公开(公告)号：US20050017271A1

公开(公告)日：2005-01-27

申请号：US10920270

申请日：2004-08-18

Applicant: Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

Inventor： Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

IPC: H01L23/12 ,  H01L23/498 ,  H05K1/11 ,  H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/20 ,  H05K3/38 ,  H05K3/46 ,  H01L23/52

CPC classification number: H05K3/4682 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/007 ,  H05K3/045 ,  H05K3/108 ,  H05K3/20 ,  H05K3/205 ,  H05K3/388 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49345

Abstract: A substrate of multilayered structure having a. plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.

Abstract translation: 具有a的多层结构的衬底。 多个绝缘层和布线层组，并且具有用于安装半导体元件的一个面和要设置外部连接端子的另一个面，用于安装半导体元件的面设置有衬垫 接合到半导体元件的电极端子，另一个面设置有待连接到诸如由焊球形成的端子的外部连接端子的焊盘，并且绝缘层两侧的布线层被连接 彼此通过穿过绝缘层的通孔，其中要结合到半导体元件的电极端子的焊盘的表面是平坦的并且在同一平面中。 还公开了制造这种多层基板的方法。

公开(公告)号：US06756430B2

公开(公告)日：2004-06-29

申请号：US09878424

申请日：2001-06-12

Applicant: Yuichi Matsuda ,  Mikio Hashimoto ,  Ikunori Sakai

Inventor： Yuichi Matsuda ,  Mikio Hashimoto ,  Ikunori Sakai

IPC: C08K53492

CPC classification number: C08K5/053 ,  C08K5/0091 ,  C08K5/3492 ,  C08K5/34928 ,  C08K5/51

Abstract: A flame-retarding thermoplastic resin composition which is composed essentially of (A) a component of thermoplastic resin, (B) a component of nitrogen atom-containing phosphatic compound, (C) a component of hydroxyl group-containing compound or partly esterified product thereof and (D) a component of neutralizer for acids, with optional component (E) of triazine derivative or (F) of metal alkoxide, wherein the proportion of each component is such that the component (A) is in the range from 60 to 90 parts by weight, the sum of the components (B)+(C) is in the range from 10 to 40 parts by weight and the component (D) is in the range from 0.1 to 5 parts by weight, per 100 parts by weight of the total sum of (A)+(B)+(C), respectively, wherein the weight ratio of (B)/(C) amounts to at least 1.

Abstract translation: 一种阻燃性热塑性树脂组合物，其主要由（A）热塑性树脂组分，（B）含氮原子的磷酸酯化合物的组分，（C）含羟基化合物的组分或其部分酯化产物 和（D）酸中和剂的组分，和三嗪衍生物的任选组分（E）或金属醇盐的（F），其中每种组分的比例使得组分（A）的比例在60至90 （B）+（C）的总和为10〜40重量份，成分（D）为0.1〜5重量份，相对于100重量份 分别为（A）+（B）+（C）的总和，其中（B）/（C）的重量比达到至少1。

公开(公告)号：US06441314B2

公开(公告)日：2002-08-27

申请号：US09815047

申请日：2001-03-23

Applicant: Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

Inventor： Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

IPC: H05K116

CPC classification number: H05K3/4682 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/007 ,  H05K3/045 ,  H05K3/108 ,  H05K3/20 ,  H05K3/205 ,  H05K3/388 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49345

Abstract: A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.

公开(公告)号：US09698037B2

公开(公告)日：2017-07-04

申请号：US13156925

申请日：2011-06-09

Applicant: Seiyo Nakashima ,  Yuichi Matsuda ,  Takashi Nogami ,  Shinobu Sugiura ,  Tomoyuki Yamada

Inventor： Seiyo Nakashima ,  Yuichi Matsuda ,  Takashi Nogami ,  Shinobu Sugiura ,  Tomoyuki Yamada

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67757 ,  H01L21/67017

Abstract: A substrate processing apparatus includes a holder configured to hold a substrate and carry the substrate into a process chamber, a waiting station located outside the process chamber in which the holder waits prior to carrying the substrate into the process chamber, a circulation path configured to circulate a gas throughout the waiting station, and an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station.

