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公开(公告)号：US20120048611A1
公开(公告)日：2012-03-01
申请号：US13045695
申请日：2011-03-11
Applicant: Tzong-Lin Wu , Chung-Hsiang Huang
Inventor： Tzong-Lin Wu , Chung-Hsiang Huang
CPC classification number: H05K1/0236 , H05K2201/09309 , Y10T29/49165
Abstract: The invention relates to an embedded multi-layer circuit board and a noise suppression method. The embedded multi-layer circuit board comprises at least two ground layers, a power layer and a plurality of vias. The power layer is between two ground layers. Each via is electrically connected with the two ground layers and electrically isolated from the power layer. The power layer is divided to a plurality of periodical cells. Each cell comprises the same number of the vias.
Abstract translation: 本发明涉及嵌入式多层电路板和噪声抑制方法。 嵌入式多层电路板包括至少两个接地层，功率层和多个通孔。 功率层位于两个接地层之间。 每个通孔与两个接地层电连接并与功率层电隔离。 功率层被划分为多个周期性单元。 每个单元包括相同数量的通孔。
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公开(公告)号：US20120025925A1
公开(公告)日：2012-02-02
申请号：US12898987
申请日：2010-10-06
Applicant: Tzong-Lin Wu , Chung-Hao Tsai , Iat In Ao Ieong
Inventor： Tzong-Lin Wu , Chung-Hao Tsai , Iat In Ao Ieong
CPC classification number: H04B3/28 , H03H7/1725 , H03H7/1758 , H03H7/427 , H03H2001/0071 , H03H2001/0078 , H03H2001/0085
Abstract: A common mode noise suppression circuit applicable to differential signal transmission performs common mode noise suppression with respect to differential signals transmitted by a transmission line. An inductance-capacitance resonant structure is formed based on electromagnetic coupling combining a ground structure to suppress common mode noise of differential mode signals at broadband meanwhile keeping low loss of the differential mode signals at broadband via differential transmission lines. By this, the common mode noise suppression circuit performs broadband suppression with related to the common mode noise within frequency scope of several GHzs without affecting the differential mode signals and improves manufacturing process miniaturization to decrease cost.
Abstract translation: 适用于差分信号传输的共模噪声抑制电路相对于由传输线发送的差分信号执行共模噪声抑制。 基于结合地面结构的电磁耦合来形成电感 - 电容谐振结构，以抑制宽带差模信号的共模噪声，同时通过差分传输线保持宽带上的差模信号的低损耗。 通过这种方式，共模噪声抑制电路在几GHz的频率范围内与共模噪声相关地进行宽带抑制，而不影响差模信号，并且改善制造过程的小型化以降低成本。
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公开(公告)号：US07679926B2
公开(公告)日：2010-03-16
申请号：US11843382
申请日：2007-08-22
Applicant: Kuo-Ching Steven Hsu , Chien-Min Lin , Tzong-Lin Wu , Guan-Tzong Wu
Inventor： Kuo-Ching Steven Hsu , Chien-Min Lin , Tzong-Lin Wu , Guan-Tzong Wu
IPC: H05K1/18
CPC classification number: H05K1/162 , H05K2201/0187 , H05K2201/09309
Abstract: A circuit structure is provided. The circuit structure includes a capacitor including a top capacitor electrode; a bottom capacitor electrode parallel to the top capacitor electrode; and an insulating layer between the top and the bottom capacitor electrodes. The insulating layer includes a dielectric rod enclosed by a dielectric material. The dielectric rod has a higher dielectric constant than that of the dielectric material. The circuit structure may be a printed circuit board or packaging substrate, wherein the capacitor is formed between the two layers of the capacitor. Additional dielectric rods may be formed in the insulating layer of the capacitor and spaced apart from the dielectric rods.
Abstract translation: 提供电路结构。 电路结构包括：电容器，其包括顶部电容器电极; 平行于顶部电容器电极的底部电容器电极; 以及顶部和底部电容器电极之间的绝缘层。 绝缘层包括由介电材料包围的介电棒。 介电棒具有比介电材料更高的介电常数。 电路结构可以是印刷电路板或封装衬底，其中电容器形成在电容器的两层之间。 可以在电容器的绝缘层中形成另外的介质棒，并与电介质棒间隔开。
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公开(公告)号：US20090050356A1
公开(公告)日：2009-02-26
申请号：US11843382
申请日：2007-08-22
Applicant: Kuo-Ching "Steven" Hsu , Chien-Min Lin , Tzong-Lin Wu , Guan-Tzong Wu
Inventor： Kuo-Ching "Steven" Hsu , Chien-Min Lin , Tzong-Lin Wu , Guan-Tzong Wu
CPC classification number: H05K1/162 , H05K2201/0187 , H05K2201/09309
Abstract: A circuit structure is provided. The circuit structure includes a capacitor including a top capacitor electrode; a bottom capacitor electrode parallel to the top capacitor electrode; and an insulating layer between the top and the bottom capacitor electrodes. The insulating layer includes a dielectric rod enclosed by a dielectric material. The dielectric rod has a higher dielectric constant than that of the dielectric material. The circuit structure may be a printed circuit board or packaging substrate, wherein the capacitor is formed between the two layers of the capacitor. Additional dielectric rods may be formed in the insulating layer of the capacitor and spaced apart from the dielectric rods.
