公开(公告)号：US20220183153A1

公开(公告)日：2022-06-09

申请号：US17602659

申请日：2020-05-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Raymond P. Johnston ,  John J. Sullivan ,  Matthew C. Messina ,  Charles D. Hoyle ,  Jaewon Kim ,  Haiyan Zhang ,  Matthew S. Stay ,  Robert A. Sainati ,  Kevin W. Gotrik ,  Kenneth A.P. Meyer ,  Gregory L. Abraham ,  Joseph C. Carls ,  Douglas S. Dunn

IPC: H05K1/02 ,  H05K1/03 ,  H01Q1/38 ,  H05K3/46 ,  H05K3/20

Abstract: A patterned article includes a unitary polymeric layer and a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer. Each electrically conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the unitary polymeric layer, and includes a metallic body disposed on the top major surface of the conductive seed layer. The metallic body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the unitary polymeric layer and extends from the bottom major surface of the metallic body toward or to, but not past, a top major surface of the unitary polymeric layer. The conductive elements may be electrically isolated from one another. Processes for making the patterned article are described.

公开(公告)号：US20220167499A1

公开(公告)日：2022-05-26

申请号：US17602886

申请日：2020-05-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Raymond P. Johnston ,  Kevin W. Gotrik ,  John J. Sullivan ,  Kenneth A.P. Meyer ,  Joseph C. Carls ,  Haiyan Zhang ,  Gregory L. Abraham ,  Matthew S. Stay

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/10 ,  H05K3/24

Abstract: A patterned conductive article 200 includes a substrate 210 including a unitary layer 210-1 and includes a micropattern of conductive traces 220 embedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234 in direct contact with the unitary layer; and a unitary conductive body 240 disposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewalls 242, 244 and at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.

公开(公告)号：US20210187819A1

公开(公告)日：2021-06-24

申请号：US17182507

申请日：2021-02-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jodi L. Connell ,  Raymond P. Johnston ,  John J. Sullivan ,  Karl J.L. Geisler ,  Vivian W. Jones ,  Gordon A. Kuhnley ,  Patrick G. Zimmerman ,  Bradley W. Eaton ,  Kurt J. Halverson ,  Brian W. Lueck ,  Alexander C. Eldredge ,  Hyacinth L. Lechuga

IPC: B29C59/02 ,  B08B17/06 ,  B29C51/02

Abstract: Films and articles are described comprising a microstructured surface having an array of peak structures and adjacent valleys. For improved cleanability, the valleys preferably have a maximum width ranging from 10 microns to 250 microns and the peak structures have a side wall angle greater than 10 degrees. The peak structures may comprise two or more facets such as in the case of a linear array of prisms or an array of cube-corners elements. The facets form continuous or semi-continuous surfaces in the same direction. The valleys typically lack intersecting walls. Also described are methods of making and methods of use. The microstructured surface of the article can be prepared by various microreplication techniques such as coating, injection molding, embossing, laser etching, extrusion, casting and curing a polymerizable resin; and bonding microstructured film to a surface or article with an adhesive.

公开(公告)号：US20250015507A1

公开(公告)日：2025-01-09

申请号：US18705049

申请日：2022-10-26

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ivan Lemesh ,  Michael S. Graff ,  Sergei A. Manuilov ,  John J. Sullivan

IPC: H01Q15/14 ,  H01Q1/32 ,  H01Q3/46

Abstract: Systems and methods using passive reflectors or reflectarrays are provided to enhance non-line-of-sight (NLOS) wireless signals. Multiple reflectarrays are combined and positioned to cover a wide range of user positions/beam angles. The passive reflectarrays include at least one of a first reflectarray configured to split an incident beam and a second reflectarray configured to steer the incident beam with an off-plane of incidence.

公开(公告)号：US12133327B2

公开(公告)日：2024-10-29

申请号：US17602659

申请日：2020-05-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Raymond P. Johnston ,  John J. Sullivan ,  Matthew C. Messina ,  Charles D. Hoyle ,  Jaewon Kim ,  Haiyan Zhang ,  Matthew S. Stay ,  Robert A. Sainati ,  Kevin W. Gotrik ,  Kenneth A. P. Meyer ,  Gregory L. Abraham ,  Joseph C. Carls ,  Douglas S. Dunn

IPC: H05K1/02 ,  H01Q1/38 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K1/0296 ,  H01Q1/38 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/103 ,  H05K3/207 ,  H05K3/244 ,  H05K3/4644 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0723

Abstract: A patterned article includes a unitary polymeric layer and a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer. Each electrically conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the unitary polymeric layer, and includes a metallic body disposed on the top major surface of the conductive seed layer. The metallic body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the unitary polymeric layer and extends from the bottom major surface of the metallic body toward or to, but not past, a top major surface of the unitary polymeric layer. The conductive elements may be electrically isolated from one another. Processes for making the patterned article are described.