公开(公告)号：US08832496B2

公开(公告)日：2014-09-09

申请号：US13005157

申请日：2011-01-12

Applicant: Yuichi Matsuda ,  Yuji Nomura

Inventor： Yuichi Matsuda ,  Yuji Nomura

IPC: G06F11/00 ,  H04L12/24 ,  G06F11/07

CPC classification number: H04L41/069 ,  G06F11/079 ,  H04L41/0622

Abstract: A computer-readable non-transitory recording medium storing therein an information managing program causing a computer to execute extracting from among events that have occurred at objects under management and having dependence relations, combinations of a first event that has occurred at a source-of-dependence object and a second event that has occurred at a dependent object dependent on the source-of-dependence object; judging for each extracted combination, whether a dependence relation exists between the first event and the second event, by using the difference between the time of occurrence of the first event and that of the second event; determining from among the events and based on a judgment result obtained at the judging, an event that has occurred at an object that is a source-of-dependence object but not a dependent object, to be an event to be stored; and storing to a database, information related to the event to be stored.

Abstract translation: 一种存储信息管理程序的计算机可读的非暂时性记录介质，其使得计算机执行从在管理对象发生的事件中提取并具有依赖关系的信息管理程序， 依赖对象和依赖于依赖关系对象的依赖对象发生的第二个事件; 对于每个提取的组合，通过使用第一事件的发生时间和第二事件的发生时间之间的差异，判断第一事件和第二事件之间是否存在依赖关系; 从所述事件中确定并且基于在所述判断处获得的判断结果，将在作为依赖源的对象而不是依赖对象的对象发生的事件作为要存储的事件; 并向数据库存储与要存储的事件相关的信息。

公开(公告)号：US20120313245A1

公开(公告)日：2012-12-13

申请号：US13493123

申请日：2012-06-11

Applicant: Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA

Inventor： Michio HORIUCHI ,  Yasue TOKUTAKE ,  Yuichi MATSUDA

IPC: H01L23/52

CPC classification number: H01L23/5389 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/96 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00

Abstract: One embodiment provides a semiconductor device having: a core substrate having first and second surfaces and an accommodation hole penetrating therethrough; a semiconductor element accommodated in the accommodation hole so that a front surface thereof is on the first surface side; a first metal film formed on a back surface of the semiconductor element; a second metal film formed on the second surface of the core substrate; an insulating layer covering the first and second metal films; and a third metal film formed on the insulating layer, via parts thereof penetrating through the insulating layer to respectively reach the first and second metal films.

Abstract translation: 一个实施例提供一种半导体器件，其具有：具有第一和第二表面的芯基板和贯穿其中的容纳孔; 容纳在所述容纳孔中使得其前表面位于所述第一表面侧的半导体元件; 形成在所述半导体元件的背面上的第一金属膜; 形成在芯基板的第二表面上的第二金属膜; 覆盖第一和第二金属膜的绝缘层; 以及形成在所述绝缘层上的第三金属膜，经由其穿过所述绝缘层的部分分别到达所述第一和第二金属膜。

公开(公告)号：US08242612B2

公开(公告)日：2012-08-14

申请号：US12813692

申请日：2010-06-11

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC: H01L23/48 ,  H05K1/00

CPC classification number: H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0227 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09345 ,  H05K2201/09609

Abstract: A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.

Abstract translation: 布线基板包括：具有绝缘基体的芯基板; 构造成从所述绝缘基材的第一表面刺穿到所述绝缘基材的第二表面的线状导体; 包括形成在芯基板的第一表面上的第一接地布线的接地布线组和形成在芯基板的第二表面上的带状第二接地布线，并且通过一部分电连接到第一接地布线 线性导体; 以及电源布线组，其包括形成在第一表面上的第一电力供给布线和形成在第二表面上的第二电力供应布线，并且通过多个部分中的一部分电连接到第一电力布线 线性导体。

公开(公告)号：US20110305543A1

公开(公告)日：2011-12-15

申请号：US13156925

申请日：2011-06-09

Applicant: Seiyo NAKASHIMA ,  Yuichi MATSUDA ,  Takashi NOGAMI ,  Shinobu SUGIURA ,  Tomoyuki YAMADA

Inventor： Seiyo NAKASHIMA ,  Yuichi MATSUDA ,  Takashi NOGAMI ,  Shinobu SUGIURA ,  Tomoyuki YAMADA

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67757 ,  H01L21/67017

Abstract: A substrate processing apparatus includes a holder configured to hold a substrate and carry the substrate into a process chamber, a waiting station located outside the process chamber in which the holder waits prior to carrying the substrate into the process chamber, a circulation path configured to circulate a gas throughout the waiting station, and an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station.