Abstract translation: 提供电路结构。 电路结构包括：电容器，其包括顶部电容器电极; 平行于顶部电容器电极的底部电容器电极; 以及顶部和底部电容器电极之间的绝缘层。 绝缘层包括由介电材料包围的介电棒。 介电棒具有比介电材料更高的介电常数。 电路结构可以是印刷电路板或封装衬底，其中电容器形成在电容器的两层之间。 可以在电容器的绝缘层中形成另外的介质棒，并与电介质棒间隔开。
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15.发明申请Power plane system of high-speed digital circuit for suppressing ground bounce noise 有权用于抑制地面反弹噪声的高速数字电路功率平面系统公开(公告)号：US20050168238A1
公开(公告)日：2005-08-04
申请号：US11043605
申请日：2005-01-26
Applicant: Tzong-Lin Wu , Yen-Hui Lin , Sin-Ting Chen , Ting-Kuang Wang
Inventor： Tzong-Lin Wu , Yen-Hui Lin , Sin-Ting Chen , Ting-Kuang Wang
IPC: H01L23/50 , H01L23/552 , H03K17/16 , H03K19/003 , H05K1/02
CPC classification number: H01L23/50 , H01L23/552 , H01L2924/0002 , H01L2924/3011 , H05K1/0216 , H05K2201/09263 , H05K2201/093 , H05K2201/09309 , H05K2201/09663 , H01L2924/00
Abstract: The invention relates to a power plane system for suppressing ground bounce noise. The power plane system of the invention comprises a substrate, a power layer and a ground layer. The power layer comprises a plurality of metal units. There is a distance between two adjacent metal units. A plurality of bridges is used for connecting the metal units. The ground layer has a grounding metal plate. According to the invention, when the ground bounce noise occurs, the metal units can broaden the stop-band bandwidth. Therefore, the signals in the stop-band hardly are transmitted so as to suppress the ground bounce noise, and the high frequency ground bounce noise and the electromagnetic radiation can be suppressed efficiently.
Abstract translation: 本发明涉及一种用于抑制地面反弹噪声的电力平面系统。 本发明的功率平面系统包括基板，功率层和接地层。 功率层包括多个金属单元。 两个相邻的金属单元之间有一段距离。 多个桥用于连接金属单元。 接地层有接地金属板。 根据本发明，当发生地面反弹噪声时，金属单元可以扩大阻带带宽。 因此，阻带中的信号几乎不发射，以抑制地面反弹噪声，并且可以有效地抑制高频地面反弹噪声和电磁辐射。
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Patent Agency Ranking
公开(公告)号：US20130002378A1
公开(公告)日：2013-01-03
申请号：US13243896
申请日：2011-09-23
Applicant: Tzong-Lin Wu , Chung-Hao Tsai
Inventor： Tzong-Lin Wu , Chung-Hao Tsai
IPC: H04B3/14
Abstract: This invention provides a digital electronic device comprising: a grounded metal portion comprising a first metal plate electrically connected to ground and a first substrate disposed on the first metal plate; at least one layer of differential-mode reference metal portion comprising a second substrate and a second metal plate electrically connected to the first metal plate by at least one conductive structure; a pair of differential signal lines at least partially disposed on the second substrate of the at least one layer of differential-mode reference metal portion and electromagnetically coupled to the second metal plate of the at least one layer of differential-mode reference metal portion; and an equalizer electrically connected to the pair of differential signal lines.
Abstract translation: 本发明提供一种数字电子设备，包括：接地金属部分，包括电连接到地的第一金属板和设置在第一金属板上的第一基板; 至少一层差模参考金属部分，包括通过至少一个导电结构与第一金属板电连接的第二基板和第二金属板; 至少部分地布置在所述至少一个所述差模参考金属部分层的所述第二基板上并与所述至少一个所述差模参考金属部分的所述第二层的所述第二金属板电磁耦合的一对差分信号线; 以及电连接到所述一对差分信号线的均衡器。
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17.发明申请公开(公告)号：US20110032048A1
公开(公告)日：2011-02-10
申请号：US12701287
申请日：2010-02-05
Applicant: Tzong-Lin Wu , Chung-Hao Tsai
Inventor： Tzong-Lin Wu , Chung-Hao Tsai
IPC: H01P1/201
CPC classification number: H01P1/203
Abstract: A filtering device is capable of suppressing common mode noises upon transmission of a differential signal, and includes a differential transmission line, a grounding layer, a dielectric unit and a conductive structure. The differential transmission line has a pair of conductive traces spaced apart from each other. The grounding layer is spaced apart from the differential transmission line. The dielectric unit is disposed between the differential transmission line and the grounding layer. The conductive structure is embedded in the dielectric unit, is coupled electrically to the conductive traces and the grounding layer, and cooperates with the differential transmission line, the grounding layer and the dielectric unit to form a stacked structure that has an effective negative permittivity, thereby suppressing the common mode noises coupled to the conductive traces. A differential signal transmission circuit is also disclosed.
