating medium gap (24), and a voltage source (V) connected to said first and second electrode which is activatable for applying an electric potential difference at the first and second electrode such that the liquid in the liquid container is attracted in the direction of said second electrode so as to allow the liquid to overcome the stopping effect of the capillary-stop valve for discharging liquid from said liquid container via said capillary-stop valve. The invention also relates to a method for activating a capillary-stop valve of a device.
Abstract translation: 本发明涉及一种装置（20），包括：用于容纳液体的液体容器（21）; 与所述液体容器（21）处于介质中流动连接的用于阻止所述容器中的液体经由所述毛细管截止阀（22）从所述容器流出的毛细管截止阀（22）; 第一电极（7）被布置成使得在使用中所述第一电极与所述液体容器中的所述液体接触; 通过电绝缘介质间隙（24）与所述毛细管截止阀间隔开的第二电极（2）和连接到所述第一和第二电极的电压源（V），所述电压源可激活以施加电位差 所述第一和第二电极使得所述液体容器中的液体沿所述第二电极的方向被吸引，从而允许所述液体克服所述毛细管截止阀的停止作用，所述停止效应通过所述毛细管 - 截止阀。 本发明还涉及用于激活装置的毛细管截止阀的方法。
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公开(公告)号：US20140335301A1
公开(公告)日：2014-11-13
申请号：US14361683
申请日：2012-12-21
Applicant: Micronit Microfluidics B.V.
Inventor： Ronny Van 'T Oever , Marko Theodoor Blom , Jeroen Haneveld , Johannes Oonk , Marinus Bernardus Olde Riekerink , Peter Tijssen , Hendrik Jan Hildebrand Tigelaar , Jean-Noël Fehr , Jean-Christophe Roulet , Amitava Gupta
CPC classification number: B81C1/00269 , B81B2201/058 , B81C3/001 , B81C2201/0132 , B81C2203/0118 , B81C2203/019 , C23F1/02 , H01L21/50 , H01L23/10 , H01L2924/0002 , Y10T428/239 , H01L2924/00
Abstract: The invention relates to method for bonding at least two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, by using an intermediate thin film metal layer for providing the bonding, said method comprising the following steps of: a) providing said two substrates; b) depositing said thin film metal layer on at least a part of a surface of a first substrate of the two substrates; c) bringing a surface of the second substrate into contact with said thin film metal layer on said surface of the first substrate such that a bonding between the second substrate and the thin film metal layer on the first substrate is provided; and d) at least locally strengthening the bonding between the second substrate and the thin film metal layer on the first substrate. The invention also relates to a device comprising two substrates, for example made from glass, silicon, ceramic, aluminum, or boron, and an intermediate thin film metal layer.
Abstract translation: 本发明涉及通过使用用于提供接合的中间薄膜金属层将至少两个基板（例如由玻璃，硅，陶瓷，铝或硼制成）接合的方法，所述方法包括以下步骤：a） 提供所述两个基板; b）将所述薄膜金属层沉积在所述两个基板的第一基板的表面的至少一部分上; c）使所述第二基板的表面与所述第一基板的所述表面上的所述薄膜金属层接触，从而提供所述第二基板和所述第一基板上的所述薄膜金属层之间的接合; 以及d）至少局部加强第一基板上的第二基板和薄膜金属层之间的接合。 本发明还涉及包括例如由玻璃，硅，陶瓷，铝或硼制成的两个基底和中间薄膜金属层的器件。
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