Abstract translation: 基板处理装置包括保持器，其构造成保持基板并将基板运送到处理室中，等待站位于处理室外部，其中保持器在将基板运送到处理室之前等待，循环路径被配置为循环 整个等候站内的气体，以及形成在循环路径中的排气路径，其构造成从等待站排出气体。

公开(公告)号：US20110095419A1

公开(公告)日：2011-04-28

申请号：US12909096

申请日：2010-10-21

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

IPC: H01L23/498 ,  H01L21/768 ,  H05K1/11 ,  B05D5/12

CPC classification number: H05K3/3436 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01078 ,  H01L2924/12044 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y02P70/613

Abstract: There is provided a conductive film. The conductive film includes: an anodized layer having a plurality of through holes extending therethrough in its thickness direction; a plurality of linear conductors each formed in a corresponding one of the through holes and each having first and second protrusions protruding from the anodized layer, wherein at least one of the first and second protrusions is covered by a coating material; and an uncured thermosetting resin layer formed on the anodized layer to cover at least one of the first and second protrusions.

Abstract translation: 提供导电膜。 导电膜包括：阳极化层，其具有在其厚度方向上延伸穿过其中的多个通孔; 多个线状导体，各自形成在所述通孔中的对应的一个中，并且每个具有从所述阳极氧化层突出的第一和第二突起，其中所述第一突起和所述第二突起中的至少一个被涂覆材料覆盖; 以及形成在所述阳极氧化层上以覆盖所述第一和第二突起中的至少一个的未固化的热固性树脂层。

公开(公告)号：US20070160861A1

公开(公告)日：2007-07-12

申请号：US10589431

申请日：2005-02-09

Applicant: Hosei Shinoda ,  Takeshi Kashima ,  Masahiro Enna ,  Shinichi Kojoh ,  Hideyuki Kaneko ,  Shingo Matsuo ,  Nobuo Kawahara ,  Tomoaki Matsugi ,  Yuichi Matsuda ,  Takayuki Onogi ,  Fumio Kageyama

Inventor： Hosei Shinoda ,  Takeshi Kashima ,  Masahiro Enna ,  Shinichi Kojoh ,  Hideyuki Kaneko ,  Shingo Matsuo ,  Nobuo Kawahara ,  Tomoaki Matsugi ,  Yuichi Matsuda ,  Takayuki Onogi ,  Fumio Kageyama

IPC: B32B27/30

CPC classification number: C08L51/06 ,  C08L23/00 ,  C08L23/02 ,  C08L67/02 ,  C08L69/00 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31938 ,  C08L2666/24 ,  C08L2666/18 ,  C08L2666/14 ,  C08L2666/02

Abstract: A modified polyolefin resin comprising a copolymer having a structure that a propylene-based polyolefin segment (a) and a segment (b) containing a lactic acid as a constituent are bonded in a block state and/or a graft state through a vinyl monomer having a hydroxyl group, wherein a number average molecular weight of the propylene-based polyolefin segment (a) is from 1,000 to 100,000, a number average molecular weight of the segment (b) containing lactic acid as a constituent is from 1,000 to 200,000, and a weight composition of the propylene-based polyolefin segment (a) and the segment (b) containing lactic acid as a constituent is from 10/90 to 90/10. The modified polyolefin resin can be used in a resin composition containing an aliphatic polyester resin (A), a polyolefin resin (B) and the modified polyolefin resin (C). The composition can exhibit excellent heat resistance and impact resistance and can be used for molding various parts.

Abstract translation: 包含具有丙烯类聚烯烃链段（a）和含有乳酸作为组分的链段（b）的结构的共聚物的改性聚烯烃树脂以嵌段状态和/或接枝状态通过具有 羟基，其中丙烯类聚烯烃链段（a）的数均分子量为1,000〜100,000，以乳酸为成分的链段（b）的数均分子量为1,000〜200,000，以及 丙烯类聚烯烃链段（a）和含有乳酸作为成分的链段（b）的重量组成为10/90〜90/10。 改性聚烯烃树脂可用于含有脂族聚酯树脂（A），聚烯烃树脂（B）和改性聚烯烃树脂（C）的树脂组合物中。 该组合物可以表现出优异的耐热性和抗冲击性，并且可用于各种部件的成型。