Abstract translation: 滤波装置能够在发送差分信号时抑制共模噪声，并且包括差分传输线，接地层，电介质单元和导电结构。 差动传输线具有彼此间隔开的一对导电迹线。 接地层与差动传输线隔开。 电介质单元设置在差动传输线和接地层之间。 导电结构嵌入电介质单元中，与导电迹线和接地层电耦合，与差分传输线，接地层和电介质单元配合，形成具有有效负介电常数的堆叠结构 抑制耦合到导电迹线的共模噪声。 还公开了一种差分信号传输电路。
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公开(公告)号：US20100052820A1
公开(公告)日：2010-03-04
申请号：US12352500
申请日：2009-01-12
Applicant: Tzong-Lin Wu , Shu-Jung Wu
Inventor： Tzong-Lin Wu , Shu-Jung Wu
IPC: H01P1/203
CPC classification number: H01P1/20336
Abstract: Provided are common mode filtering method and device for use with a defected ground structure, the device including a substrate, coupled microstrip lines formed on the substrate and a ground plane formed underneath the substrate, the common mode filtering method being characterized by forming at least a defected ground structure on the ground plane and making dual mode signals pass through the coupled microstrip lines, thereby using the defected ground structure to suppress dual model noises within a specific frequency band and prevent signal distortion.
Abstract translation: 提供了一种共模滤波方法和用于缺陷接地结构的器件，该器件包括衬底，形成在衬底上的耦合微带线和形成在衬底下面的接地平面，共模滤波方法的特征在于形成至少一个 在地平面上有缺陷的接地结构，使双模信号通过耦合微带线，从而利用缺陷接地结构抑制特定频段内的双模噪声，防止信号失真。
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公开(公告)号：US07184637B2
公开(公告)日：2007-02-27
申请号：US11151113
申请日：2005-06-13
Applicant: Tzong-Lin Wu , Chia-Hsin Chao
Inventor： Tzong-Lin Wu , Chia-Hsin Chao
CPC classification number: G02B6/02233 , G02B6/02357 , G02B6/02361
Abstract: The invention relates to a micro-structured fiber comprising a core region and a cladding region. The cladding region has a plurality of air holes regularly arranged on a plurality of rings, wherein the innermost ring of the fiber defines the core region. The cladding region comprises an inner circumference portion and an outer circumference portion; the inner circumference portion comprises at least one ring, the outer circumference portion comprises at least one ring, wherein the diameter of the air hole on the outer circumference portion is larger than that of the air hole on the inner circumference portion. As a result, the micro-structured fiber of the present invention has the advantages of broader band of nearly zero dispersion, less confinement loss, being easier to design due to less geometrical parameters needed to be optimized, and being easier to fabricate.
Abstract translation: 本发明涉及一种包含芯区和包层区的微结构纤维。 包层区域具有规则地布置在多个环上的多个气孔，其中纤维的最内环限定纤芯区域。 包层区域包括内周部分和外周部分; 所述内周部包括至少一个环，所述外周部包括至少一个环，其中所述外周部上的所述气孔的直径大于所述内周部上的所述气孔的直径。 结果，本发明的微结构化纤维具有几乎零色散宽带，更少的限制损失，由于需要优化的较少几何参数而易于设计并且易于制造的优点。
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公开(公告)号：US08648262B2
公开(公告)日：2014-02-11
申请号：US13045695
申请日：2011-03-11
Applicant: Tzong-Lin Wu , Chung-Hsiang Huang
Inventor： Tzong-Lin Wu , Chung-Hsiang Huang
CPC classification number: H05K1/0236 , H05K2201/09309 , Y10T29/49165
Abstract: The invention relates to an embedded multi-layer circuit board and a noise suppression method. The embedded multi-layer circuit board comprises at least two ground layers, a power layer and a plurality of vias. The power layer is between two ground layers. Each via is electrically connected with the two ground layers and electrically isolated from the power layer. The power layer is divided to a plurality of periodical cells. Each cell comprises the same number of the vias.
Abstract translation: 本发明涉及嵌入式多层电路板和噪声抑制方法。 嵌入式多层电路板包括至少两个接地层，功率层和多个通孔。 功率层位于两个接地层之间。 每个通孔与两个接地层电连接并与功率层电隔离。 功率层被划分为多个周期性单元。 每个单元包括相同数量的通孔。
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