Abstract:
In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.
Abstract:
An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.
Abstract:
An electronic device may be provided with a flexible printed circuit. The flexible printed circuit may have layers of metal and dielectric. Strain gauge resistors may be formed from a strain gauge metal such as constantan. The strain gauge metal may be formed within the flexible printed circuit layers. A strain gauge may include strain gauge circuitry coupled to a strain gauge bridge circuit. Strain gauge resistors for the bridge circuit may be formed from traces that follow parallel meandering paths in the flexible printed circuit layers. A component such as a fingerprint sensor may overlap the strain gauge resistors. Strain gauge resistors may be formed in different overlapping metal layers in the flexible printed circuit layers or may be formed from the same metal layer. Electroplating techniques may be used to form metal traces to which solder balls or wire bonds are coupled.
Abstract:
An electronic device may be provided with proximity sensor capabilities for monitoring for the presence of nearby external objects. The electronic device may make temperature measurements such as measurements involving the monitoring of nearby objects for emitted blackbody light indicative of whether or not the external object is a heat-emitting object such as a human body part. The same sensor that is used in gathering temperature readings may be used in gathering proximity sensor data or separate temperature sensor and proximity sensor detector structures may be used. Motion sensor capabilities may be provided using sensor structures having an array of heat sensing elements. Signals from the array of heat sensing elements may be used in making temperature measurements and in gathering proximity sensor readings. Sensor structures may operate at wavelengths longer than 3 microns such as wavelengths from 3-5 microns or 10-15 microns.
Abstract:
A portable electronic device may include a housing member defining a side surface of the portable electronic device, a portion of the housing member defining a side wall of a hole extending through the housing member, a button member positioned along the side surface and defining a chassis portion and a hollow post extending into the hole defined through the housing member, and a first waterproof seal defined between the hollow post and the side wall of the hole. The portable electronic device may also include a biometric sensing component coupled to the chassis portion, a flexible circuit element extending through the hollow post and conductively coupling the biometric sensing component to a component within the housing, and a second waterproof seal defined within the hollow post.
Abstract:
An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.
Abstract:
An electronic device having a pressure sensor configured to determine pressure is disclosed. The electronic device includes an enclosure defining an internal volume. The enclosure may include a sidewall with an external opening that provides a vent for the internal components. To reduce the response of the pressure sensor (that is, the time required to detect a pressure change), the pressure sensor may secure with an internal wall of the enclosure. Further, the internal wall includes an opening defining an air pocket significantly smaller than the internal volume. When the pressure sensor is mounted to receive air via the air pocket, the pressure sensor may respond faster to pressure changes, as compared to receiving air circulating throughout the internal volume. This is due in part to an amount of airflow passing through the air pocket causing a greater pressure change throughout the air pocket as compared to the internal volume.
Abstract:
A hardware security token in contact with a user's body can send a signal via interbody communication to one or more electronic devices associated with a system of electronic devices having unified access controls such that a user can access each of the electronic devices using the same credentials. The signal sent by the hardware security token can be deputized by a user in possession of credentials to the system as a temporary proxy for that user's identity. In other examples, the signal sent by the portable security token can be deputized by a user in possession of credentials to the system as a temporary proxy for another user's identity. In some embodiments, the proxy can expire after a period of time or after a particular event occurs.
Abstract:
An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.
Abstract:
In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.