公开(公告)号：US12048092B2

公开(公告)日：2024-07-23

申请号：US17602886

申请日：2020-05-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Raymond P. Johnston ,  Kevin W. Gotrik ,  John J. Sullivan ,  Kenneth A. P. Meyer ,  Joseph C. Carls ,  Haiyan Zhang ,  Gregory L. Abraham ,  Matthew S. Stay

IPC: H05K1/02 ,  H01Q1/38 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K1/0296 ,  H01Q1/38 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/103 ,  H05K3/207 ,  H05K3/244 ,  H05K3/4644 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0723

Abstract: A patterned conductive article 200 includes a substrate 210 including a unitary layer 210-1 and includes a micropattern of conductive traces 220 embedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234 in direct contact with the unitary layer; and a unitary conductive body 240 disposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewalls 242, 244 and at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.

公开(公告)号：US20240235055A1

公开(公告)日：2024-07-11

申请号：US18059151

申请日：2021-06-10

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Raymond P. Johnston ,  John J. Sullivan ,  Matthew C. Messina ,  Charles D. Hoyle ,  Jaewon Kim ,  Haiyan Zhang ,  Kevin W. Gotrik ,  Douglas S. Dunn

IPC: H01Q21/00 ,  H01Q21/06

CPC classification number: H01Q21/0093 ,  H01Q21/061

Abstract: A patterned article includes a polymeric layer having opposing first and second major surfaces and defining a plurality of through openings therein. For each through opening in at least a sub-plurality of the through openings, a metallic body is disposed in the through opening. The metallic body has a first outermost surface, an opposite second outermost surface and at least one lateral sidewall extending therebetween. The first outermost surface of the metallic body is substantially flush with the first major surface of the polymeric layer. Each lateral sidewall extends from the first outermost surface of the metallic body toward or to, but not past, the second major surface of the polymeric layer. The metallic body is substantially coextensive with the through opening in at least one cross-section parallel to the polymeric layer. The metallic bodies can be electrically isolated from one another.

公开(公告)号：US20240001415A1

公开(公告)日：2024-01-04

申请号：US18253989

申请日：2022-01-25

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jodi L. Connell ,  Raymond P. Johnston ,  John J. Sullivan ,  Karl J.L. Geisler ,  Vivian W. Jones ,  Gordon A. Kuhnley ,  Patrick G. Zimmerman ,  Bradley W. Eaton ,  Kurt J. Halverson ,  Brian W. Lueck ,  Alexandr C. Eldredge ,  Hyacinth L. Lechuga ,  Lynn E. Lorimor ,  Diane R. Wolk ,  Junia M. Pereira ,  Caroline M. Yitalo ,  Linda W. Suszko ,  Daniel J. Rogers ,  Bryon A. Mrrill

IPC: B08B17/06 ,  B08B17/04

CPC classification number: B08B17/065 ,  B29C2059/023 ,  B08B17/04

Abstract: Films and articles are described comprising a microstructured surface having an array of peak structures and adjacent valleys. For improved cleanability, the valleys preferably have a maximum width ranging from 10 microns to 250 microns and the peak structures have a side wall angle greater than 10 degrees. The peak structures may comprise two or more facets such as in the case of a linear array of prisms or an array of cube-corners elements. The facets form continuous or semi-continuous surfaces in the same direction. The valleys typically lack intersecting walls. Also described are methods of making and methods of use. The microstructured surface of the article can be prepared by various microreplication techniques such as coating, injection molding, embossing, laser etching, extrusion, casting and curing a polymerizable resin; and bonding microstructured film to a surface or article with an adhesive.

公开(公告)号：US20230382151A1

公开(公告)日：2023-11-30

申请号：US18033429

申请日：2021-11-30

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Raymond P. Johnston ,  Kevin W. Gotrik ,  Graham M. Clarke ,  John J. Sullivan ,  Matthew C. Messina ,  Scott J. Jones

IPC: B44C1/10 ,  B44F1/02 ,  B44C1/14

CPC classification number: B44C1/105 ,  B44F1/02 ,  B44C1/14

Abstract: A transfer article includes a carrier layer releasable at a release value of from 2 to 50 grams/inch from a release layer including a metal layer or a doped semiconductor layer. A functional layer overlies the carrier layer, and the functional layer includes at least one microcut inorganic layer. The microcut inorganic layer includes a pattern of cut toolmarks and plates bounded by the toolmarks, wherein each of the plates has a thickness of about 3 nanometers to about 2000 nanometers. The transfer article has a thickness of less than 3 micrometers.

公开(公告)号：US20250016916A1

公开(公告)日：2025-01-09

申请号：US18892610

申请日：2024-09-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Raymond P. Johnston ,  John J. Sullivan ,  Matthew C. Messina ,  Charles D. Hoyle ,  Jaewon Kim ,  Haiyan Zhang ,  Matthew S. Stay ,  Robert A. Sainati ,  Kevin W. Gotrik ,  Kenneth A.P. Meyer ,  Gregory L. Abraham ,  Joseph C. Carls ,  Douglas S. Dunn

IPC: H05K1/02 ,  H01Q1/38 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/20 ,  H05K3/24 ,  H05K3/46

Abstract: A patterned article includes a unitary polymeric layer and a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer. Each electrically conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the unitary polymeric layer, and includes a metallic body disposed on the top major surface of the conductive seed layer. The metallic body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the unitary polymeric layer and extends from the bottom major surface of the metallic body toward or to, but not past, a top major surface of the unitary polymeric layer. The conductive elements may be electrically isolated from one another. Processes for making the patterned article are described.